industry news
Subscribe Now

Qorvo® Simplifies Wi-Fi 6E System Design with the First Single FEM to Support 5.1 to 7.1 GHz Bands

Accelerates design, enhances Wi-Fi 6/Wi-Fi 6E capabilities and delivers industry-leading throughput for enterprise gateways and access points

GREENSBORO, N.C., Jan. 06, 2022 (GLOBE NEWSWIRE) — Qorvo® (Nasdaq: QRVO), a leading provider of innovative RF solutions that connect the world, today introduced the first wideband Wi-Fi front-end module (FEM) covering the 5.1 GHz to 7.1 GHz bands for customer premises equipment (CPE). Qorvo’s new wideband QPF4730 can provide full-frequency support for both Wi-Fi 6 and Wi-Fi 6E enterprise solutions.

In previous generations of Wi-Fi routers, each radio is fixed to a specific frequency, due to the narrowband nature of available solutions. To enable broadband operation, manufacturers must currently place a 5 GHz front-end module, a 6 GHz front-end module and switch components. The QPF4730 flexibly delivers full high-band support while reducing the board space required in Wi-Fi 6E upgrades. This improves overall system performance, capacity and flexibility.

Tony Testa, Qorvo director of Technical Marketing, said, “Qorvo’s newest FEM is optimized to operate over 5 GHz, 6 GHz or both, to maximize system capacity and throughput, which is not possible in existing CPE designs. Qorvo’s QPF4730 is the first in a family of new products that will address operational and architectural flexibility for Wi-Fi 6E channels and will include solutions for home gateways, routers and mesh systems.”

The QPF4730 enhances efficiency in Wi-Fi 6/Wi-Fi 6E architectures and is optimized for Power over Ethernet (PoE), improving Quality of Service (QoS), range and throughput. This solution maximizes user capacity and leverages the full available spectrum. It also enables manufacturers to design smaller form factors than current gateways to meet user expectations for more compact, sleek and efficient designs. With its expanded spectrum, Wi-Fi 6E provides higher throughput while servicing more client connections in home, campus and enterprise settings.

For more information about Qorvo’s solutions, announcements and meeting inquiries, visit our Qorvo CES 2022 landing page.

Qorvo’s Wireless Connectivity business is a leading developer of wireless semiconductor system solutions for connected devices that support Wi-Fi, and IoT low-power Zigbee, Thread, Bluetooth® Low Energy and UWB. To learn more about Qorvo solutions that enable faster connections for Wi-Fi 6E and beyond, visit the company’s online Wi-Fi Innovation Resource Center.

About Qorvo
Qorvo (Nasdaq: QRVO) makes a better world possible by providing innovative Radio Frequency (RF) solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FleClear: TDK’s Transparent Conductive Ag Film
Sponsored by Mouser Electronics and TDK
In this episode of Chalk Talk, Amelia Dalton and Chris Burket from TDK investigate the what, where, and how of TDK’s transparent conductive Ag film called FleClear. They examine the benefits that FleClear brings to the table when it comes to transparency, surface resistance and haze. They also chat about how FleClear compares to other similar solutions on the market today and how you can utilize FleClear in your next design.
Feb 7, 2024
11,092 views