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Keysight, Marvin Test Solutions Collaborate to Speed Manufacturing of mmWave Semiconductors

Supplier of functional test solutions integrates Keysight’s PXIe-based Vector Network Analyzer (VNA) to accelerate measurements in 5G semiconductor test platform
December 5, 2019

SANTA ROSA, Calif., December 5, 2019

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that its collaboration with Marvin Test Solutions, Inc. (MTS) – a supplier of functional test solutions – has resulted in the development of a fast and accurate 5G semiconductor manufacturing test platform.</ … Read More → "Keysight, Marvin Test Solutions Collaborate to Speed Manufacturing of mmWave Semiconductors"

VadaTech Announces a Dual FMC+ Carrier with Xilinx Zynq® UltraScale+ FPGA

December 5, 2019

Henderson, NV – December 5, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC560. The AMC560 is an AMC FPGA Carrier with dual FMC+ (VITA 57.4) interfaces and is compliant to AMC.1, AMC.2, AMC.3 and AMC.4 specifications. The unit has a … Read More → "VadaTech Announces a Dual FMC+ Carrier with Xilinx Zynq® UltraScale+ FPGA"

Renesas Electronics Introduces Low-Power RL78 Prototyping Board to Simplify IoT Endpoint Equipment Prototyping

New Prototyping Board and Bluetooth® Low Energy Expansion Board Feature Interfaces Supporting a Wide Range of Functional Expansion
December 5, 2019

TOKYO, Japan, December 5, 2019 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RL78/G14 Fast Prototyping Board – a low-cost, function-rich board to enable rapid product development for IoT endpoint equipment. Quicker development prototyping and lower costs give users the agility to respond to rapid changes in technology and market needs, and reduces the time to market window for new products. Renesas also introduced the RL78/G1D BLE Module Expansion Board, which users can combine with the new prototyping board to add Bluetooth® Low Energy wireless communication functions (Note 1) with … Read More → "Renesas Electronics Introduces Low-Power RL78 Prototyping Board to Simplify IoT Endpoint Equipment Prototyping"

Renesas Electronics Delivers Enhanced Security and Privacy for Bluetooth® 5 Connections With 32-Bit RX23W Microcontroller

Provides Full Support Including Long-Range and Mesh Network, and Single-Chip System Control and Wireless Communication
December 4, 2019
Düsseldorf, December 4, 2019 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX23W – a 32-bit microcontroller (MCU) featuring Bluetooth® 5.0 for IoT endpoint devices such as home appliances and healthcare equipment. By combining Bluetooth 5.0 … Read More → "Renesas Electronics Delivers Enhanced Security and Privacy for Bluetooth® 5 Connections With 32-Bit RX23W Microcontroller"

STMicroelectronics Launches Affordable and Easy-to-Use STM8 Nucleo-32 Boards

December 4, 2019

Geneva, December 4, 2019 — STMicroelectronics is making design starts using 8-bit STM8 microcontrollers (MCUs) faster, more affordable, and more accessible for creative minds of all types by introducing new development boards in the easy-to-use Nucleo-32 form factor.

The compact boards are controlled and powered conveniently … Read More → "STMicroelectronics Launches Affordable and Easy-to-Use STM8 Nucleo-32 Boards"

Andes certifies Imperas models and simulator as reference for new Andes RISC-V Vectors Core with lead customers and partners

Imperas code morphing simulation technology, virtual platforms and tools used by lead customers for early software development and high-level architectural exploration
December 4, 2019

Oxford, United Kingdom, December 5th, 2019 — Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced with Andes Technology Corporation, the close collaboration with lead customers for the latest Andes Vectors Core NX27V, which addresses the requirement for advanced ML (machine learning) and AI (artificial intelligence) applications. Using Imperas models and tools allows system designers to evaluate advanced SoC architectural analysis … Read More → "Andes certifies Imperas models and simulator as reference for new Andes RISC-V Vectors Core with lead customers and partners"

Vishay Intertechnology Commercial Inductors Offer High Operating Temperatures to +155 °C in Compact 1212 Case Size

Space-Saving Devices Feature Profiles as Low as 1.0 mm for Computer and Telecom Applications
December 4, 2019

MALVERN, Pa. — Dec. 4, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced three new commercial IHLP® low profile, high current inductors with high operating temperatures up to +155 °C in the 3.3 mm by 3.3 mm 1212 case size — the company’s smallest to date. Designed to save space in computer and telecom applications, the Vishay Dale IHLP-1212AZ-51, IHLP-1212AB-51, and IHLP-1212BZ-51 offer extremely low profiles down to 1.0 mm.

The devices released today are optimized for energy storage in DC/DC converters up to 5 MHz and provide excellent attenuation of noise in high current filtering applications up to the SRF of … Read More → "Vishay Intertechnology Commercial Inductors Offer High Operating Temperatures to +155 °C in Compact 1212 Case Size"

ADLINK Teams with Intel and AWS to Offer AI at the Edge for Machine Vision Applications

Solution combines Intel® Distribution of OpenVINO™ toolkit, AWS Greengrass, Amazon Sagemaker and ADLINK Edge™ to simplify Edge AI deployments
December 3, 2019

December 2, 2019 – San Jose, Calif. – ADLINK Technology, a global leader in edge computing, has joined forces with Intel and Amazon Web Services (AWS) to simplify artificial intelligence (AI) at the edge for machine vision. The integrated solution offers an Amazon Sagemaker-built machine learning model optimized by and deployed with the Intel® Distribution of OpenVINO™ toolkit, the ADLINK Edge™ software suite, and certification on … Read More → "ADLINK Teams with Intel and AWS to Offer AI at the Edge for Machine Vision Applications"

Reduce Memory Costs and Retain Data at Power Loss with Microchip’s EERAM Memory Solutions

New family introduces high density SPI EERAMs, extending up to 1 Mb
December 3, 2019

CHANDLER, Ariz., Dec. 02, 2019 (GLOBE NEWSWIRE) — From smart meters to manufacturing lines, applications that require repetitive task data logging must be able to automatically restore content if power is disrupted during processing. Current low density (64 Kb to 1Mb) nonvolatile serial RAM (NVRAM) solutions used for these datalogs are typically the highest price-per-bit memory in the resulting end products. Microchip Technology Inc. (NASDAQ: MCHP) today announced a new family of Read More → "Reduce Memory Costs and Retain Data at Power Loss with Microchip’s EERAM Memory Solutions"

Accurate blood pressure measurement can now be cuff-less and calibration-free and can be built in to every smartphone

“Cuff-less” devices that require cuff calibration or wearables that are not medically accurate will not solve the global hypertension epidemic
December 2, 2019

November 27, 2019, Lausanne, Switzerland:  The first measurement of blood pressure was made in 1896 by squeezing the flesh around an artery. This method remains the only non-invasive way to measure blood pressure, and 123 years later, there is only one device in the world that can do it without a cuff and to medical accuracy.  That device, the V-Sensor, is the technical implementation of proven medical science by Leman Micro Devices (LMD), the developer of regulated consumer healthcare products that is backed by major players within the mobile device industry.

There are many ways of tracking … Read More → "Accurate blood pressure measurement can now be cuff-less and calibration-free and can be built in to every smartphone"

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