industry news
Subscribe Now

PARALIA is a new EU HORIZON Research and Innovation Actions Project that aims to the development of fundamental innovations for automotive and aerospace applications

Thessaloniki (Greece), 5th May 2023 – PARALIA is a new ambitious EU HORIZON Research and Innovation Actions Project launched on January 1st that aims to the development of fundamental innovations in the field of automotive and aerospace applications. PARALIA is funded under the HORIZON-CL4-2022-DIGITAL-EMERGING-01-03 Call. The project is coordinated by Aristotle University of Thessaloniki in Greece and will be running throughout the period of January 2023 to June 2026.

The impressive milestones achieved in the on-going global race for highly automated or autonomous vehicles are setting the stage for major transformations across the transportation industry, led primary by the expected wide adoption of Level 2 and Level 3 automated driving systems in next-generation automotive vehicles, the forward-looking roadmaps of major technology vendors, predicting next generation consumer-centric fleets of robo-taxis and the growing maturity and expected proliferation of autonomous or Enchanted Flight Vision System-augmented Urban Air Mobility. Transforming however, these technological concepts into a tangible reality has been proven challenging, with recent studies urgently calling for a new-generation of integrated, cost-effective and multi-domain sensory systems, capable of providing to Machine Learning algorithms the required heterogenous environmental information in a low-energy envelope.

PARALIA aims to demonstrate breakthrough performance by enabling an agile, low-cost, and energy-efficient multi-sensor that combines RADAR and LiDAR technologies and by re-architecting the sensors ecosystem enabling ultra-high resolution at ultra-long distances crucial for current and futuristic automotive and aerospace applications.

PARALIA targets to a powerful common LiDAR/RADAR optical multibeam beamforming platform that will be developed based on the best-in-class multi-port linear optical operator architectures exploiting the mighty synergy of InP and SiN integration platforms.

PARALIA will highlight its versatile and scalable perspective and its broad market take-up credentials through the demonstrations of a new series of low-cost, energy-efficient and high-performance LiDAR/RADAR and multi-sensor modules for ultra-high resolution at ultra-long distances for current and futuristic automotive and aerospace applications.

The consortium is bringing together 6 leading industrial partners, and 3 top-ranked academic and research institutes in the PIC and Photonic Systems value chain. The project participants are the Aristotle University of Thessaloniki (Greece), Institute of Communication and Computer Systems (Greece), Argotech a.s (Czechia), Collins Aerospace Ireland (Ireland), LioniX International BV (Netherlands), SIKLU Communication LTD (Israel), Sivers Semiconductors (Sweden), VALEO Autoklimatizace K.S. (Czechia) and Fraunhofer Heinrich Hertz Institute (Germany).

PARALIAPhotonic Multi-beam Beamforming Technology enabling RADAR/LiDAR Multisensor Fusion platforms for Aerospace and Automated Driving applications (Project Number: 101093013)
For more information, please visit project’s website:

For updates follow us also in:


Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 21, 2023
Labforge is a Waterloo, Ontario-based company that designs, builds, and manufactures smart cameras used in industrial automation and defense applications. By bringing artificial intelligence (AI) into their vision systems with Cadence , they can automate tasks that are diffic...
Sep 21, 2023
At Qualcomm AI Research, we are working on applications of generative modelling to embodied AI and robotics, in order to enable more capabilities in robotics....
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....
Sep 21, 2023
See how we're accelerating the multi-die system chip design flow with partner Samsung Foundry, making it easier to meet PPA and time-to-market goals.The post Samsung Foundry and Synopsys Accelerate Multi-Die System Design appeared first on Chip Design....

featured video

TDK PowerHap Piezo Actuators for Ideal Haptic Feedback

Sponsored by TDK

The PowerHap product line features high acceleration and large forces in a very compact design, coupled with a short response time. TDK’s piezo actuators also offers good sensing functionality by using the inverse piezo effect. Typical applications for the include automotive displays, smartphones and tablet.

Click here for more information about PowerHap Piezo Actuators

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit:

featured chalk talk

ROHM's 4th Generation SiC MOSFET
In this episode of Chalk Talk, Amelia Dalton and Ming Su from ROHM Semiconductor explore the benefits of the ROHM’s 4th generation of silicon carbide MOSFET. They investigate the switching performance, capacitance improvement, and ease of use of this new silicon carbide MOSFET family.
Jun 26, 2023