industry news
Subscribe Now

COM Express module supports PCIe Gen4 and AI optimization

Dramatic AI inferencing performance improvements at low power envelope for fanless edge computing

ADLINK Technology, a global provider of leading edge computing solutions, launches its next generation COM Express Type 6 module, the cExpress-TL, based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron® processor (formerly Tiger Lake UP3). Featuring a brand new high performance graphics core called Intel® Iris® Xe and supporting AVX-512 VNNI (Vector Neural Network Instructions), the cExpress-TL provides AI inferencing performance nearly 3X that previously available from non-VNNI platforms.

11th Gen Intel® Core™ processors have a configurable power range of 15 to 28 watts, which makes them ideally suited for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI.

The cExpress-TL is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth compared to prior generations COM Express modules. Two other important improvements are: support for 2.5 GbE Ethernet, that leverages existing CAT5e cable infrastructure being used today for 1GbE Ethernet, and support for four USB 3.2 Gen 2 ports with transfer rates of up to 10Gb/s. Both high speed interfaces are highly suited to serve as camera input ports in AI related applications.

The integrated Intel® Iris® Xe Graphics core provides 96 execution units (EUs) and can be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Legacy display interfaces such as LVDS and analog VGA can be supported as build options.

AVX-512 Vector Neural Net Instruction (VNNI) is an x86 extension designed to accelerate convolutional neural network-based algorithms. VNNI significantly improves the number of elements processed per cycle and, depending on the type of workload, can boost inferencing performance by up to 300%. The Intel OpenVINO toolkit makes sure that inferencing workloads are run across all CPU cores and Intel® Iris® Xe graphics execution units.

For mission critical or rugged applications, the cExpress-TL supports in-band ECC (IBECC) that provides ECC level error correction on standard DDR4 SODIMM memories. The module is optionally available in an Extreme Rugged version supporting ambient -40°C to +85°C operation and resistance against high vibration and shock.

For more information about the cExpress-TL COM Express module, please visit:


ADLINK is a global leader in edge computing. Our mission is to affect positive change in society and industry by connecting people, places and things with AI. Our offerings include robust boards, real-time data acquisition solutions and application enablement for AIoT. We serve vertical markets including manufacturing, communications, healthcare, military, energy, infotainment and transportation.

We’re a Premier Member of the Intel® Internet of Things Solutions Alliance, a partner of NVIDIA, and a contributor to standards initiatives such as Eclipse, OCP, OMG and ROS2 TSC. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on TAIEX (Stock Code: 6166).

Leave a Reply

featured blogs
Oct 22, 2020
WARNING: If you read this blog and visit the featured site, Max'€™s Cool Beans will accept no responsibility for the countless hours you may fritter away....
Oct 22, 2020
Cadence ® Spectre ® AMS Designer is a high-performance mixed-signal simulation system. The ability to use multiple engines and drive from a variety of platforms enables you to "rev... [[ Click on the title to access the full blog on the Cadence Community site....
Oct 20, 2020
In 2020, mobile traffic has skyrocketed everywhere as our planet battles a pandemic. saw nearly double the mobile traffic in the first two quarters than it normally sees. While these levels have dropped off from their peaks in the spring, they have not returned to ...
Oct 16, 2020
[From the last episode: We put together many of the ideas we'€™ve been describing to show the basics of how in-memory compute works.] I'€™m going to take a sec for some commentary before we continue with the last few steps of in-memory compute. The whole point of this web...

featured video

Better PPA with Innovus Mixed Placer Technology – Gigaplace XL

Sponsored by Cadence Design Systems

With the increase of on-chip storage elements, it has become extremely time consuming to come up with an optimized floorplan with manual methods. Innovus Implementation’s advanced multi-objective placement technology, GigaPlace XL, provides automation to optimize at scale, concurrent placement of macros, and standard cells for multiple objectives like timing, wirelength, congestion, and power. This technology provides an innovative way to address design productivity along with design quality improvements reducing weeks of manual floorplan time down to a few hours.

Click here for more information about Innovus Implementation System

featured paper

An engineer’s guide to autonomous and collaborative industrial robots

Sponsored by Texas Instruments

As robots are becoming more commonplace in factories, it is important that they become more intelligent, autonomous, safer and efficient. All of this is enabled with precise motor control, advanced sensing technologies and processing at the edge, all with robust real-time communication. In our e-book, an engineer’s guide to industrial robots, we take an in-depth look at the key technologies used in various robotic applications.

Click here to download the e-book

Featured Chalk Talk

Maxim's Himalaya uSLIC Portfolio

Sponsored by Mouser Electronics and Maxim Integrated

With form factors continuing to shrink, most engineers are working hard to reduce the number of discrete components in their designs. Power supplies, in particular, are problematic - often requiring a number of large components. In this episode of Chalk Talk, Amelia Dalton chats with John Woodward of Maxim Integrated about how power modules can save board space, improve performance, and help reliability.

Click here for more information about Maxim Integrated Himalaya uSLIC™ MAXM1546x Step-Down Power Modules