News – Page 900 – EEJournal

NVIDIA Turing GPUs and NVIDIA Xavier Achieve Fastest Results on MLPerf Benchmarks Measuring Data Center and Edge AI Inference Performance

November 18, 2019

NVIDIA today posted the fastest results on new benchmarks measuring the performance of AI inference workloads in data centers and at the edge — building on the company’s equally strong position in recent benchmarks measuring AI training.

< … Read More →

Temperature Sensor Accurate to 0.25°C, from STMicroelectronics, Delivers Flexible Power Savings for Mobile Monitoring

November 18, 2019

Geneva, November 18, 2019 — With typical temperature-reading accuracy of 0.25°C and low operating and standby current, the STMicroelectronics STTS22H enhances temperature and heat-flow monitoring in asset trackers, shipping-container loggers, HVAC systems, air humidifiers, refrigerators, building-automation systems, and smart … Read More → "Temperature Sensor Accurate to 0.25°C, from STMicroelectronics, Delivers Flexible Power Savings for Mobile Monitoring"

Supplyframe and Cadence collaborate to integrate cloud-based PCB library service directly with the next generation of PCB tools

November 18, 2019

Pasadena, CA, USA, November 18th, 2019 – Supplyframe’s subsidiary company SamacSys, the world’s leading provider of electronic component CAD models and library services, has completed a new integration with Cadence Design Systems, Inc.’s Allegro® and OrCAD® PCB design tool suites. This collaboration supports the Cadence® OrCAD Capture Cloud and the new Allegro System Capture electrical engineering design platform by directly integrating the SamacSys platform of free design resources, including PCB footprints, schematic symbols and 3D models for more than 15 million components.

“Collaborating with Cadence to integrate our eCAD model platform within their next-generation Allegro System Capture … Read More → "Supplyframe and Cadence collaborate to integrate cloud-based PCB library service directly with the next generation of PCB tools"

Pentek Announces 6.4 GHz A/D and D/A Jade 3U VPX Module for Wideband Defense, Radar and Communication Applications

November 18, 2019

Utilizes state-of-art high-speed Texas Instruments A/Ds and D/As
Matching 6.4 GHz A/D and D/A sampling for wideband signals
3U VPX with PCIe Gen.3×8, Optical I/O and RF I/O backplane options
Jade architecture uses Xilinx Kintex UltraScale FPGA
Navigator Design Suite supports Xilinx Graphical Vivado IP IntegratorUPPER SADDLE RIVER, NJ─November 18, 2019─Pentek, Inc., today introduced the newest member of the Jade™ family of high-performance data converter 3U VPX modules based on the Xilinx Kintex Ultrascale FPGA. The Model 54141A is a dual channel analog-to-digital and digital-to-analog … Read More → "Pentek Announces 6.4 GHz A/D and D/A Jade 3U VPX Module for Wideband Defense, Radar and Communication Applications"

Vishay Intertechnology AC and Pulse Film Capacitors Ensure Compliance With AEC-Q200 Rev. D, Withstand THB Testing

For Hybrid and Electric Vehicles, Automotive Grade Metallized Polypropylene Devices Feature High Operating Temperature to +125 °C

November 18, 2019

MALVERN, Pa. — Nov. 18, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of Automotive Grade AC and pulse metallized polypropylene film capacitors for hybrid and electric vehicles. With a maximum operating temperature of +125 °C (observing voltage derating), Vishay BCcomponents MKP385e series devices ensure compliance with IEC 60384-17 and AEC-Q200 Revision D while withstanding temperature humidity bias (THB) testing of 60 °C, 93 % RH for 56 days at rated voltage.

The radial potted capacitors released today are designed to ensure high and stable pulse strength and ripple current capabilities over a long service life under harsh environmental conditions. Offered … Read More → "Vishay Intertechnology AC and Pulse Film Capacitors Ensure Compliance With AEC-Q200 Rev. D, Withstand THB Testing"

Samtec and REFLEX CES Launch New 448 Gbps (16 x 28 Gbps) Embedded Optical Development Platform at SC19

November 18, 2019

New Albany, IN and Paris, France: Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, and REFLEX CES, a leading European-based provider of custom embedded systems and high-end FPGA COTS boards, proudly announce a new embedded optical development platform at SC19. This new solutions combines the latest FPGA solutions from REFLEX CES with the Read More → "Samtec and REFLEX CES Launch New 448 Gbps (16 x 28 Gbps) Embedded Optical Development Platform at SC19"

Blaize Emerges from Stealth to Transform AI Computing

Blaize, formerly known as Thinci, unveils the first true Graph-Native silicon architecture and software platform built to process neural networks and enable AI applications with unprecedented efficiency

November 18, 2019

News Highlights

Blaize Graph Streaming Processor (GSP) architecture: the first to enable concurrent execution of multiple neural networks and entire workflows on a single system, while supporting a diverse range of heterogeneous compute intensive workloads
Fully programmable solution brings new levels of flexibility for evolving AI models, workflows, and applications that run efficiently where needed, a breakthrough for dynamic intelligence at the edge
Directly addresses technology and economic barriers to AI adoption via streamlined processing that yields 10-100x improvement in systems … Read More → "Blaize Emerges from Stealth to Transform AI Computing"

Nordic Semiconductor unveils world’s first dual Arm Cortex-M33 processor wireless SoC

November 15, 2019

The nRF5340 combines a high performance application processor with a fully programmable, ultra low power network processor, plus advanced root-of-trust and trusted execution security features, into a low power multiprotocol SoC ready for professional lighting, industrial automation, advanced wearables, and other complex IoT applications.

Oslo, Norway – November 14, 2019 – Nordic Semiconductor today announces the nRF5340^TM high-end multiprotocol System-on-Chip (SoC), the first member of its next generation of nRF5 Series SoCs. The nRF5340 builds on Nordic’ … Read More →

Keysight, FormFactor and CompoundTek Join Forces to Accelerate Integrated Photonics Innovations

November 15, 2019

LIVERMORE, Calif.; SINGAPORE, November 14, 2019

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, Read More → "Keysight, FormFactor and CompoundTek Join Forces to Accelerate Integrated Photonics Innovations"

New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging

Silicon-proven, high-bandwidth, low-latency interface extends Cadence high-performance computing IP portfolio for AI/ML, 5G, cloud computing and networking

November 14, 2019

Silicon proven and prime for customer engagements today
Supports multi-chip module SoCs on organic substrates
40Gbps wire speed delivers up to 1Tbps/mm unidirectional bandwidth
Achieves better than 10-15 BER without requiring FEC
SAN JOSE, Calif., November 13, 2019—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence® UltraLink™ D2D PHY IP, a high-performance, low-latency PHY for die-to-die connectivity targeted at the AI/ML, 5G, cloud computing and networking market segments. The UltraLink D2D PHY IP is an enabling technology for chiplet and system-in-package (SiP) applications, which empower system-on-chip (SoC) … Read More → "New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging"