industry news
Subscribe Now

Renesas Extends Bluetooth 5.0 Connectivity to RA Family of 32-Bit MCUs with Arm Cortex-M Core

Enhanced Security and Privacy for Bluetooth 5.0 Low Energy Connections Supported with Flexible Software Package and Comprehensive Arm Ecosystem
Düsseldorf, May 7, 2020  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the first RA microcontroller (MCU) with an integrated Bluetooth® 5.0 Low Energy radio. The single-chip RA4W1 MCU includes a 48 MHz, 32-bit Arm® Cortex®-M4 core and Bluetooth 5.0 core delivered in a 56-pin QFN package. Together, the RA4W1 MCU and easy-to-use Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks that work out-of-the-box with RA MCUs.
 
The RA4W1 MCU makes it easy for embedded designers to develop safe and secure IoT endpoint devices for Industry 4.0, building automation, metering, healthcare, consumer wearable, and home appliance applications. The MCU is also ideal for developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways, and an aggregator to IoT cloud applications.
“While offering an MCU with Bluetooth 5.0 connectivity is not new to Renesas, the addition of the RA4W1 enables our customers to easily adopt Bluetooth 5.0,” said Sakae Ito, Vice President of IoT Platform Business Division at Renesas. “Customers can also take full advantage of the on-chip MCU features, including Secure Crypto Engine to implement strong key management for the ultimate IoT security, and best-in-class output power consumption and sensitivity to achieve a superior link budget for longer range applications.”
Key Features of RA4W1 MCU
 
  • Arm Cortex M4 core and Bluetooth 5.0 core housed in 7mm x 7mm 56-pin QFNThe single-chip RA4W1 48 MHz MCU features 512 KB flash memory, 96 KB SRAM, and connectivity such as USB, CAN, and Renesas’ popular HMI capacitive touch technology. It also includes Renesas’ Secure Crypto Engine supporting customers with symmetric encryption and decryption, hash functions, true random number generation (TRNG), and advanced key handling with key generation and MCU-unique key wrapping.
 
  • Full Bluetooth 5.0 support with industry best power consumption and sensitivity for superior reception: The RA4W1 MCU includes full Bluetooth 5.0 functions such as 2 Mbps data throughput, all advertising extension functions with maximum advertising length (1650 Byte), periodic advertisements, and channel selection algorithm #2 for applications requiring large amounts of traffic. The RA4W1 also offers superior low peak power consumption at 3.3mA during receiving and 4.5mA (@0dBm) while transmitting. An industry best sensitivity of -105dBm in 125kbps mode is achieved without additional loss from external components.
 
  • Basic protocol stack package and all standard profiles:
In addition to the Bluetooth 5.0 basic protocol stack package, Renesas provides several API functions that conform to all standard profiles, including a Heart Rate Profile (HRP), an Environment Sensing Profile (ESP), and an Automation I/O profile (AIOP). These functions allow users to quickly start and speed up prototype development and evaluation.
 
  • Innovative development environment allows simultaneous development of communication control and system control: Renesas’ Smart Configurator GUI generates Bluetooth code and MCU peripheral function driver code as well as pin settings for the e2 Studio integrated development environment (IDE). The Renesas QE tool for BLE generates programs for custom profiles and embeds them in user application programs to support application program development. And the Bluetooth Trial Tool Suite GUI allows users to perform initial wireless characteristics evaluations and Bluetooth functional verification. Users can typically have the RA4W1 evaluation board up and running with the downloadable smartphone applications demo in less than 30 minutes.
 
  • Reduced BOM through integration: The RA4W1 includes a high-precision, low-speed on-chip oscillator, and also integrates an RF oscillator adjustment circuit and on-chip matching circuit for easy antenna connection. This high-level of integration reduces both BOM (bills of materials) costs and circuit board area, resulting in lower IoT equipment manufacturing costs.
 
  • The Flexible Software Package’s (FSP) open architecture allows customers to re-use their legacy code and combine it with software examples from Renesas and ecosystem partners: The FSP for RA Family MCUs speed the implementation of complex functions like connectivity and security. It features FreeRTOS and middleware offering a premium device-to-cloud option for developers. These out-of-box options can be easily replaced and expanded with any other RTOS or middleware.
 
Pricing and Availability
The RA4W1 is available now from Renesas Electronics’ worldwide distributors and is priced at $3.98 USD in 10,000-unit quantities. For more information, please visit: www.renesas.com/products/microcontrollers-microprocessors/ra/ra4/ra4w1.
 
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, infrastructure, and IoT applications that help shape a limitless future. Learn more at renesas.com. Follow us on LinkedInFacebookTwitter, and YouTube.

Leave a Reply

featured blogs
Oct 23, 2020
Processing a component onto a PCB used to be fairly straightforward. Through hole products, a single or double row surface mount with a larger center-line rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller and conne...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren'€™t wobbly and you don'€™t have to strike a key dead center for it to make contact?...
Oct 23, 2020
At 11:10am Korean time this morning, Cadence's Elias Fallon delivered one of the keynotes at ISOCC (International System On Chip Conference). It was titled EDA and Machine Learning: The Next Leap... [[ Click on the title to access the full blog on the Cadence Community ...

featured video

Better PPA with Innovus Mixed Placer Technology – Gigaplace XL

Sponsored by Cadence Design Systems

With the increase of on-chip storage elements, it has become extremely time consuming to come up with an optimized floorplan with manual methods. Innovus Implementation’s advanced multi-objective placement technology, GigaPlace XL, provides automation to optimize at scale, concurrent placement of macros, and standard cells for multiple objectives like timing, wirelength, congestion, and power. This technology provides an innovative way to address design productivity along with design quality improvements reducing weeks of manual floorplan time down to a few hours.

Click here for more information about Innovus Implementation System

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

featured chalk talk

UWB: Because Location Matters

Sponsored by Mouser Electronics and Qorvo

While technologies like GPS, WiFi, and Bluetooth all offer various types of location services, none of them are well-suited to providing accurate, indoor/outdoor, low-power, real-time, 3D location data for edge and endpoint devices. In this episode of Chalk Talk, Amelia Dalton chats with Mickael Viot from Qorvo about ultra-wideband (UWB) technology, and how it can revolutionize a wide range of applications.

Click here for more information about Qorvo Ultra-Wideband (UWB) Technology