News – Page 949 – EEJournal

Renesas Electronics Enables Embedded Automotive ADAS Developments with Perception Quick Start Software

Software Designed Specifically to Utilize Unique Hardware Accelerators in R-Car V3H System on Chip

June 6, 2019

Düsseldorf, June 3, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, continues to accelerate the development of advanced driver assistance systems (ADAS) systems with a new Perception Quick Start Software based on its R-Car V3H system-on-chip (SoC). The solution delivers reference software for camera obstacle detection (COD), LiDAR obstacle detection (LOD), and road … Read More →

Analog Devices’ New Multi-Channel, Mixed-Signal RF Converter Platform Expands Call Capacity and Data Throughput for Wireless Carriers

June 6, 2019

NORWOOD, Mass.–(BUSINESS WIRE)– Read More → "Analog Devices’ New Multi-Channel, Mixed-Signal RF Converter Platform Expands Call Capacity and Data Throughput for Wireless Carriers"

UltraSoC embedded analytics selected to support Wave Computing’s TritonAI 64 IP platform

System-on-chip monitoring, testing and analytics platform supports fast development of intelligent heterogeneous IP designs

June 6, 2019

CAMBRIDGE, UK and DAC 2019, Las Vegas – 3 June 2019

UltraSoC today announced that Wave Computing has chosen the company’s embedded analytics and heterogeneous debug technology to test its new TritonAI 64 scalable IP platform for intelligent SoCs (systems on chip). Wave Computing’s use of UltraSoC’s platform will also serve as a reference design for customers needing to validate and debug heterogeneous IP designs.

Wave Computing is partnering with UltraSoC to create a reference architecture for testing, validating and reporting on the performance of SoCs based on the TritonAI 64 Platform. The platform contains three different types … Read More → "UltraSoC embedded analytics selected to support Wave Computing’s TritonAI 64 IP platform"

NXP Drives the 5G Revolution with Its Industry-Leading Portfolio of RF Infrastructure Solutions

June 6, 2019

News Highlights:

NXP’s comprehensive suite of solutions address 5G RF power amplification needs for base stations, from MIMO to massive MIMO based active antenna systems for cellular and millimeter Wave (mmWave) spectrum bands.
NXP simplifies 5G Massive MIMO deployments by enabling smaller, lighter active antenna systems with Multi-Chip Modules (MCM) that offer high levels of integration and performance on the market.
NXP’s solutions, from sub-6 GHz to 40 GHz and from milliwatts to kilowatts, further simplify 5G infrastructure.

BOSTON, June 04, 2019 (GLOBE NEWSWIRE) — International Microwave Symposium 2019 – NXP … Read More → "NXP Drives the 5G Revolution with Its Industry-Leading Portfolio of RF Infrastructure Solutions"

Faraday Adopts Synopsys SpyGlass Design Handoff Kit to Ensure High Design Quality

New Kit Provides Infrastructure for Checking, Reporting, and Packaging of ASIC Designs

June 6, 2019

MOUNTAIN VIEW, Calif., June 5, 2019 /PRNewswire/ — Read More → "Faraday Adopts Synopsys SpyGlass Design Handoff Kit to Ensure High Design Quality"

Sectigo and Thirdwayv Speed Connected Device Deployments by Introducing Strongest Level of Embedded IoT Security

Joint Solution Protects Smartphone and App Layers from Malware and Wireless Attacks in Medical and Other Mission-Critical IoT Systems

June 6, 2019

ROSELAND, N.J. – June 5, 2019 – Sectigo (formerly Comodo CA), the world’s largest commercial Certificate Authority and a provider of purpose-built and automated PKI management solutions, today announced a technology partnership with Thirdwayv, a leading provider of end-to-end secure … Read More → "Sectigo and Thirdwayv Speed Connected Device Deployments by Introducing Strongest Level of Embedded IoT Security"

Deliver “smarter” faster: Mentor introduces new AI/ML toolkit, adds AI/ML power to Calibre tools to speed smarter IC innovation

June 5, 2019

Mentor, a Siemens business, has announced an artificial intelligence/machine learning (AI/ML) development kit and added AI/ML enhancements to two tools to help its customers deliver smarter, AI/ML-powered ICs to market faster. The new Catapult™ software High-Level Synthesis (HLS) AI Toolkit and HLS ecosystem are designed to help customers jumpstart the development of complex machine learning IC architectures. Meanwhile, Mentor has also announced it is adding AI/ML infrastructure throughout the Calibre™ platform, and is launching the first two of these AI/ML-powered technologies: Calibre Machine Learning OPC (mlOPC) and Calibre LFD with Machine Learning – both … Read More → "Deliver “smarter” faster: Mentor introduces new AI/ML toolkit, adds AI/ML power to Calibre tools to speed smarter IC innovation"

Mentor sets new software scaling benchmark for Semiconductor Design Workload on Microsoft Azure

June 4, 2019

Mentor, a Siemens business, today announced that the Calibre™ platform Physical Verification Suite has achieved a new standard for electronic design automation (EDA) software scalability on the Microsoft Azure cloud platform.

The benchmarks were achieved during scaling experiments on 5nm test chips and a full reticle-sized 7nm production design on Azure. In these deployments, Calibre scaled out to more than 4,000 CPUs – an industry record for an EDA tool scaling a single job on Azure. Mentor and Azure plan additional experiments to demonstrate further scaling and establish recommended chip design sizes to help mutual customers achieve … Read More → "Mentor sets new software scaling benchmark for Semiconductor Design Workload on Microsoft Azure"

RS Components launches RS platform across the Americas to enable easier design-in process for engineers

New site helps to bring joined-up design experience between DesignSpark and ease of purchase of board-level products and technologies for engineers

June 4, 2019

LONDON, UK, 3 June 2019 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, today announced the launch of its new
americas.rsdelivers.com (Read More → "RS Components launches RS platform across the Americas to enable easier design-in process for engineers"

Menlo Micro Unveils Ideal Switches that Perform Beyond 20GHz, Setting New Standard for RF Switch Performance

New MM5120 and MM5130 Bring Major Improvements to Insertion Loss, Power Handling and Linearity

June 4, 2019

BOSTON, June 03, 2019 (GLOBE NEWSWIRE) — Today marks another major milestone in the history of Menlo Micro with the introduction of their latest series … Read More → "Menlo Micro Unveils Ideal Switches that Perform Beyond 20GHz, Setting New Standard for RF Switch Performance"