industry news
Subscribe Now

Phil Kaufman Hall of Fame Announced by ESD Alliance and IEEE CEDA

Posthumous Recognition for Individuals who made Significant, Noteworthy Contributions to Industry

MILPITAS, CALIF. –– February 2, 2021 –– The Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA), sponsors of the Phil Kaufman Award for Distinguished Contributions to Electronic System Design, today announced the Phil Kaufman Hall of Fame.

This new award posthumously recognizes individuals who made significant and noteworthy contributions through creativity, entrepreneurism and innovation to the electronic system design industry and were not recipients of the Phil Kaufman Award. Deceased members of the community are not eligible to receive the Phil Kaufman Award, a policy set by the IEEE.

“Many individuals made significant contributions to the semiconductor design industry and helped it grow to where it is today, underpinning the entire global semiconductor and electronic products markets,” says Bob Smith, executive director of the ESD Alliance. “Unfortunately, many of these contributors died but should be recognized for their efforts that were instrumental in shaping our community. The Phil Kaufman Hall of Fame is intended to change that.”

Selections for entry into the inaugural Phil Kaufman Hall of Fame will be determined through a nomination process. Nominations will be reviewed by the ESD Alliance and IEEE CEDA Kaufman Award review committees and approved nominees will be honored for their contributions and achievements in 2021. The nomination period runs from now through Friday, March 26. The link to the nomination form can be found here.

Inductees will be announced in early April. A special Phil Kaufman Hall of Fame page on the ESD Alliance and IEEE CEDA websites will host their photos, citations and tributes.

The long-standing and prestigious Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. It was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. 

About the IEEE Council on Electronic Design Automation (CEDA)

The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters. 

Stay in touch with IEEE CEDA:

Website: www.ieee-ceda.org

LinkedIn: https://www.linkedin.com/groups/8343531

Facebook: https://www.facebook.com/ieeeceda/

Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. 

Follow the ESD Alliance

www.esd-alliance.org

Leave a Reply

featured blogs
Apr 16, 2024
In today's semiconductor era, every minute, you always look for the opportunity to enhance your skills and learning growth and want to keep up to date with the technology. This could mean you would also like to get hold of the small concepts behind the complex chip desig...
Apr 11, 2024
See how Achronix used our physical verification tools to accelerate the SoC design and verification flow, boosting chip design productivity w/ cloud-based EDA.The post Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with Synopsys Cloud appeared ...
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

ROHM's 4th Generation SiC MOSFET
In this episode of Chalk Talk, Amelia Dalton and Ming Su from ROHM Semiconductor explore the benefits of the ROHM’s 4th generation of silicon carbide MOSFET. They investigate the switching performance, capacitance improvement, and ease of use of this new silicon carbide MOSFET family.
Jun 26, 2023
33,517 views