News – Page 944 – EEJournal

Saelig Introduces the PCBite System For Precise PCB Probing

This kit holds any size circuit board and features spring-loaded fine tips on stable gooseneck arms for hands-free PCB probing

June 19, 2019

Fairport, NY, USA: Saelig Company, Inc. announces the introduction of the Sensepeek PCBite System – a professional yet affordable PCB testing apparatus with a system of repositionable fine-point spring-loaded probes, a large (8.3″ x 11.7″) metal baseplate, and four magnetic-base PCB holders for clamping circuit boards in a stable, fixed position. The probes are attached to a flexible, stable gooseneck arm that has a powerful magnetic base, and the probe’s gold-plated needle tips are replaceable. An easy electrical connection is made to the probe tip via a standard pair of built-in 0.1″-separated posts, enabling two instruments, … Read More →

Achronix Selects Moortec’s 7nm Embedded Temperature Sensor To Optimise Performance And Reliability In Its 4th Generation Speedster FPGA

June 18, 2019

Plymouth, UK, June 18th 2019

Moortec Semiconductor Ltd, providers of complete In-Chip PVT (Process, Voltage and Temperature) Monitoring Subsystems announced today that Achronix Semiconductor Corporation have chosen Moortec’s 7nm Embedded Temperature Sensor IP to optimise performance and increase reliability for the company’s Speedster®7t FPGAs

Achronix specialise in high-performance FPGA solutions that include high-density FPGA ICs, eFPGA IP for ASIC and SoC designs, FPGA chiplets for multichip modules and SiPs (Systems in Packages), and accelerator boards for datacenter and HPC applications. Achronix also offers its best-in-class ACE tool suite, which supports … Read More → "Achronix Selects Moortec’s 7nm Embedded Temperature Sensor To Optimise Performance And Reliability In Its 4th Generation Speedster FPGA"

ROM-Based GNSS Module from STMicroelectronics Targets Mass-Market Tracking and Navigation Applications

June 18, 2019

Geneva, June 17, 2019 — STMicroelectronics has enlarged its GNSS product offering with the Teseo-LIV3R ROM-based module. The competitively-priced module provides ST’s full GNSS algorithm capability for cost-conscious tracking and navigation devices.

ST’s new GNSS module provides odometer functionality with three trip counters and reached-distance alert, along with geofencing capabilities with up to eight configurable circles and crossing-circles alarm. Support for real-time assisted GNSS with free server access ensures uninterrupted positioning data for dependable navigation.

Telit ME910C1-WW is the First NB-IoT Module Certified by AT&T

June 18, 2019

Highly efficient power usage and enhanced coverage makes the ME910C1-WW ideal for a wide variety of battery-powered and massive-scale IoT applications
The ME910C1-WW is the first module certified for use on AT&T’s NB-IoT and LTE-M IoT networks

London, June 17, 2019 – Telit, a global enabler of the Internet of Things (IoT), today announced that the ME910 … Read More → "Telit ME910C1-WW is the First NB-IoT Module Certified by AT&T"

Samtec Features Latest 32GT/s Interconnect Solutions at PCI-SIG® Developers Conference 2019

June 18, 2019

New Albany, IN: Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019.

Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted.

Demonstrations:

Scalable 32 GT/s Silicon Test Platform:
Demonstration of configurable, next-generation GPU-based system combining a cable mesh backplane (AcceleRate® Slim … Read More → "Samtec Features Latest 32GT/s Interconnect Solutions at PCI-SIG® Developers Conference 2019"

New eBook from Mouser Electronics and Qorvo Explores the Future of 5G Connectivity

June 18, 2019

June 17, 2019 – Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces a new eBook in collaboration with Read More → "New eBook from Mouser Electronics and Qorvo Explores the Future of 5G Connectivity"

ams to light up Sensors Expo 2019 with innovative demonstrations of new optical sensor technologies

Industry-first use cases in automotive, medical, consumer and industrial applications

June 18, 2019

Premstaetten, Austria (17 June, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, will showcase innovative optical sensing technologies which are transforming personal health monitoring, the mobile phone, automotive evolution, and smart agriculture at the Sensors Expo 2019 (25-27 June, San Jose, CA). The company will also lead two Sensors Expo conference sessions.

Breakthroughs from ams, such as the development of nanoscale optical filters and new miniature, best-in-class efficiency power laser emitters, are creating new markets and opening up fresh opportunities to deploy optical sensors across the automotive, medical, consumer and industrial … Read More → "ams to light up Sensors Expo 2019 with innovative demonstrations of new optical sensor technologies"

Wind River Joins O-RAN Alliance to Support Growth of Open Source Innovation for 5G Networks

June 18, 2019

ALAMEDA, CA — June 6, 2019 — Wind River® ( http://www.windriver.com/?utm_source=PR&utm_campaign=Automotive-OTA-SLM-2018 ), a leader in delivering IoT software for critical infrastructure, today announced that it has joined the O-RAN Alliance ( Read More → "Wind River Joins O-RAN Alliance to Support Growth of Open Source Innovation for 5G Networks"

ES Design West Opens July 9 at SEMICON West 2019 in San Francisco

“Meet the Experts” Program Features System-Centric Vision, Celebrates Commercial Achievements of Electronic System Design

June 18, 2019

MILPITAS, CALIF. –– Jun 13, 2019 –– ES Design West, hosted by the Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner, opens Tuesday, July 9, at San Francisco’s Moscone Center as a co-located event at SEMICON West, and runs through Thursday, July 11.</ … Read More → "ES Design West Opens July 9 at SEMICON West 2019 in San Francisco"

Toshiba Selects Cadence Tensilica Vision P6 DSP as Image Recognition Processor for its Next-Generation ADAS Chip

Tensilica Vision P6 DSP increases performance and power efficiency compared to CPUs for vision and AI applications

June 17, 2019

SAN JOSE, Calif., June 13, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) announced today that Toshiba has implemented the Cadence® Tensilica® Vision P6 DSPs for its next-generation automotive SoC to meet functional safety requirements. The Vision P6 DSP provides high compute throughput with low power consumption, small core area and a strong partner ecosystem, and is certified to meet functional safety requirements, making it the ideal choice for automotive applications. Offering up to 3.8X more power efficiency than CPUs alone and 1024 giga-operations (GOPS) of processing power, the Vision P6 DSP serves as a powerful offload engine, efficiently processing vision and AI … Read More → "Toshiba Selects Cadence Tensilica Vision P6 DSP as Image Recognition Processor for its Next-Generation ADAS Chip"