industry news
Subscribe Now

Samtec Features Latest 32 GT/s Interconnect Solutions at PCI-SIG® Developers Conference Asia-Pacific Tour 2019

New Albany, IN: Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference Asia-Pacific Tour 2019.

Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted.

Demonstrations:

  • Scalable 32 GT/s Silicon Test Platform:
    Demonstration of a configurable, next-generation GPU-based system combining cable mesh backplane (AcceleRate® Slim Body Cable Assemblies) and tradition two-connector backplane (next-generation Edge Rate® High-Speed Edge Card Connector) topologies.
  • Direct Connect Technology:
    The demonstration platform showcases low latency, high performance, on-board optical engines transmitting at 56 Gbps PAM4 per channel. The Samtec FireFly™ Micro Flyover System™ copper and optical options offer a direct connection into the ASIC/FPGA package, bypassing the PCB for improved density and performance. The latest FireFly™ solutions are compatible with new generation FPGAs that support 56G PAM4 transceivers.

Technical Sessions (Taipei Location Only):

2:30 PM Tuesday, October 29, 2019 – Kevin Burt, Sr. Product Manager

  • Enable PCI Express® (PCIe®) 5.0 Specification System Design with Ethernet Architectures:
    As PCI Express specification data rates increase to 32 GT/s, system SI becomes critical. As other interfaces (Ethernet, InfiniBand, etc.) achieve higher data rates, opportunities exist to leverage industry-wide techniques that optimize power, thermal efficiency and cost-effectiveness across the system. Samtec will explore options enabling PCIe system architects to achieve similar results.

The demonstrations can be seen in the Samtec booth at PCI-SIG Developers Conference Asia-Pacific Tour 2019. The first location is the Westin Tokyo on October 23, 2019. The second location is the Taipei Marriott Hotel on October 28-29, 2019.

For more information on the Samtec High-Performance Interconnect Portfolio, please visit www.samtec.com/s2s or e-mail SIG@samtec.com.

About Samtec, Inc.:
Founded in 1976, Samtec is a privately held, $822 MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. With 40+ locations serving approximately 125 countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.

Leave a Reply

featured blogs
May 22, 2020
As small as a postage stamp, the Seeeduino XIAO boasts a 32-bit Arm Cortex-M0+ processor running at 48 MHz with 256 KB of flash memory and 32 KB of SRAM....
May 22, 2020
Movies have the BAFTAs and Academy Awards. Music has the GRAMMYs. Broadway has the Tonys. Global footballers have the Ballon d’Or. SI/PI engineers have the DesignCon 2020 Best Paper Award? Really? What’s that? Many people are familiar with annual awards mentioned....
May 22, 2020
[From the last episode: We looked at the complexities of cache in a multicore processor.] OK, time for a breather and for some review. We'€™ve taken quite the tour of computing, both in an IoT device (or even a laptop) and in the cloud. Here are some basic things we looked ...
May 21, 2020
In this time of financial uncertainty, a yield-shield portfolio can protect your investments from market volatility.  Uncertainty can be defined as a quantitative measurement of variability in the data [1]. The more the variability in the data – whet...

Featured Video

Featured Paper

Energy-Saving Piezo Haptic Driver is the Touch Sensor's Best Friend

Sponsored by Maxim Integrated

Haptic sensing technology, with its ability to render complex tactile experiences, is becoming popular in portable applications. Excessive power dissipation is a concern with current piezo haptic drivers' implementations. Although the piezoelectric actuator represents a capacitive load, considerable power is dissipated to drive it. This design solution reviews the shortcomings of current piezo haptic driver implementations and introduces a novel, regenerative, boost converter-based implementation that minimizes power dissipation, helping maximize the battery life of portables.

Click here to download the whitepaper