industry news archive
Subscribe Now

Helix Semiconductors Brings Improved Power Efficiency to Range of DC-DC Applications

NUREMBERG, Germany, May 06, 2019 (GLOBE NEWSWIRE) — Booth #355 – Fabless power semiconductor company Helix Semiconductors today announced a new DC-DC product family that maximizes low-profile DC-DC power delivery to create leading-class, high-power density solutions. Based on the technology platform first introduced in its highly efficient Read More → "Helix Semiconductors Brings Improved Power Efficiency to Range of DC-DC Applications"

Keysight Technologies, Calterah Collaborate to Launch New Generation Automotive Radar Chipset

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, has joined forces with China’s leading automotive millimeter wave radar chipset design house, Calterah, to support the design, verification, test and launch of a new generation of automotive millimeter wave radar chipset that will drive development of the connected car supply … Read More → "Keysight Technologies, Calterah Collaborate to Launch New Generation Automotive Radar Chipset"

Cycle-accurate trace boosts performance optimization capabilities of UltraSoC embedded analytics infrastructure

CAMBRIDGE, UK & Shenzhen, China – 7 May 2019

UltraSoC today announced new technology within its embedded monitoring and analytics infrastructure that allows designers of high-performance computing, storage and real-time devices to squeeze ultimate levels of performance from their products. The addition of cycle-accurate trace enables developers of real-time applications using UltraSoC’s embedded analytics to see not only what is happening inside devices, but critically, when something occurred.

Cycle-accurate tracing is increasingly important in real-time and performance-critical applications, where engineers need to optimize the operation of their hardware and software code down to the level of single … Read More → "Cycle-accurate trace boosts performance optimization capabilities of UltraSoC embedded analytics infrastructure"

Abaco Announces Ultra-high Performance Graphics, Vision and AI Evaluation Platform Featuring NVIDIA Jetson AGX Xavier Module

 

  • Delivers up to 5.7 TeraFLOPS for maximum performance in advanced applications
  • Minimal SWaP enables deployment in constrained environments
  • Wide range of I/O provides maximum flexibility

 

HUNTSVILLE, Ala.— May 7 2019 Abaco Systems today announced the GVC1001 ultra-high performance graphics, vision and AI evaluation platform. It is based on the recently-released NVIDIA® Jetson™ AGX Xavier™ module that features an NVIDIA Volta GPU with 512 … Read More → "Abaco Announces Ultra-high Performance Graphics, Vision and AI Evaluation Platform Featuring NVIDIA Jetson AGX Xavier Module"

eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip

SAN JOSE, Calif. — May 7, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a 7nm test chip to validate the latest neuASIC™ IP platform release. eSilicon’s neuASIC IP platform provides a library of IP that supports a wide range of functions found in artificial intelligence applications. The IP is verified to be compatible and supports algorithm-specific customization as well as a validated integration architecture through eSilicon’s ASIC Chassis.

IP on the test chip includes specialized memory and … Read More → "eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip"

New 8 x 8 mm addition to Nexperia’s LFPAK MOSFET family delivers up to 48x power density

Nijmegen, May 7th, 2019: Nexperia, the global leader in discretes, logic and MOSFET devices, today announced a new package in its MOSFET and LFPAK family which, when combined with its latest silicon technology, results in 40 V MOSFETs delivering a low RDS(on) of 0.7 mΩ. LFPAK88 devices replace larger power packages such as D²PAK and D²PAK-7, and measuring 8 x 8 mm offer a footprint reduction of 60 %, … Read More → "New 8 x 8 mm addition to Nexperia’s LFPAK MOSFET family delivers up to 48x power density"

Power Integrations Unveils Complete Range of Switcher ICs with Integrated 900 V MOSFETs

San Jose, Calif. – May 7, 2019 – Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the release of a … Read More → "Power Integrations Unveils Complete Range of Switcher ICs with Integrated 900 V MOSFETs"

Stepping Up Power Density with Vincotech’s New PFC Module

Unterhaching/Munich, Germany, May 7, 2019. Vincotech GmbH today extended its product line-up with the flow3xANPFC 1, a new PFC module aimed to help vendors step up efficiency and drive down costs. Vincotech, a supplier of module-based solutions for power electronics, engineered this ultra-compact module to pack a lot of power into a petit housing. Offering impressive performance at a remarkably low price, the flow3xANPFC 1 line goes a long way towards cutting manufacturers’ overall system costs. </ … Read More → "Stepping Up Power Density with Vincotech’s New PFC Module"

OneSpin Joins the RISC-V Foundation

MUNICH, GERMANY –– May 7, 2019 –– OneSpin® Solutions today joined the RISC-V Foundation, a non-profit corporation controlled by its members to drive a new era of processor innovation via the adoption and implementation of the free and open RISC-V instruction set architecture (ISA).

This follows an earlier announcement that OneSpin, provider of certified IC integrity verification solutions for building functionally correct, safe, secure … Read More → "OneSpin Joins the RISC-V Foundation"

UnitedSiC adds 7 SiC FETs to 650V product portfolio

May 7th, 2018, Princeton, New Jersey and Nuremberg, Germany: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, has added seven new TO220-3L and D2PAK-3L device/package combinations to its UJ3C (general purpose) and UF3C (hard switched) series of 650V SiC FETs.

These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power supplies, telecom rectifiers, and on-board chargers respectively. The new devices will appeal to designers who prefer a 3-lead, TO220 … Read More → "UnitedSiC adds 7 SiC FETs to 650V product portfolio"

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...