November 14, 2019 – Mouser Electronics, Inc. today released Read More → "Industry Experts Discuss Prototyping with Purpose in Mouser’s Latest Engineering Big Ideas eBook"
SAN JOSE, Calif. — November 11, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a definitive agreement with Inphi Corporation (NYSE: IPHI) to acquire eSilicon. Concurrently, Synopsys, Inc. (Nasdaq: SNPS) announced the signing of a definitive agreement to acquire eSilicon’s embedded memory (SRAM, TCAM, multi-port memory compiler) and interface (HBM and HBI™) IP assets.
The press release detailing the … Read More → "eSilicon to be Acquired by Inphi and Synopsys"
HARRISBURG, Pa. – November 12, 2019 – TE Connectivity (TE), a world leader in connectivity and sensors, is extending its time-tested 369 connector series with the introduction of the new 369 shielded rectangular connectors for environments that demand ambient EMI noise protection. These connectors incorporate the benefits of the 369 series, which is qualified for use in a wide range of commercial aerospace applications, with EMI shielding that opens up new application possibilities.
“The combination of shielding technology with the existing 369 connector series enables a huge range of potential applications for the 369 series beyond commercial aerospace,” said Clint Schlosser, product manager for TE’s … Read More → "TE Connectivity’s new 369 shielded connectors expand harsh environment capabilities beyond commercial aerospace"
London, November 11, 2019 – Telit, a global enabler of the Internet of Things (IoT), today announced two new Narrow Band-IoT modules< … Read More → "Telit Adds New Cellular Low Power Wide Area Modules to Portfolio"
Mentor, a Siemens business, today introduced the new Tessent™ software Safety ecosystem – a comprehensive portfolio of best-in-class automotive IC test solutions from Mentor with links to its industry-leading partners. The program helps IC design teams meet the increasingly stringent functional safety requirements of the … Read More → "Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era"
TOKYO, Japan, November 12, 2019 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA) microcontroller (MCU) Family of 32-bit Arm® Cortex®-M MCUs. RA MCUs deliver optimized performance and ease of use with the Flexible Software Package (FSP) and partner building block solutions that work out-of-box to address a range of Internet of Things (IoT) endpoint and edge applications.
The RA MCU ecosystem today has more than 30 partners with continuous investments planned. Each partner’s … Read More → "Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions"
SANTA CLARA, Calif., Nov. 12, 2019 (GLOBE NEWSWIRE) — Efinix®, an innovator in programmable product platforms and technologies, today announced the rollout of Trion® T120 FPGAs, featuring a small, high-density fabric, a hardened DDR memory controller and hardened MIPI CSI-2 and PHY interfaces.
Built on SMIC’s 40nm process, Trion T120 FPGAs are designed and developed to address high-volume cutting-edge products and applications in … Read More → "Efinix® Rolls Out Trion® T120 FPGAs"
HUNTSVILLE, Ala.— November 12 2019 Abaco Systems today announced the XMC477RC 4-Channel SFP Gigabit Ethernet Interface, further expanding the company’s range of network interface card options. The new XMC is distinguished by its support for four SFP (Small … Read More → "Abaco Announces Flexible, Rugged 4-Channel Gigabit Ethernet Interface XMC to Help Minimize Size, Weight and Power (SWaP)"
MUNICH, Germany – November 12, 2019 – NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest provider of automotive semiconductors, today announced an addition to its UWB portfolio with a new automotive UWB IC. UWB provides precise, secure, real-time localization capabilities unrivaled by other wireless technologies such as Wi-Fi, Bluetooth, and … Read More → "NXP Announces New Automotive Ultra-Wideband Chip Capable of Turning Smartphones into Car Keys"
