Bringing a high-performance AI product to market usually takes years of grueling hardware development. Today, Grinn is working together with Renesas to change that narrative. Grinn announced a collaboration centered on the launch of the Grinn ReneSOM-V2H, a production-ready System-on-Module (SOM) that allows engineers to move directly from concept to application.
Grinn significantly lowers the barrier to entry for companies developing AI- and vision-enabled devices. Customers can shorten development cycles by up to 12 months, which is increasingly critical in today’s fast-moving technology landscape. Instead of investing extensive resources in processor bring-up, high-speed interface design, and system validation, developers can focus on their application and differentiation. The Grinn ReneSOM-V2H enables rapid prototyping and smooth transition to mass production, helping customers move from concept to deployed product faster and more efficiently.
“By combining Renesas processing technology with Grinn’s expertise in System-on-Module design, we have created the smallest solution of its kind.”, said Robert Otręba, CEO of Grinn. “This cooperation allows companies to adopt advanced AI and vision capabilities without the typical complexity associated with high-performance embedded platforms.”
Grinn selected the Renesas RZ/V2H processor as the foundation for this new product line due to its exceptional AI performance and versatility. Notably, the Grinn ReneSOM-V2H stands as the world’s smallest system-on-module based on the RZ/V2H processor.
The processor’s ability to handle up to four cameras simultaneously, combined with high-speed data throughput via USB 3.2 and PCIe Gen 3, makes it a powerhouse for vision-based systems. Furthermore, its industrial-grade temperature resilience ensures it can perform reliably in the most demanding environments.
“The Grinn ReneSOM-V2H is a pre-integrated compute module that includes the RZ/V2H MPU with a built-in AI accelerator, connectivity and key interfaces to power modern edge AI vision systems,” said Luca Bartolomeo, Vice President of Business Development, Solutions at Renesas. “The module has everything developers need to rapidly deploy a broad range of applications including smart cameras and industrial vision systems.”
Technical Overview: The Grinn ReneSOM-V2H
The ReneSOM-V2H is a remarkably compact (37mm x 42.6mm) yet powerful platform designed for intelligent edge applications. It integrates AI acceleration, advanced vision processing, and deterministic control into a single, industrial-grade module.
Key Specifications:
- Processing Power: RZ/V2H (4x Cortex-A55, 2x Cortex-R8, 1x Cortex-M33).
- AI Acceleration: Integrated DRP-AI3 delivering 8TOPS for real-time inference.
- High-Speed I/O: PCIe Gen3 (4-lane) and USB 3.2 (10Gbps) for maximum bandwidth.
- Vision Connectivity: 4x MIPI-CSI interfaces supporting multi-camera arrays.
- Form Factor: The world’s smallest RZ/V2H SOM; custom LGA design with 260-pin SO-DIMM compatibility.
- Operating Range: Rated for extreme industrial temperatures (-40°C to 85°C).
Target Applications: Built for real-world deployment, the ReneSOM-V2H is the ideal fit for Industrial Vision & Inspection, Robotics, Autonomous Systems, and Smart Infrastructure. By providing full LGA pin access, Grinn has simplified carrier board design, ensuring that time-to-market becomes a tangible competitive edge for their clients.
For more information regarding the ReneSOM-V2H and the Grinn-Renesas partnership, please visit grinn-global.com.
