NEWS HIGHLIGHTS
- Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond.
- Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery.
- Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct.
- … Read More → "Intel Accelerates Process and Packaging Innovations"

