EEJournal

industry news archive
Subscribe Now

NXP’s New UCODE X Delivers Industry-Leading RAIN RFID Performance for High-Volume Applications

UCODE X delivers high read and write sensitivity and customizable configurations, enabling RAIN RFID adoption in new product categories.
January 13, 2026

What’s New:

NXP Semiconductors today announced the new UCODE X, delivering industry-leading read and write sensitivity, flexible configurations, and the industry’s lowest power consumption. UCODE X supports smaller RAIN RFID labels, enabling a wide range of new, high-volume RAIN RFID applications, including retail, logistics, healthcare, and more.

Why it Matters:

Global regulations around product traceability and consumer safety continue to evolve, including the EU Digital Product Passport and U.S. FSMA 204. UCODE X provides the flexibility needed to meet … Read More → "NXP’s New UCODE X Delivers Industry-Leading RAIN RFID Performance for High-Volume Applications"

LambdaTest Rebrands to TestMu AI, the Agentic AI platform for Quality Engineering

Introducing Vibe Testing for the Age of Infinite Code: As Agentic AI transforms software development, TestMu AI introduces autonomous agents to ensure quality keeps pace with infinite code, powering 1.5+ billion tests across 18,000 enterprises.
January 12, 2026

SAN FRANCISCO, CALIFORNIA – January 12, 2026; LambdaTest, the AI-native, agentic quality engineering platform, today announced its rebrand to TestMu AI, marking a bold step forward in its evolution from a cloud testing platform to the world’s first full-stack Agentic AI Quality Engineering platform.

Founded in 2018, LambdaTest rapidly became one of the most trusted names in cloud-based test orchestration and execution. They built a scalable, high-performance test cloud that removed flakiness, improved developer feedback loops, and drastically accelerated release velocity.

In 2022, the company began a deep transformation, moving deep into agentic AI across its products and workflows … Read More → "LambdaTest Rebrands to TestMu AI, the Agentic AI platform for Quality Engineering"

Zapata and University of Maryland Collaborate to Advance New Paradigm in Quantum Software

Initiative aims to publish a formally verified implementation of Shor’s quantum factoring algorithm with relevance to cryptography and other high-value domains
January 12, 2026

Boston, Mass, January 12, 2026 — Zapata Quantum, Inc. (OTC: ZPTA) (“Zapata”, “Zapata Quantum” or the “Company”), a pioneer in quantum computing application and algorithm development, today announced a collaborative research effort with the University of Maryland (UMD), a global leader in quantum computing and quantum information science. The effort will demonstrate a fundamentally new approach to building quantum applications grounded in formal verification.

“We are honored to partner with UMD, one of the world’s leading academic institutions in quantum computing,” said Sumit Kapur, Chief Executive Officer of Zapata Quantum. “This collaboration positions Zapata at the forefront of the … Read More → "Zapata and University of Maryland Collaborate to Advance New Paradigm in Quantum Software"

Chonnam National University Researchers Develop Novel Virtual Sensor Grid Method for Low-Cost, Yet Robust, Infrastructure Monitoring

Researchers utilize superpixels, instead of pixel-level information, to enhance the robustness and accuracy of vision-based structural health monitoring
January 12, 2026

Vision-based structural health monitoring methods offer non-contact, full-field vibration measurement, reducing costs by eliminating the need for physical sensors or surface modifications. However, conventional methods rely on pixel-level data, which is noise-sensitive and exhibits instability. Now, researchers have developed a new virtual sensor framework, where superpixels, instead of pixels, are used as virtual sensors for vibration measurements. This method enhances robustness and accuracy, even in complex environments, without physical markers or contact sensors.

Structural health monitoring (SHM) and condition monitoring are crucial processes that ensure reliability and safety of engineering systems in a variety of fields, including … Read More → "Chonnam National University Researchers Develop Novel Virtual Sensor Grid Method for Low-Cost, Yet Robust, Infrastructure Monitoring"

Aetina Introduces AIB-AT Series, an Edge AI Platform Based on NVIDIA Jetson Thor for Physical AI and Robotics

January 9, 2026

The new AIB-AT platforms expand Aetina’s DeviceEdge portfolio with high-performance, low-latency computing designed for industrial robotics and emerging physical AI applications.

Aetina Corporation, a leading provider of Edge AI solutions, today announced the AIB-AT series, a next-generation edge AI platform powered by NVIDIA Jetson Thor modules. Designed to meet the rapidly growing demand for high-performance, low-latency edge intelligence in emerging Physical AI applications, the AIB-AT series marks a significant expansion of Aetina’s DeviceEdge portfolio and represents … Read More → "Aetina Introduces AIB-AT Series, an Edge AI Platform Based on NVIDIA Jetson Thor for Physical AI and Robotics"

Exxelia introduces a custom Smart Integrated Magnetics solution for space power conversion applications

January 9, 2026

Exxelia has developed a new Smart Integrated Magnetics solution designed for advanced power conditioning and distribution units (PCDUs) operating in constrained and demanding environments such as space systems.

Exxelia new Smart Integrated Magnetics solution combines the transformer and the inductor of a Dual Active Bridge (DAB) within a single, compact magnetic assembly. This integrated approach aims to reduce volume, mass and interconnection complexity while maintaining electrical performance at high switching frequencies. The targeted application is isolated DC-DC power conversion in space-grade PCDUs, where efficiency, reliability, and mechanical robustness are key design drivers.

From a technical … Read More → "Exxelia introduces a custom Smart Integrated Magnetics solution for space power conversion applications"

ADLINK Launches Its First COM Express Module with Intel® CoreTM Ultra 9 — Express-PTL Built on Intel® CoreTM Ultra Processors Series 3

12 Xe3 iGPU, 50 TOPS NPU, and Advanced CPU Architecture for Edge AI and General Embedded Systems — Industrial-Temperature SKUs Extended for Ruggedized Applications
January 9, 2026

Summary:

ASRock Industrial Unveils NUC(S) Ultra 300 BOX Series to Unlock Every Dimension of AI Performance

January 9, 2026

Taipei, Taiwan (Jan 6, 2026) – ASRock Industrial today announced the launch of its NUC(S) Ultra 300 BOX Series, powered by Intel® Core™ Ultra processors (Series 3). Built to unlock every dimension of AI performance, the new series takes compact computing to the next level, delivering up to 180 TOPS of AI inferencing power with up to 16 CPU cores, advanced Xe3 graphics, and NPU 5.0 for AI acceleration. Featuring up to dual 2.5G LAN, support for 8K quad displays, high-speed DDR5 7200 MHz memory, and Wi-Fi 7, the NUC(S) Ultra 300 BOX Series delivers exceptional responsiveness for AI-enhanced work environments, digital creation … Read More → "ASRock Industrial Unveils NUC(S) Ultra 300 BOX Series to Unlock Every Dimension of AI Performance"

STMicroelectronics scales STM32 microprocessors for cost-efficient, low-power, and flexible performance

January 9, 2026
  • New STM32MP21 MPUs with powerful processing engine and robust security architecture
  • New cost-effective STPMIC2L power-management companion chip designed for STM32MP2 series
  • Flexibility and performance for cost-aware industrial and IoT applications
  • STM32 development ecosystem with OpenSTLinux

 

Geneva, Switzerland, January 6, 2026 — STMicroelectronics has introduced STM32MP21 microprocessors (MPUs) for cost-aware edge applications in smart factories, smart homes, and smart cities, combining advanced cores and peripherals with strong security targeting SESIP Level 3 and PCI pre-certification.

Extending … Read More → "STMicroelectronics scales STM32 microprocessors for cost-efficient, low-power, and flexible performance"

featured blogs
Everything You Ever Wanted to Know About Gyroscopic Precession (But Were Too Afraid to Ask)
Jan 29, 2026
Most of the materials you read and see about gyroscopic precession explain WHAT happens, not WHY it happens....
More from Max's Cool Beans...