LONDON, UK, 12 March 2019 – RS Components (https://uk.rs-online.com/web/
The KUNBUS products now … Read More → "RS Components introduces intelligent industrial devices for deployment in automation"
Premstaetten, Austria (5 March, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, has introduced the AS6500, a new high-resolution time-to-digital converter (TDC) featuring CMOS inputs and compact packaging for use in space- and cost-constrained applications.
TDCs from ams can measure time intervals as short as 5ns with 10ps precision. The AS6500 is based on the existing ams TDC-GPX2, and offers resolution up to 10ps on four channels and a sampling rate of up to 1.5Msamples/s.
March 6, 2019 – Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is pleased to be a principal sponsor of the 17th Read More → "Mouser Sponsors 2019 Global Create the Future Design Contest"
Düsseldorf, March 7, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the new “RX Functional Safety” solution for industrial applications that reduces the complexity of IEC 61508 SIL3 (Note 1) certification, an international standard for functional safety. Based on the RX family of microcontrollers (MCUs), the new solution provides advanced functional safety for industrial equipment, including functions for chip self-diagnostics, the world’ … Read More → "Renesas Electronics Introduces RX Functional Safety Solution with World’s First SIL3 Software Certification for Industrial Equipment"
March 7, 2019 – Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the Read More → "Microchip’s PIC-IoT WG Development Board, Now at Mouser, Seamlessly Connects Embedded Applications to Google Cloud"
[March 7, 2019] – The Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced a new reference design board for high-current ASIC and/or FPGA chipsets supporting the SVID or AVS protocols.
PSA 48V direct conversion DC-DC modules – or ‘power stamps’ – primarily target high-performance computers and servers being used in large data centers, many of which follow … Read More → "Power Stamp Alliance Announces ASIC Reference Design Board"
MALVERN, Pa. — March 6, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new -30 V and -40 V Automotive Grade p-channel TrenchFET® power MOSFETs in the PowerPAK® SO-8L package with gullwing leads for increased board-level reliability. Providing more than a 50 % reduction in mounting area compared to devices in the DPAK, the AEC-Q101 qualified SQJ407EP and SQJ409EP save PCB space and lower costs while delivering lower on-resistance than any MOSFET with gullwing leads in the 5 mm by 6 mm footprint.
Due to their high power requirements, motor drives and main power supplies in 12 V automotive systems require MOSFETs … Read More → "Vishay Intertechnology AEC-Q101 Qualified -30 V and -40 V P-Channel MOSFETs Use 50 % Less Space Over DPAK, Increase Board-Level Reliability"
San Diego, CA – March 5, 2019 – Source Photonics, a leading vendor of optical connectivity products for Access and Datacom applications, today announced it will demonstrate the interoperability of its latest 400G and 100G PAM4 based transceivers with industry partners at OFC 2019 from March 5-7.
Successful interoperability between optical transceivers and hosts is crucial to rolling out the next higher data rate connectivity. Multiple demonstrations at Source … Read More → "Source Photonics Demonstrates Multi-Vendor Interoperability of Latest 400G and 100G PAM4 Technologies at OFC 2019"
SWINDON, United Kingdom, March 7, 2019– Sensata Technologies (NYSE:ST), an industrial technology company and a leading provider of sensors, today announced the availability of the new ACW4 Single Turn and TCW4 Multi Turn Absolute Hall Effect Sensors, which feature an over-molded, two-part modular construction that provides engineers with exceptional design flexibility.
The sensing electronics are encased in a thermoplastic polyamide shell while the separate activating magnet is external to the sensor assembly. This modular architecture results in a compact package of only 50mm in diameter by a maximum 24mm thick that allows designers to … Read More → "Sensata Technologies Introduces Well-Sealed, Easy to Install Modular Hall Effect Sensors"
San Jose, Calif. – March 7, 2019 – ADLINK Technology, a global provider of leading Edge Computing solutions, has partnered with Google Cloud to integrate ADLINK’s hardware and software solutions with Google Cloud IoT offerings, providing customers with an easy path to added business value by harnessing and analyzing critical operational data.
“Companies are seeking hardware solutions that are pre-integrated with … Read More → "ADLINK Partners with Google Cloud to Offer IoT Ready Solutions"
