Kyoto, Japan and Santa Clara, CA, Sept. 24, 2020 (GLOBE NEWSWIRE) — ROHM announces the availability of Read More → "The Industry’s First Integrated Zero Cross Detection ICs from ROHM Semiconductor"
MOUNTAIN VIEW, Calif., Sept. 24, 2020 /PRNewswire/ —
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FORT WORTH, Tex. September 24, 2020 – As part of its ongoing efforts to enhance product availability in high-demand categories, Allied Electronics and Automation has further expanded its ready-to-ship Read More → "Taking It Up A Gear: Allied Electronics & Automation Expands Online Selection of Motion Control and Power Transmission Products"
Santa Clara, Calif., September 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today at its Global Technology Conference the next generation of its FDXTM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. GF’s industry-leading 22FDX® (22nm FD-SOI) platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.
GF’s new 22FDX+ builds on the company’s 22FDX platform, offering a broader set of features that provide high performance, ultra-low power, and specialty features and capabilities … Read More → "GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility"
Panasonic Industry Europe is continuously developing new series of surface mount Conductive Polymer Aluminum Solid capacitors OS-CON and introduces the SVT series.
This new series features low Equivalent Series Resistance (ESR) characteristics – even at low temperatures, excellent noise reduction capabilities, and frequency characteristics.
Additionally, the wide temperature rating of -50°C up to +125°C for up to 2.000 hours proves the robustness and a long lifespan of this development and enables operation in high-reliability applications.
Depending on the model of the SVT, the new capacitors feature … Read More → "New SVT series introduced as part of Panasonic Industry OS-CON capacitors"
TOKYO, Sept. 23, 2020 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has announced its next-generation V93000 testers targeted at advanced digital ICs up to the exascale performance class. The systems’ new test heads incorporate Xtreme Link™ technology, and the EXA Scale universal digital and power supply cards that enable new test methodologies, lower cost-of-test and faster time-to-market.
Today’s most advanced semiconductor processes allow for technology transformations that enable real-time integration of data from a countless number of sources such as IoT and handheld devices, automobiles … Read More → "Advantest Introduces Evolutionary V93000 EXA Scale™ SoC Test System"
ADLINK Technology, a global provider of leading edge computing solutions, launches its next generation COM Express Type 6 module, the cExpress-TL, based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron® processor (formerly Tiger Lake UP3). Featuring a brand new high performance graphics core called Intel® Iris® Xe and supporting AVX-512 VNNI (Vector Neural Network Instructions), the cExpress-TL provides AI inferencing performance nearly 3X that previously available from non-VNNI platforms.
11th Gen Intel® Core™ processors have a configurable power range of 15 to 28 watts, which makes them ideally suited for fanless space-constrained embedded … Read More → "COM Express module supports PCIe Gen4 and AI optimization"
Santa Clara, Calif., September 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities. Developed in collaboration with Mentor, a Siemens business, the new industry-leading ML-enhanced DFM solution, built on Mentor’s Calibre® nmDRC platform, can provide customers with a more effective design and development experience and, ultimately, contribute to a faster time to market.
The new ML-enhanced DFM kit is launching as an update to the process design kit (PDK) for GF’s 12LP+ … Read More → "GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities"
SAN JOSE, Calif., Sept. 24, 2020 (GLOBE NEWSWIRE) — Efabless Corporation, the leading open innovation platform for IC design, announced today it has expanded design support for the GLOBALFOUNDRIES® (GF®) 130G solution. The new offering, which includes digital design and low cost ASIC development based on configurable design templates, provides a full “semiconductor ecosystem in a box” that brings the power of GF’s 130G solution to a network of previously unserved OEMs, IC designers and IP providers. New capabilities are available on GF’s 130nm platform now.
The Cloud-based design platform provides access to EDA tools, infrastructure and prototyping … Read More → "Efabless Expands support for Cloud-based Design Platform"
