News – Page 7 – EEJournal

Grinn Collaborates with Renesas to Launch Grinn ReneSOM-V2H

March 4, 2026

Bringing a high-performance AI product to market usually takes years of grueling hardware development. Today, Grinn is working together with Renesas to change that narrative. Grinn announced a collaboration centered on the launch of the Grinn ReneSOM-V2H, a production-ready System-on-Module (SOM) that allows engineers to move directly from concept to application.

Grinn significantly lowers the barrier to entry for companies developing AI- and vision-enabled devices. Customers can shorten development cycles by up to 12 months, … Read More → "Grinn Collaborates with Renesas to Launch Grinn ReneSOM-V2H"

Solid Sands highlights Continuous Qualification for safety-critical toolchains at embedded world 2026

March 4, 2026

Amsterdam, 4 March 2026 – Solid Sands B.V., the world-leading provider of testing and qualification technology for compilers and libraries, will present its latest work on continuous qualification at embedded world 2026 (10–12 March, Nuremberg). Visitors can meet the company in Hall 4, Booth 4-548, where Solid Sands will share a stand with software verification specialists BUGSENG.

Together, Solid Sands and BUGSENG will demonstrate how Continuous Qualification of C and C++ toolchains can be implemented in practice, combining Solid Sands’ expertise in compiler and library qualification with BUGSENG’ … Read More → "Solid Sands highlights Continuous Qualification for safety-critical toolchains at embedded world 2026"

Mouser’s Autonomous Vehicle Online Resource Center Addresses Real-World Deployment Challenges

March 4, 2026

March 4, 2026 – Read More → "Mouser’s Autonomous Vehicle Online Resource Center Addresses Real-World Deployment Challenges"

Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications

March 4, 2026

Latest RH850 family addition building on 4 billion+ units shipped since 2013
Rich connectivity and advanced security for next‑gen E/E architectures
Supports latest automotive standards with easy ECU migration and upgrades
Lower active and standby power, reducing ECU power demand

TOKYO, Japan, March 4, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the RH850/U2C, a new 32‑bit automotive microcontroller (MCU) built on a 28nm process. With rich communication interface support and advanced security, the MCU targets a diverse range of automotive applications, including … Read More → "Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications"

Infineon’s ModusToolbox™ Power Suite accelerates the development of power conversion solutions with PSOC™ Control C3 MCUs

March 4, 2026

Munich, Germany – 03 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches ModusToolbox™ Power Suite, a comprehensive software platform for digital power conversion designs based on PSOC™ Control C3 microcontrollers (MCUs). Power Suite includes easy-to-use power conversion libraries, graphical user interfaces (GUIs), visualization tools, and application examples. All features are integrated into the ModusToolbox ecosystem, providing engineers … Read More → "Infineon’s ModusToolbox™ Power Suite accelerates the development of power conversion solutions with PSOC™ Control C3 MCUs"

Infineon’s first MOTIX™ motor control System-in-Package with integrated MCU and power stage enables designs smaller than a postage stamp

March 4, 2026

Munich, Germany – 3 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the MOTIX™ TLE9954QSW40-33, its first fully integrated motor control system-in-package (SiP) for the automotive sector. The new motor driver addresses the industry’s growing challenges related to extreme miniaturization and the increasing demand for intelligent motor control in space-constrained environments.

“By integrating all essential motor control functions, including power stages, into a single package, our customers can reduce the component count by up to 30 percent compared … Read More → "Infineon’s first MOTIX™ motor control System-in-Package with integrated MCU and power stage enables designs smaller than a postage stamp"

Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers

March 4, 2026

Munich, Germany – 3 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its DRIVECORE software portfolio with three new bundles designed to simplify and accelerate software-defined vehicle (SDV) development. At the center of this expansion is the new DRIVECORE bundle for the Infineon RISC‑V Virtual Prototype, a key milestone in preparing the automotive ecosystem for Infineon’s upcoming AURIX™ microcontroller (MCU) family based on RISC‑V. With this latest step, Infineon continues to lead the transition toward open, scalable compute architectures and … Read More → "Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers"

STMicroelectronics’ sensor and secure wireless technologies support Snapdragon Wear Elite

March 4, 2026

AI at the edge for smarter, longer lasting, and slimmer user-centric wearables
Ready-to-use solution accelerates time to market and simplifies integration

Geneva, March 2, 2026 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, now supports leading-edge motion-sensing and secure wireless technologies on Qualcomm Technologies’ newly launched personal AI platform, SnapdragonWear™ Elite. ST components help unlock richer always on sensing, unprecedented power efficiency, and breakthrough user experiences for the next generation of truly personal, responsive wearable computing devices, enabling advanced use cases … Read More → "STMicroelectronics’ sensor and secure wireless technologies support Snapdragon Wear Elite"

Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals

Built on Ceva’s third-generation PentaG platform, PentaG-NTN accelerates the convergence of satellite and cellular networks

March 4, 2026

BARCELONA, Spain – MWC26 – March 3, 2026 – As satellite connectivity rapidly becomes the most strategically important and disruptive extension of the 5G network, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced Read More → "Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals"

Accellera Approves Clock and Reset Domain Crossing (CDC/RDC) Standard 1.0 for Release

New standard enables interoperable, tool-independent CDC/RDC collateral exchange and signoff from IP to SoC design flows

March 4, 2026

Elk Grove, Calif., March 2, 2026 — Accellera Systems Initiative (Accellera), today announced that its Board of Directors has approved the Standard for IP Abstraction for Clock and Reset Domain Crossing Integration 1.0 for release. The new standard is available for immediate download.

CDC/RDC verification is essential to avoid metastability, glitches, and data reconvergence errors when signals traverse asynchronous clock or reset … Read More → "Accellera Approves Clock and Reset Domain Crossing (CDC/RDC) Standard 1.0 for Release"