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Teledyne SP Devices Announces New 8-channel 10-bit Digitizer with 1 GS/s Sampling Rate

Linköping, Sweden, June 14, 2019 – Teledyne SP Devices today announced the release of ADQ8-8C – a flexible data acquisition board with high channel density and an open FPGA architecture which makes it ideal for large-scale physics installations and Original Equipment Manufacturer (OEM) product integration.

The 8-channel ADQ8-8C allows for compact and cost-efficient multi-channel system design. The versatile analog front-end (AFE) of ADQ8-8C supports a wide variety of detectors and can therefore be used in many applications such as particle physics, scientific instruments, time-of-flight applications, and more.

OpenHW Group created and announces CORE-V family of open-source cores for use in high volume production SoCs

Ottawa, Canada and Zurich, Switzerland, June 6, 2019: A new not-for-profit global organization aims to boost the adoption of open-source processors by providing a platform for collaboration, creating a focal point for ecosystem development, and offering open-source IP for processor cores.

Headed by Founder and CEO, Rick O’Connor, the OpenHW Group has already recruited 13 sponsor organizations and expects this to grow to 25 by the end of 2019. OpenHW Group is a member of the RISC-V Foundation ( Read More → "OpenHW Group created and announces CORE-V family of open-source cores for use in high volume production SoCs"

Renesas Electronics Develops New Processing-In-Memory Technology for Next-Generation AI Chips that Achieves AI Processing Performance of 8.8 TOPS/W

TOKYO, Japan, June 13, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced it has developed an AI accelerator that performs CNN (convolutional neural network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will accelerate increased intelligence of endpoint devices. A Renesas test … Read More → "Renesas Electronics Develops New Processing-In-Memory Technology for Next-Generation AI Chips that Achieves AI Processing Performance of 8.8 TOPS/W"

X-FAB and Efabless Announce Successful First Silicon of Raven, An Open-Source RISC-V Microcontroller

Tessenderlo, Belgium and San Jose, CA, United States – June 13, 2019

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with crowd-sourcing IC platform partner Efabless Corporation, today announced the successful first-silicon availability of the Efabless RISC-V System on Chip (SoC) reference design. This open-source semiconductor project went from design start to tape-out in less than three months using the Efabless design flow based on open-source tools.  The mixed-signal SoC, called Raven, is based on the community developed ultra-low power PicoRV32 RISC-V core.  Efabless has successfully bench-tested the Raven at 100MHz, and based on simulations the design … Read More → "X-FAB and Efabless Announce Successful First Silicon of Raven, An Open-Source RISC-V Microcontroller"

Renesas Electronics Develops Low-Power Technology for Embedded Flash Memory Based on SOTB™ Process to Enable Energy Harvesting and Eliminate Need for Batteries

TOKYO, Japan, June 12, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the development of new low-power technology for use in embedded flash memory based on a 65 nanometer (nm) SOTB™ (Silicon On Thin Buried Oxide) process. Available with 1.5 MB capacity, it is the world’s first embedded 2T-MONOS (2 Transistors-Metal Oxide Nitride Oxide Silicon) flash memory … Read More → "Renesas Electronics Develops Low-Power Technology for Embedded Flash Memory Based on SOTB™ Process to Enable Energy Harvesting and Eliminate Need for Batteries"

TT Electronics to Launch New Series of Integrated, High-Performance Reflective Sensors for Industrial & Medical Applications at Sensors Expo 2019

STMicroelectronics Exhibits Semiconductor Solutions for Industrial IoT at Embedded Technology West 2019

Tokyo, June 12, 2019 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will demonstrate its IoT solutions for industrial applications at Embedded Technology West, Grand Front Osaka, June 13-14, 2019. ST’s centerpiece Smart Industry demo shows the increasing potential for collaboration among humans, robots, and facilities. Other key ST exhibits focus on Industrial IoT (IIoT) and embedded Artificial Intelligence (AI).

ST’s Smart Industry demonstration integrates a humanoid robot, a robot arm, and a belt conveyor equipped with a range of functions including face recognition, voice control, AI-based image recognition, vibration detection, … Read More → "STMicroelectronics Exhibits Semiconductor Solutions for Industrial IoT at Embedded Technology West 2019"

ACEINNA Expands AMR Based Current Sensor Family

Andover, Massachusetts- June 12, 2019

ACEINNA today announced that their industry leading MCx1101 family of Current Sensors now supports 3.3 volt applications. These highly accurate, wide bandwidth AMR-based current sensors are now available for a wide range of ADC and microprocessor based power systems and applications.

Units are now available for sampling and volume shipments.

“Our integrated, AMR … Read More → "ACEINNA Expands AMR Based Current Sensor Family"

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