News – Page 677 – EEJournal

element14 Presents celebrates its 500th Episode and announces Winners of the Build Inside the Box Challenge

July 14, 2021

element14, an Avnet community, today announced the winners of the recent Build Inside the Box Challenge, designed to celebrate the element14 Presents 500^th episode.

‘Build Inside the Box’ contestants participated in a competition that looked similar to Food Network’s ‘Chopped,’ a cooking challenge in … Read More → "element14 Presents celebrates its 500th Episode and announces Winners of the Build Inside the Box Challenge"

AVX Launches new 3-D Interactive Interconnect Application

Available on the AVX website, the new 3-D interactive interconnect application provides users with several different intuitive ways to access a comprehensive and visually engaging suite of product information, including application examples extending across seven market segments; interactive, animated, and annotated digital, 3-D product renderings; and relevant product pages, datasheets, and catalogs.

July 14, 2021

FOUNTAIN INN, S.C. (July 14, 2021) – Read More → "AVX Launches new 3-D Interactive Interconnect Application"

Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release

New standard to identify security concerns for IP providers

July 14, 2021

Elk Grove, Calif., July 14, 2021 — Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards, announced today that its Board of Directors has approved the Security Annotation for Electronic Design Integration (SA-EDI) Standard 1.0 for release. Developed by the IP Security Assurance (IPSA) Working Group, the new standard is available for immediate download at … Read More → "Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release"

Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT

July 13, 2021

SANTA ROSA, Calif. July 13, 2021 — Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that DEKRA, a global test organization, has selected Keysight’s 5G and internet of things (IoT) test solutions to expand 5G new radio (NR), … Read More → "Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards"

Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs

July 13, 2021

SAN JOSE, Calif. and HSINCHU, Taiwan, July 13, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) and United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) (“UMC”), a global semiconductor foundry, today announced that the Cadence digital full flow has been optimized and certified for the UMC 22ULP/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, enables mutual customers to deliver top-quality designs and achieve a faster path to tapeout. To learn more about the Cadence digital advanced-node solutions, please visit Read More → "Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs"

Ultra Librarian Partners with Vishay to Provide FREE 3D Vishay CAD Models for Download from UltraLibrarian.com

July 13, 2021

Rochester, NY (July 13, 2021)—Ultra Librarian®, (ultralibrarian.com) the world’s largest free cloud-based CAD library provider, today announced its partnership with Vishay Intertechnology, Inc. to provide free symbols, footprints, and 3D models for download from Read More → "Ultra Librarian Partners with Vishay to Provide FREE 3D Vishay CAD Models for Download from UltraLibrarian.com"

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

July 13, 2021

LAKE OSWEGO, Ore. — July 13, 2021 — CUI Devices’ Interconnect Group today announced the continued expansion of their power-only USB Type C … Read More → "60 W Power-Only USB Type C Receptacle Features Vertical Orientation"

Linaro brings standardization to edge device firmware through the Trusted Substrate Project

Linaro Ltd, the open source collaborative engineering organization developing software for the Arm® ecosystem, today announced the availability of a white paper on the importance of standardized firmware and its efforts to do so.

July 13, 2021

Cambridge, United Kingdom, July 13, 2021 /WebWire/ – Linaro has a track record of bringing Arm vendors together on the Linux kernel and is currently extending this to firmware with the Trusted Substrate Project. Read More → "Linaro brings standardization to edge device firmware through the Trusted Substrate Project"

IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications

Now adopted as IEEE 2977-2021, MIPI A-PHY delivers high performance, reliability and noise immunity for ADAS, ADS, IVI and other automotive applications

July 13, 2021

PISCATAWAY, N.J., July 13, 2021—The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the adoption of the MIPI A-PHY v1.0 specification as an IEEE standard. Published as IEEE 2977-2021, … Read More → "IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications"

VadaTech Announces a High-Speed High-Density FMC with Single DAC and 8 ADC

July 13, 2021

Henderson, NV – July 12, 2021 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the FMC255. The FMC255 is a high-density ADC/DAC module with two LTC2107 that each provide a single channel ADC, 16-bit at 210 MSPS, dual AD9653 for total of … Read More → "VadaTech Announces a High-Speed High-Density FMC with Single DAC and 8 ADC"