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Tieto and STMicroelectronics Accelerate Development of Automotive Central Control Units for Safer and More Secure Vehicles

December 10, 2019

Espoo, Finland, and Geneva, Switzerland, December 10, 2019 – Tieto, a leading software and services company and a member of the ST Partner Program, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced their collaborative efforts to develop Central Control-Unit (CCU) software to run on STMicroelectronics’ popular Telemaco3P platform.

Accelerating electrification and connectivity requirements of vehicles are pushing for greater and greater processing power and uncompromised cybersecurity. In turn, automakers’ demands for Central Control Units meeting connectivity, data privacy, security, and over-the-air update needs have led … Read More → "Tieto and STMicroelectronics Accelerate Development of Automotive Central Control Units for Safer and More Secure Vehicles"

Artilux unveils world’s first GeSi wide spectrum 3D sensor at CES

December 10, 2019
  • Photonic innovation improving eye safety, sensing accuracy and performance under sunlight
  • The first CMOS-based ToF sensor that can work with optical wavelengths up to 1.55µm
  • Safety for consumers boosted by use of longer NIR wavelengths

    Hsinchu, Taiwan, December 10th – At CES 2020, Artilux, an innovator in photonics and electronics technology, will be unveiling its Explore Series, the world’s first wide spectrum 3D ToF (time-of-flight) sensor based on GeSi (germanium-on-silicon) photonic innovation. Operating at longer NIR (near infared) wavelengths, the sensor can be used in the area of the spectrum that is more than 10 … Read More → "Artilux unveils world’s first GeSi wide spectrum 3D sensor at CES"

Microchip Unveils Family Details and Opens Early Access Program for RISC-V Enabled Low-Power PolarFire SoC Family

Early access program starts for PolarFire SoC, which delivers simultaneous support of real-time applications and rich operating systems with unparalleled power efficiency
December 10, 2019

CHANDLER, Ariz., Dec. 10, 2019, RISC-V Summit — The trend towards compute intensive gateways and edge devices is driving the integration of traditional deterministic control applications with additional embedded processing capabilities needed for smart and secure connected systems. In response, Microchip Technology Inc. (Nasdaq: MCHP) is opening the Early Access Program (EAP) for the PolarFire® field programmable gate array (FPGA) system-on-chip (SoC). The platform offers the world’s first hardened real-time, Linux® capable, RISC-V-based microprocessor subsystem on the award-winning, mid-range PolarFire FPGA family, bringing class-leading low power consumption, thermal efficiency and defense grade security to embedded … Read More → "Microchip Unveils Family Details and Opens Early Access Program for RISC-V Enabled Low-Power PolarFire SoC Family"

Fully Integrated Power-Management IC from STMicroelectronics Saves Board Space, Bill of Materials, and Power Consumption

Companion chip to STM32MP1 microprocessor and general-purpose system power management solution
December 9, 2019

Geneva, December 9, 2019 — With features including four DC/DC buck converters, a boost DC/DC converter, and six low-dropout regulators (LDOs), the STMicroelectronics STPMIC1 power-management IC (PMIC) satisfies the complex power demands of highly integrated application-processor … Read More → "Fully Integrated Power-Management IC from STMicroelectronics Saves Board Space, Bill of Materials, and Power Consumption"

Imec presents forksheet device as the ultimate solution to push scaling towards the 2nm technology node

TCAD simulations of a new forksheet device show 10 percent performance boost and 20 percent cell area reduction compared to gate-all-around nanosheet devices.
December 9, 2019

LEUVEN (Belgium), December 9, 2019 — This week, at the 2019 IEEE
International Electron Devices Meeting, imec, a world-leading research
and innovation hub in nanoelectronics and digital technologies, presents
first standard cell simulation results of its forksheet device designed
for sub-3nm logic technology nodes. Compared to nanosheet devices, the
reduced n-to-p spacing results in a 10 percent performance increase.
When combined with scaling boosters, the new device architecture will
bring logic standard cell height down to 4.3 tracks, which combined with
cell template optimization can result in more than 20 percent area
reduction. The results value … Read More → "Imec presents forksheet device as the ultimate solution to push scaling towards the 2nm technology node"

UltraSoC donates RISC-V trace implementation to enable true open-source development

Works through OpenHW Group to support design innovation and ensure ecosystem compatibility
December 6, 2019

CAMBRIDGE, UK – 6 December 2019

UltraSoC today announced it will offer an open-source implementation of its industry-leading RISC-V trace encoder via the OpenHW Group. The availability of a production-grade, standards-compliant processor trace solution is a key enabler for developers, and supports the OpenHW Group’s aim of creating an open, commercial grade ecosystem for development based on open-source processors.

Rupert Baines, CEO of UltraSoC, said: “We fully believe in industry standards and the importance of open-source; by donating this encoder we can help industry adoption of RISC-V, strengthen the ecosystem and support compatibility and consistency. Open-source is … Read More → "UltraSoC donates RISC-V trace implementation to enable true open-source development"

Murata Develops the World’s First Multilayer Ceramic Capacitor

December 6, 2019

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M, the world’s first multi-layer ceramic capacitor*1 to feature a maximum capacitance of 0.1μF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020.
*1 According to research by the Company. As of November 30, 2019.

As smartphones supporting 5G become more widespread and devices such as wearable devices become increasingly multifunctional and more compact, the demand for smaller and higher density electronic circuitry is growing. Among the components employed in this circuitry, multi-layer ceramic capacitors are essential for … Read More → "Murata Develops the World’s First Multilayer Ceramic Capacitor"

Nexperia introduces industry’s fastest Common Mode Filters with Integrated ESD Protection for Super Speed USB

Widest differential passband; high surge robustness and low clampingNijmegen, December 3, 2019: Nexperia, the expert in discrete and MOSFET components and analog & logic ICs, today announced the market’s fastest common mode filter (choke)/ ESD protection combination. The new PCMFxUSB3BA/C features the industry’s widest differential passband of up to 10 GHz 3dB frequency and a very high surge robustness of up to 7.5 A 8/20 µs. It is designed to suppress common mode and single-ended noise while minimizing the impact on the signal integrity of extremely fast data lines. Developed to meet the requirements of Super Speed USB applications, the new devices provide effective 1, 2 & 3 line pair protection (Tx +/-, Rx +/-, D +/-) and filtering. Proven for 10 Gbps communications line protection, the filter’s system-level robustness exceeds the IEC 61000-4-2 level 4, suiting them for use with sensitive SoCs. The solution also minimizes reflections when compared to a discrete design. The integration of Nexperia’s TrEOS technology results in low clamping and high robustness. PCMFxUSB3BA/C extends Nexperia’s family of Common Mode Filters (PCMF devices), helping to optimize the choice between differential pass-band and common-mode rejection at signal fundamentals and higher harmonics. Comments Stefan Seider, Product Manager, Nexperia: “Apart from their capability to reduce EMI, Common Mode Filters with ESD protection are also very popular for their efficiency in protecting sensitive transceivers: They add an impedance to the signal line pair, which is very small for differential signals but shows significant attenuation of common mode noise as well as single-ended transients such as ESD.” The new PCMF filters are available in very low-inductance, space-saving WLCSP packages. Devices are footprint-compatible with available ESD-only solutions for fast design changes. More information, including product specs and datasheets is available at: https://www.nexperia.com/products/PCMFXUSB3BA About Nexperia Nexperia is the expert in high-volume production of discrete and MOSFET components and analog & logic ICs that meet the stringent standards set by the Automotive industry. With an absolute focus on efficiency, Nexperia consistently produces the essential semiconductors required by every electronic design in the world: more than 90 billion annually. Products that are benchmarks in efficiency - in process, size, power and performance - with industry-leading small packages that save valuable energy and space. With decades of experience, supplying to the world’s biggest companies, Nexperia has over 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001 and OHSAS 18001.
December 6, 2019

Nijmegen, December 3, 2019: Nexperia, the expert in discrete and MOSFET components and analog & logic ICs, today announced the market’s fastest common mode filter (choke)/ ESD protection combination. The new PCMFxUSB3BA/C features the industry’s widest differential passband of up to 10 GHz 3dB frequency and a very high surge robustness of up to 7.5 A 8/20 µs. It is designed to suppress common mode and single-ended noise … Read More → "Nexperia introduces industry’s fastest Common Mode Filters with Integrated ESD Protection for Super Speed USB"

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