News – Page 7 – EEJournal

TDK announces TDK SensEI’s edgeRX™ platform is now powered by AWS to accelerate Industry 4.0 adoption

November 18, 2025

Integration of AWS IoT tools and secure cloud services into TDK SensEI’s edgeRX™ platform
Enhanced edge-to-cloud orchestration for intelligent, proactive industrial machine health
Real-time diagnostics, remote AI model deployment, and scalable industrial machine health monitoring
Available on AWS Marketplace with go-to-market support from AWS targeting industrial customers

November 18, 2025

TDK Corporation (TSE:6762) today announced that its subsidiary TDK SensEI … Read More → "TDK announces TDK SensEI’s edgeRX™ platform is now powered by AWS to accelerate Industry 4.0 adoption"

Penguin Solutions to Provide OriginAI Pre-Validated Cluster Architectures Featuring NVIDIA DGX B300 and NVIDIA RTX PRO 6000 GPUs

Integration of the latest NVIDIA GPUs delivers training and inference architectures for organizations to move from pilots to production

November 18, 2025

Fremont, Calif.– November 18, 2025 – Penguin Solutions, Inc. (“Penguin Solutions”) (Nasdaq: PENG), a leading provider of high-performance computing and AI infrastructure solutions, today announced support for the latest NVIDIA GPUs across its < … Read More → "Penguin Solutions to Provide OriginAI Pre-Validated Cluster Architectures Featuring NVIDIA DGX B300 and NVIDIA RTX PRO 6000 GPUs"

AMD Expands Space-Grade Portfolio, Enhances In-Orbit Processing Capability and Extends Mission Timelines

November 18, 2025

Samtec Releases Rugged, Multi-Port SMPM Interconnects with Threaded Coupling

November 18, 2025

New Albany, IN: Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new line of rugged, multi-port SMPM solutions that feature threaded coupling for high thermal shock and vibration environments commonly found in military, aerospace and communication applications. Samtec’s rugged, threaded-SMPM solutions provide high-frequency performance up to 65 GHz with excellent reliability in high-density applications.

SMPM multi-port mated sets with the new -S Screw option for threaded coupling are part of Samtec’s Read More → "Samtec Releases Rugged, Multi-Port SMPM Interconnects with Threaded Coupling"

lowRISC® and Partners to Deliver Commercial-Quality, Open-Source CHERI Secure Enclave with InnovateUK Support

COSMIC Project kicks off to provide a secure foundation for application-class SoCs, combining CHERI technology with formal verification and open-source design

November 17, 2025

CAMBRIDGE, UK – 12 November, 2025 – lowRISC CIC and Capabilities Limited are pleased to announce the launch of the COSMIC Project, led by lowRISC and backed by the UK Department for Science, Innovation and Technology (DSIT) and InnovateUK.

COSMIC aims to deliver the world’s first open-source, commercial-quality, CHERI-enabled, 64-bit application-class Secure Enclave design. This will provide CHERI memory safety and compartmentalisation, along with the … Read More → "lowRISC® and Partners to Deliver Commercial-Quality, Open-Source CHERI Secure Enclave with InnovateUK Support"

Infineon gallium nitride (GaN) technology powers next-generation IQ9 solar microinverters from Enphase Energy

November 17, 2025

Munich, Germany – 12 November 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that the company provides its groundbreaking gallium nitride (GaN) technology for the next-generation of solar microinverters from Enphase Energy, Inc. (ENPH), a global energy technology company and the world’s leading supplier of microinverter-based solar and battery systems. Infineon’s CoolGaN™ bi-directional switch (BDS) technology enables significant enhancements in power output, energy efficiency, and system reliability for Enphase’s IQ9 Series Microinverters. For the new Read More → "Infineon gallium nitride (GaN) technology powers next-generation IQ9 solar microinverters from Enphase Energy"

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces

Call for Workshop Submissions – Topics To Include New Materials, Process Technologies, Advanced Packaging Solutions, & Advanced Circuit Design Techniques

November 17, 2025

HONOLULU, HI (November 12, 2025) – The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits has announced a Call for Workshop topics in support of the conference theme: “Advancing the AI Frontier Through VLSI Innovation.” The topics and scope of the workshop sessions involve merging research with applications in areas that have not been covered in detail in previous Symposium technical programs and could serve as topics for future Symposium sessions. The workshop sessions will be held in person during the Symposium on Sunday, June 14, 2026, and presentation slides will be … Read More → "The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces"

3D-Micromac Introduces Next-Generation Laser Sample Preparation Platform for Whole Semiconductor Wafer and System-Level Failure Analysis

microPREP® L delivers unmatched sample size scalability, high throughput and precision, and automation-ready workflows for advanced semiconductor failure analysis

November 17, 2025

Overcoming Sample Preparation Bottlenecks

Sample preparation remains one of the most time-consuming and costly steps in semiconductor failure analysis. Traditional preparation methods like mechanical polishing and focused ion beam (FIB) milling cannot meet the stringent needs of today’s advanced applications. Mechanical polishing introduces mechanical stress to the specimen, which can affect the overall quality and yield. FIB milling is constrained by limited ablation rates, very small sample sizes, high tool operating costs, … Read More → "3D-Micromac Introduces Next-Generation Laser Sample Preparation Platform for Whole Semiconductor Wafer and System-Level Failure Analysis"

MinIO Unveils ExaPOD™, The Reference Architecture for Exascale AI

Designed in collaboration with Intel, Solidigm, and Supermicro, ExaPOD™ delivers the next-generation AI data foundation with industry-leading density, performance, and economics

November 17, 2025

REDWOOD CITY, Calif., November 13, 2025 — MinIO, the data foundation for Enterprise AI, today announced MinIO ExaPOD™, a modular reference architecture for building and operating exascale AI. Developed in collaboration with Intel, Solidigm, and Supermicro, ExaPOD is powered by MinIO AIStor – the Exascale Data Store for the AI Enterprise – and extends MinIO’s proven Read More → "MinIO Unveils ExaPOD™, The Reference Architecture for Exascale AI"

Molex Extends eHV High-Voltage Connector Portfolio to Ensure Safe, Reliable and Efficient Electrical Connections in Electric and Hybrid Vehicles

November 17, 2025

New eHV60 Connector suited for auxiliary high-voltage functions, including DC/DC converters, onboard chargers, electric compressors and e-axles in electric and hybrid vehicles
Designed to meet stringent industry standards while offering compact, efficient alternatives to legacy products for easier integration into space-constrained systems
Validated second-source options reduce supply chain risk while increasing sourcing flexibility, eliminating costly redesigns and accelerating time-to-market

LISLE, IL – November 12, 2025 – Read More →