industry news
Subscribe Now

Renesas Electronics Accelerates HMI- and Camera-Based Development with Integrated RZ/A1 Design Environment

RZ/A1 MPUs and RZ/A1 Software Package Combine Best of Microcontroller and Microprocessor Environments to Ease the Migration Path for MPU-Based Design

TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced a new design environment for its powerful RZ/A1 microprocessors (MPUs) to simplify and accelerate the development of rich human-machine interface- (HMI) and camera- and GUI-based applications, such as industrial equipment, building controls, home automation, medical devices, white goods, and video surveillance and video/fingerprint based access control.

Featuring the new RZ/A1 Software Package, the integrated design environment offers a complete starting point for RZ/A1-based HMI and camera-GUI design, significantly reducing the complexity and resources required to develop these applications. The RZ/A1 Software package incorporates familiar and easy-to-use design characteristics of the microcontroller (MCU) design environment to ease the transition path for designers who are migrating to a rich and more complex MPU design environment.

The growing popularity of HMI-based systems and other markets where HMI and streaming converge is driving the need for higher-end MPU implementations that can manage the demands of these rich and highly sophisticated systems.

“For designers accustomed to a simpler and more streamlined MCU design environment, transitioning to the highly complex MPU environment can be a significant obstacle,” said Mark Rootz, Senior Director of Industrial Marketing Division, Industrial Solutions Business Unit, Renesas Electronics Corporation. “To help them navigate this journey, Renesas created a design environment with the RZ/A1 Software Package where designers can leverage the best of both worlds – combining the elevated capabilities of MPUs with the ease of use of MCUs, which builds confidence for making the leap to MPU-based solutions.”

Main Features of the RZ/A1 Design Environment

Renesas’ high-performance RZ/A1 MPUs features the ease of use of Renesas MCUs along with up to 10MB of on-chip SRAM, a built-in memory management unit, and a powerful Arm® Cortex®-A9 core. This combination allows engineers to keep the application design process simple and fast, while they take advantage of computational and HMI capabilities of high-speed MPUs.

Pre-integrated with the RZ/A1 MPUs, the new design environment combines everything needed to immediately begin HMI design work. The RZ/A1 Software Package is a fully integrated software package that includes a real-time operating system, drivers, middleware, and sample applications for camera-GUI-display implementation along with software components, such as:

Software engineers working with streaming applications, such as IP-based video and radio streams, as well as video surveillance and video/fingerprint-based access control, can use the RZ/A1 Software Package together with the Renesas RZ development kit to further reduce development times. This out-of-the-box evaluation and development platform allows engineers to begin their specific code development almost immediately after installing the project and opening the tool suite.

Eliminating the typical software integration tasks allows engineers to focus their time and resources on developing compelling HMI-based applications.

In addition to the software quick start, the RZ/A1 MPUs and the RZ/A1 Software Package offer a streamlined PCB layout with quad flat packaging (QFP) and easy power and clock design, as well as a familiar debugging and development experience for designers migrating from MCU to MPU environments. XIP (Execute-in-Place) Linux with QSPI flash memory allows the RZ/A1 Series to add MCU-like boot-up times to the MPU-level performance.

The hardware integration enables customers to spin up their custom designs quickly, minimize implementation errors and other design risks, eliminate the need for external DRAM, deliver boot up response times similar to MCUs, and reduce overall bill-of-materials costs.

The RZ/A1 Software Package is compatible with the IAR System® IAR Embedded Workbench®, as well as with Renesas’ e² studio Eclipse-based development environment.

Availability

The RZ/A1 Software Package is available now pre-integrated with the RZ/A1 MPUs and is also available for use with the RZ development kit. For more information, view here.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. A global leader in microcontrollers, analog, power, SoC products and integrated platforms, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics, Office Automation and Information Communication Technology applications to help shape a limitless future. Learn more at renesas.com.

Leave a Reply

featured blogs
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Feb 19, 2024
9,120 views