Waterloo, Ontario — Sept 17, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new RiCool chassis configurations for 9-slot and 16-slot OpenVPX backplanes in the 6U height.
The RiCool OpenVPX chassis platform line from Pixus provides powerful and reliable cooling for high-CFM requirements. The front-to-rear cooled 9U tall enclosure pulls air from an intake area below the card cage and blows the heat ninety degrees out the rear. The dual fans are hot swappable and provide up to 191 CFM each of cooling. In a full 16-slot OpenVPX system (at 1.0” pitch), this translates to 125W/slot. When the height of the chassis is increased by 1U, it can cool up to 250W/slot or 4000 watts.
The 9-slot backplane features a BKP6-CEN09-11.2.13 profile per VITA 65. It is designed for PCIe Gen3 (8 Gbaud/s) speeds, but higher speed options are available upon request. The 16-slot 6U backplanes are available in multiple routing configurations. Pixus offers standard modular power supplies for VPX voltages. Pluggable VITA 62 or other AC or DC power supply options are also available.
Pixus offers OpenVPX backplanes, chassis platforms, and specialty products. The company also provides enclosure solutions in MicroTCA, cPCI Serial, AdvancedTCA, as well as instrumentation case formats.
About Pixus Technologies
Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on ATCA, OpenVPX, MicroTCA, and custom designs. Pixus also has an extensive offering of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.
