industry news
Subscribe Now

Picocom selects UltraSoC in-system analytics and monitoring IP for 5G New Radio small cell SoC

Includes system-wide analytics for in-life use, benefiting Picocom engineering and customer development

CAMBRIDGE, UK – 17 June 2020

UltraSoC today announced that Picocom, the 5G open RAN baseband semiconductor and software specialist, has selected UltraSoC’s hardware-based analytics and monitoring IP for use in Picocom’s upcoming baseband system-on-chip (SoC) for 5G small cells. The UltraSoC IP enables Picocom and its customers to monitor, analyze and fine-tune the performance of their systems throughout the whole product lifecycle, starting in the lab for silicon bring-up and software development, through to deployment and in-field optimization.

Picocom President Peter Claydon commented: “As a result of this partnership with UltraSoC, Picocom customers can accelerate and de-risk their own system development and optimize system performance in the field over the lifetime of their product. This is particularly important as the mobile industry starts to adopt open RAN and virtual RAN principles, which will see software from different vendors running code on the same hardware, with frequent software upgrades over the product lifecycle.”

Picocom provides open RAN standards-compliant baseband SoCs and carrier-grade software products for 5G small cell infrastructure. The company’s forthcoming distributed unit (DU) baseband offload system-on-chip (SoC) is designed to be deployed in buildings to increase 5G coverage and reduce the processing load on 5G macrocells under the open RAN initiative. By partnering with UltraSoC to add in-field monitoring and analytics to its products, Picocom aims to further empower wireless vendors and new market entrants to compete in the rapidly evolving disaggregated telecoms RAN market.

Picocom has selected a suite of UltraSoC’s IP to enable monitoring and development of software for its SoC as a whole, from IP definition through to software/code refinement. This addresses the SoC’s CEVA XC12 DSPs, control processors, Arteris FlexNoC (Network on Chip) interconnect, custom accelerators, DDR controller, Ethernet interface, and other logic, in a single monitoring and analytics infrastructure. This makes it much easier for Picocom’s engineers and its customers to fine-tune performance. Picocom will also deploy UltraSoC’s USB IP, allowing customers to debug systems at high-speed in a ‘closed chassis’ through a standard USB port.

Using UltraSoC’s hardware monitoring and analytics infrastructure will allow Picocom to offer unique optimization features across its product line. Data on the behavior of the system is captured in real-time, and with detailed information about system timing – essential for demanding applications such as wireless communications. Just as importantly, UltraSoC’s on-chip monitors feature integrated ‘smarts’: data can be pre-processed and analyzed locally on-chip, giving the engineer deep insight into system operation, without the need to route excessive volumes of data off-chip.

UltraSoC CEO Rupert Baines said: “We are proud to be working with Picocom, an innovative company with extensive experience in the field of small cells. Too many silicon companies regard post-silicon debug and optimization as ‘someone else’s problem’. The fact that Picocom has selected such a comprehensive suite of UltraSoC IP demonstrates a serious commitment to helping its customers deliver the best possible products, on time – and with reliability and upgradeability ‘baked in’ from day one.”

About UltraSoC

UltraSoC is a pioneering developer of analytics and monitoring technology at the heart of the systems-on-chip (SoCs) that power today’s electronic products. The company’s embedded analytics technology allows product designers to add advanced cybersecurity, functional safety and performance tuning features; and it helps resolve critical issues such as increasing system complexity and ever-decreasing time-to-market. UltraSoC’s technology is delivered as semiconductor IP and software to customers in the consumer electronics, computing and communications industries. For more information visit www.ultrasoc.com.

About Picocom

Picocom is a semiconductor company that designs and markets open RAN standard-compliant baseband SoCs and carrier-grade software products for 5G small cell infrastructure. The company, founded in 2018, is headquartered in Hangzhou, China, and has R&D engineering sites in Beijing, China and Bristol, UK. Picocom founding members have significant experience in designing baseband infrastructure products. Picocom is a proud member of the Small Cell Forum, O-RAN Alliance and Telecom Infra Project wireless industry associations.
www.picocom.com

Leave a Reply

featured blogs
Sep 25, 2020
[From the last episode: We looked at different ways of accessing a single bit in a memory, including the use of multiplexors.] Today we'€™re going to look more specifically at memory cells '€“ these things we'€™ve been calling bit cells. We mentioned that there are many...
Sep 25, 2020
Normally, in May, I'd have been off to Unterschleißheim, a suburb of Munich where historically we've held what used to be called CDNLive EMEA. We renamed this CadenceLIVE Europe and... [[ Click on the title to access the full blog on the Cadence Community site...
Sep 24, 2020
I just saw a video from 2012 in which Jeri Ellsworth is strolling around a Makerfaire flaunting her Commodore 64-based bass guitar....
Sep 24, 2020
Samtec works with system architects in the early stages of their design to create solutions for cable management which provide even distribution of thermal load. Using ultra-low skew twinax cable to route signals over the board is a key performance enabler as signal integrity...

Featured Video

AI SoC Chats: Host Processor Interconnect IP for AI Accelerators

Sponsored by Synopsys

To support host-to-AI accelerator connectivity, AI chipsets can use PCI Express, CCIX, and/or CXL, and each have their benefits. Learn how to find the right interconnect for your AI SoC design.

Click here for more information about DesignWare IP for Amazing AI

Featured Paper

Designing highly efficient, powerful and fast EV charging stations

Sponsored by Texas Instruments

Scaling the necessary power for fast EV charging stations can be challenging. One solution is to use modular power converters stacked in parallel.

Learn More in our technical article

Featured Chalk Talk

Accelerate HD Ultra-Dense Multi-Row Mezzanine Strips

Sponsored by Mouser Electronics and Samtec

Embedded applications are putting huge new demands on small connectors. Size, weight, and power constraints are combining with new signal integrity challenges due to high-speed interfaces and high-density connections, putting a crunch on connectors for embedded design. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about the new generation of high-performance connectors for embedded design.

More information about Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips: