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THine Introduces Standalone ISP and Firmware Development Tools to Stream Uncompressed 4K 30fps Video

June 8, 2021

TOKYO, June 9, 2021 / SANTA CLARA, CA, June 8, 2021 — THine Electronics, Inc. (Tokyo Stock Exchange/JASDAQ: 6769) and its fully owned USA subsidiary, THine Solutions, Inc., the leaders in high-speed serial interfaces and image signal processing, today introduced a new standalone Image Signal Processor (ISP), the THP7312-P, to support video streaming resolutions up to 4K 30 fps in YUV format.

The new THP7312-P supports all the features of our existing THP7312 but provides higher video streaming resolutions at higher frame rates. It also includes a RAW8 output option which is required to interface and collaborate with … Read More → "THine Introduces Standalone ISP and Firmware Development Tools to Stream Uncompressed 4K 30fps Video"

Maxim Integrated Announces Smallest and Most Accurate Isolated System-Monitoring Solution

MAX22530 replaces 5 components to shrink solution size by 40 percent and tightens accuracy by 50x to improve system uptime in automated distribution and sub-station applications
June 8, 2021

SAN JOSE, Calif.—June 8, 2021— Maxim Integrated Products, Inc. (NASDAQ: MXIM) today expands the MAXSafe™ Technology line with the MAX22530, an isolated, field-side self-powered 12-bit system monitor. Featuring 4 channels, the MAX22530 provides isolated system monitoring to improve accuracy 50x and to reduce solution size by 40 percent by integrating five components into a single IC.

Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 – Ideal for Industry 4.0

PCS2100 Station Modem Chipset Combines with PCS2500 Access Point to Form Complete Wi-Fi HaLow Network
June 8, 2021

SANTA CLARA, Calif., June 7, 2021 — Palma Ceia SemiDesign, a fabless semiconductor company specializing in wireless connectivity solutions, announced it has taped out two chips supporting the Wi-Fi HaLowTM connectivity protocol. The PCS2100 and PCS2500, new chips based on the IEEE 802.11ah wireless standard, complement each other to form a complete Wi-Fi HaLow network supporting multiple Internet of Things (IoT) devices.

“The PCS2100 and PCS2500 enable the long-range, low-power wireless connectivity required in fast-growing use cases enabled by Wi-Fi HaLow,” said Palma Ceia … Read More → "Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 – Ideal for Industry 4.0"

Kandou Unveils First Device in USB-C Multiprotocol Retimer Product Family for USB4

Only Commercially Available USB4 Retimer Solutions to Work Across All SoC Platforms
June 8, 2021

LAUSANNE, SWITZERLAND –– June 2, 2021 –– Kandou today unveiled the first product from the Matterhorn™ family of USB-C® multiprotocol retimer solutions with USB4™ support and the only commercially available USB4 retimer to work across all system-on-chip (SoC) platforms. 

Production silicon samples are available for KB8001, the first in the Matterhorn family of versatile retimers for host and device applications. It supports long reach with no compromise on signal integrity to give system designers more flexibility in system development and USB4 implementation. Improved … Read More → "Kandou Unveils First Device in USB-C Multiprotocol Retimer Product Family for USB4"

MicroSys Electronics introduces world’s first System-on-Module with the NXP S32G274A processor

Application-ready S32G2 automotive gateway platform for commercial vehicles, mobile machinery, and many other functional safety uses
June 8, 2021

Columbia, MD, 8 June , 2021 – MicroSys Electronics – in the USA represented by EUROTECH Inc. – announces the world’s first System-on-Module (SoM) with NXP Semiconductors S32G274A processor. The miriac MPX-S32G274A SoM comes with quad Arm Cortex-A53 cores plus triple Arm Cortex-M7 dual-cores and combines ASIL D safety and hardware security with more than 10 times the real-time performance and networking throughput of NXP’s previous automotive gateway devices[1]. The SoM offers multiple native CAN interfaces as well as comprehensive FlexRay, LIN and Ethernet support. Target markets … Read More → "MicroSys Electronics introduces world’s first System-on-Module with the NXP S32G274A processor"

SkyLab B.V. To Use Semtech’s LoRa Edge™ for New Prototyping Board

Operating on the LoRaWAN® standard, SkyLab B.V. prototyping board benefits from Semtech’s LoRa Edge™ platform to significantly reduce power consumption for both indoor and outdoor asset management applications
June 8, 2021

CAMARILLO, Calif., Jun. 8, 2021 – Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced that Read More → "SkyLab B.V. To Use Semtech’s LoRa Edge™ for New Prototyping Board"

Qualcomm Debuts Powerful Roster of Cutting-Edge IoT Solutions, Purpose-Built to Drive Global Digital Transformation Across Industries

Next-generation solutions deliver advanced Edge-AI performance, innovative power-efficiency, 5G connectivity capabilities and enhanced features for processing and security from entry level to premium tiers
June 8, 2021

The opportunity to connect the unconnected has never been more prevalent.  Qualcomm Technologies, Inc. is enabling an IoT ecosystem of 13,000+ IoT customers to date, helping to accelerate the digital transformation and development of connected products. Today, Qualcomm Technologies extends its support for the IoT ecosystem by introducing seven new solutions to help enable the proliferation of next-generation IoT devices: Qualcomm® QCS8250, Qualcomm® QCS6490/ QCM6490, Qualcomm® QCS4290/ QCM4290, and the Qualcomm® QCS2290/ QCM2290.

These solutions range from entry-level to premium tier to expand access to a variety of industrial and commercial applications. These latest IoT solutions from Qualcomm … Read More → "Qualcomm Debuts Powerful Roster of Cutting-Edge IoT Solutions, Purpose-Built to Drive Global Digital Transformation Across Industries"

Keysight’s Open RAN Studio Selected by Kyocera for Radio Units Validation in Compliance to O-RAN Specifications

Keysight’s Open RAN Studio software enables global information and communications technology company to accelerate development of O-RUs
June 8, 2021

SANTA ROSA, Calif. June 8, 2021 

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that Kyocera Corporation has selected Read More → "Keysight’s Open RAN Studio Selected by Kyocera for Radio Units Validation in Compliance to O-RAN Specifications"

Microchip Further Protects FPGA-based Designs with First Tool that Combats Major Industry Threat to System Security in the Field

Builds on its FPGA family’s best-in-class security to block the theft of data, intellectual property and other private information from deployed systems
June 7, 2021

CHANDLER, Ariz., June 1, 2021 — Mission-critical and other high-assurance systems deployed worldwide are under rapidly evolving threats from cybercriminals who attempt to extract Critical Program Information (CPI) via the FPGAs that power them. Microchip Technology Inc. (Nasdaq: MCHP) today announced it has extended its FPGA family’s security with the DesignShield development tool that further helps prevent this information from being extracted for malicious purposes.

“As a leader in the security space, Microchip offers a portfolio featuring the latest countermeasures for reducing the risk of cloning, intellectual property theft, reverse engineering, or the insertion of … Read More → "Microchip Further Protects FPGA-based Designs with First Tool that Combats Major Industry Threat to System Security in the Field"

Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry’s First 176-Layer NAND and 1-Alpha DRAM

Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices
June 7, 2021

TAIPEI, Taiwan, June 01, 2021 (GLOBE NEWSWIRE) — Computex — Micron Technology, Inc. (Nasdaq: MU), today unveiled memory and storage innovations across its portfolio based on its industry-leading 176-layer NAND and 1α (1-alpha) DRAM technology, as well as the industry’s first Universal Flash Storage (UFS) 3.1 solution for automotive applications. The new portfolio additions deliver on the company’s vision of accelerating data-driven insights through innovations in memory and storage that enable new capabilities from the data center to the intelligent edge. Micron President and CEO Sanjay Mehrotra made the announcements during a Computex keynote, in which he shared a sweeping vision for computing … Read More → "Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry’s First 176-Layer NAND and 1-Alpha DRAM"

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