industry news
Subscribe Now

Pixus Offers Pluggable Tier 3 SOSA Aligned Chassis Manager

Waterloo, Ontario  —  Mar 25, 2024 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a Tier 3 SOSA aligned chassis management module for OpenVPX that is pluggable.

 The SHM200 chassis manager for OpenVPX is compliant to VITA 46.11 for system management. The unit comes in 3U and 6U sizes and in VITA 48.1 format for air cooled systems and VITA 48.2 format for conduction cooled systems. The Tier 3 chassis manager can plug into a standard 3U VPX backplane slot in the P0 connector position. There are also versions for more I/O that utilize the P1 or P1/P2 connectors. The standard panel interface has RS-232, RJ-45 or SFP, USB and LEDs. 

With monitoring of at least 6 temperature sensors and 10 fans, the SHM200 has custom options available. There is fan PWM/Tach control, along with 16 digital inputs and outputs and a Web interface.    

 Pixus offers OpenVPX backplanes, chassis platforms, and specialty products. The company also provides a mezzanine-based Tier 3 SOSA Aligned chassis manager that does not consume a slot. 

 About Pixus Technologies

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  ATCA, OpenVPX, MicroTCA, and custom designs. Pixus also has an extensive offering of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.  

Leave a Reply

featured blogs
Apr 12, 2024
Like any software application or electronic gadget, software updates are crucial for Cadence OrCAD X and Allegro X applications as well. These software updates, often referred to as hotfixes, include support for new features and critical bug fixes made available to the users ...
Apr 11, 2024
See how Achronix used our physical verification tools to accelerate the SoC design and verification flow, boosting chip design productivity w/ cloud-based EDA.The post Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with Synopsys Cloud appeared ...
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

USB Power Delivery: Power for Portable (and Other) Products
Sponsored by Mouser Electronics and Bel
USB Type C power delivery was created to standardize medium and higher levels of power delivery but it also can support negotiations for multiple output voltage levels and is backward compatible with previous versions of USB. In this episode of Chalk Talk, Amelia Dalton and Bruce Rose from Bel/CUI Inc. explore the benefits of USB Type C power delivery, the specific communications protocol of USB Type C power delivery, and examine why USB Type C power supplies and connectors are the way of the future for consumer electronics.
Oct 2, 2023