News – Page 678 – EEJournal

element14 Introduces the Low Power IoT Design Challenge with Infineon Technology

Community members are invited to use Infineon Technology to build a low-power IoT device that enhances industrial design

July 12, 2021

Chicago – June 30, 2021: The element14 Community, an Avnet Community, today introduced its Low Power IoT Design Challenge in partnership with Infineon Technologies. The challenge encourages element14 Community members to utilize Infineon Technology kits to build low-power IoT devices that enhance industrial design.

There are several industrial design applications that can benefit from a lower power and easier to use embedded solutions, ultimately saving companies time, money, and operational bandwidth for optimized system power. Dedicated to improving industrial design through efficient IoT applications, Infineon Technologies provides users with the optimal hardware and platform to build … Read More → "element14 Introduces the Low Power IoT Design Challenge with Infineon Technology"

DVCon U.S. 2022 Announces Call for Extended Abstracts

34th annual conference and exhibition to be held in-person

July 12, 2021

GAINESVILLE, Fla., July 12, 2021 (GLOBE NEWSWIRE) — The 2022 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals. The submission site for extended abstracts will be open July 12 through August 13, 2021. Read More → "DVCon U.S. 2022 Announces Call for Extended Abstracts"

element14 Community Launches ‘Summer of FPGAs’

Summer of workshops, trainings, webinars, product testing and giveaways will help community members gain expertise in essential components.

July 12, 2021

element14, an Avnet community, is providing educational enrichment and skills-building opportunities for engineers all summer long with its ‘Summer of FPGAs’.

FPGAs are synonymous with artificial Intelligence, high performance computing, embedded vision, automated vehicles and the 5G transformation. element14 is making them a main focus this summer to help community members be ready to work with FPGAs in the future and … Read More → "element14 Community Launches ‘Summer of FPGAs’"

SEGGER and Analog Devices Collaboration Delivers Communication Solution for Industrial Ethernet-APL

July 12, 2021

Monheim am Rhein, Germany – 12th July 2021

SEGGER Microcontroller GmbH, a leading provider of development tools and software for embedded systems, today announced a collaboration with Analog Devices, Inc., a leading global high-performance semiconductor company that provides embedded engineers with a new solution for the development of industrial Ethernet applications including the new Ethernet-APL standard.

The collaboration between the two companies revolves around emNet, SEGGER’s IP stack, and the ADIN1110, Analog Devices’ robust, low-power industrial 10BASE-T1L Ethernet MAC-PHY device. The combination of emNet and ADIN1110 enables applications with minimum energy consumption, fast transmission rates, … Read More → "SEGGER and Analog Devices Collaboration Delivers Communication Solution for Industrial Ethernet-APL"

Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension

Imperas simulation technology and RISC-V reference models updated to cover the RISC-V P Extension for SoC architecture exploration and early software development

July 12, 2021

Oxford, United Kingdom, July 12th, 2021 — Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced that Andes Technology Corp., a leading supplier of performance-efficient and extensible 32/64-bit RISC-V CPU cores and a Founding Premier member of the RISC-V International Association, has certified the Imperas reference models for the complete range of Andes IP cores with the new RISC-V P extension. Developers can now … Read More → "Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension"

Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment

Global Distributor Examines the Ever-Changing Frontier of AI

July 12, 2021

July 12, 2021 – Mouser Electronics Inc. today releases the Read More → "Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment"

Isolated Buck Converters from STMicroelectronics Reduce Bill-of-Materials Costs in Automotive and Industrial Applications

July 12, 2021

Geneva, July 8, 2021 – Optimized for isolated buck regulator designs, the STMicroelectronics A6986I and Read More → "Isolated Buck Converters from STMicroelectronics Reduce Bill-of-Materials Costs in Automotive and Industrial Applications"

3D Stacking Paves Way for Smaller, Power-Packed Computing Chips

July 12, 2021

SINGAPORE, 09 July 2021 – Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed breakthrough technology that can stack up to four layers of wafers, potentially decreasing the cost of production by 50 per cent.

DEFYING LIMITATIONS TO MOORE’S LAW

Computing performance is struggling to keep up with the relentless drive for higher-performing chips, as performance bottlenecks have emerged with scaling reaching the limit on all fronts. One way to extend Moore’s Law is through heterogeneous integration, which can … Read More → "3D Stacking Paves Way for Smaller, Power-Packed Computing Chips"

Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems

July 12, 2021

TAICHUNG, Taiwan and YOKOHAMA, Japan– 2021-07-08 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM™ and SpiStack^® (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm^®-based microprocessors (MPUs). Customers of the RZ/A2M can benefit from Winbond’s long-term supply for various types of external memory, including DRAM, NOR Flash, and NAND Flash which are currently the mainstream of embedded systems.

Renesas’ RZ/A2M is suitable for Human Machine Interface (HMI), especially HMI applications with cameras. It … Read More → "Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems"

Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment

Global Distributor Examines the Ever-Changing Frontier of AI

July 9, 2021

July 7, 2021 – Mouser Electronics Inc. today releases the third installment of the 2021 series of its award-winning Empowering Innovation Together™ program. The series’ third installment dives deep into artificial intelligence (AI) through an engaging collection of video, long-form articles, blog and infographic content.

Embedded electronics systems have continued to evolve alongside the development of machine-learning algorithms. Their union is giving rise to the concept of … Read More → "Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment"