industry news
Subscribe Now

RIKEN and Intel to Undertake Joint Research in Next-Generation Computing

RIKEN and Intel Corporation signed a Memorandum of Understanding (MoU) today, aimed at accelerating joint research and development in the field of advanced computing technologies such as Artificial Intelligence (AI), high-performance computing and quantum computing. As part of the MoU, RIKEN will also engage with Intel Foundry Services to create prototypes of these new solutions.

Collaboration Areas:

  • Computing technologies in the fields of supercomputers and AI;
  • Silicon-based quantum computing technology and quantum simulation technology; and
  • Prototyping in collaboration with Intel Foundry Services (IFS)

The objective of the collaboration is to promote cooperation between RIKEN and Intel by leveraging their research capabilities and engineering talents to explore the potential for exponential performance improvements aimed at achieving zetta-scale processing levels, with the ultimate goal of introducing these for broad adoption globally.

As the scale of big data increases massively, the computational infrastructure for machine learning and deep learning needs to become even more sophisticated, and dramatic performance improvements in supercomputers and quantum computers are required.

To address this need, RIKEN, Japan’s only comprehensive research institute focusing on the natural sciences, has launched a project it calls “Transformative Research Innovation Platform of RIKEN platforms”, a company-wide, cross-functional project, as a precursor to its Fifth Medium- to Long-Term Plan (FY2025-FY2031). The project will link RIKEN’s cutting-edge research platforms (supercomputers, large synchrotron radiation facilities, bio-resource projects, etc.), and will also provide a platform for pioneering research and innovation.

It is a challenging project that aims to promote and accelerate digital transformation and provide a driver for social change. To achieve these aims, it is necessary to accelerate research in next-generation computing areas such as high-performance computing and improve the performance of quantum computers.

Intel has a long history of foundational process innovations that have enabled the company to maintain the pace of Moore’s Law. Through continuous innovations in areas including high-performance computing and quantum computing, Intel is keeping Moore’s Law alive and well. With the rapid growth of AI, Intel is now focused on democratizing AI by delivering significant hardware performance and developer productivity at scale.

Intel is also actively working on Quantum Computing, which presents a new computing paradigm and revolutionizes all industrial fields. As the complexity of workloads and applications continues to grow, quantum computing will augment supercomputers and high-performance computing (HPC).

Leave a Reply

featured blogs
Jun 8, 2023
Learn how our EDA tools accelerate 5G SoC design for customer Viettel, who designs chips for 5G base stations and drives 5G rollout across Vietnam. The post Customer Spotlight: Viettel Accelerates Design of Its First 5G SoC with Synopsys ASIP Designer appeared first on New H...
Jun 8, 2023
Radial compressors, also known as radial fans or blowers, are primarily used for compression purposes. Radial blades attached to a rotating impeller draw air into the unit's center. They are well-suited for high-pressure applications, where their efficient design can sav...
Jun 2, 2023
I just heard something that really gave me pause for thought -- the fact that everyone experiences two forms of death (given a choice, I'd rather not experience even one)....

featured video

The Role of Artificial Intelligence and Machine Learning in Electronic Design

Sponsored by Cadence Design Systems

In this video, we talk to Paul Cunningham, Senior VP and GM at Cadence, about the transformative role of artificial intelligence and machine learning (AI/ML) in electronic designs. We discuss the transformative period we are experiencing with AI and ML and how Cadence is revolutionizing how we design and verify chips through “computationalizing intuition” and building intuitive systems that learn and adapt to the world around them. With human lives at stake, reliability, and safety are paramount.

Learn More

featured paper

EC Solver Tech Brief

Sponsored by Cadence Design Systems

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.

Click to read more

featured chalk talk

Challenges of Multi-Connectivity Asset Tracking
Multi-connectivity asset tracking is a critical element of our modern supply chain. In this episode of Chalk Talk, Colin Ramrattan and Manuel Cantone from STMicroelectronics and Amelia Dalton discuss the common needs required for asset tracking today, why low power processing is vital for these kind of applications, and how STMicroelectronics ASTRA platform can help you get started on your next asset tracking design.
Feb 20, 2023
14,115 views