SAN DIEGO — For customers designing electronics, accessing the right software and tools to get the job done is paramount. Nexar, launched by Altium in April 2021, is a partner platform designed to connect printed circuit board (PCB) designers and their companies with the software, suppliers, and manufacturers who help them to turn … Read More → "Sintecs Joins Altium’s Nexar Ecosystem"
ZURICH and SAN FRANCISCO – July 28, 2021 – RISC-V International and the Read More → "The 2021 RISC-V Summit to Co-Locate with the 58th Design Automation Conference (DAC) in San Francisco"
Concurrent Technologies launches a new 3U VPX Plug in Card (PIC) designed in alignment with the SOSA™ Technical Standard. This new I/O intensive processor is targeted for use in a variety of Situational Awareness and Intelligence, Surveillance and Reconnaissance (ISR) applications that need a combination of general-purpose processing augmented with image processing and Artificial Intelligence (AI) acceleration.
TR K9x/6sd-RCx is based on an 11th Gen Intel® Core™ Processor which has up to 4 CPU cores mated with 16 Gbytes of soldered DDR4 DRAM with … Read More → "Concurrent Technologies Launches New Rugged 3U VPX I/O Intensive Plug In Card"
TOKYO, Japan, and Irvine, Calif., July 28, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Syntiant Corp., a deep learning chip technology company advancing low-power intelligent voice and sensor processing in edge devices, today announced the joint development of a voice-controlled multimodal AI solution that enables low-power contactless operation for image processing in vision AI-based IoT and edge systems, such as self-checkout machines, security cameras, and video conference systems, and smart appliances such as robotic cleaning devices.
The new solution combines the Renesas RZ/V Series vision AI microprocessor unit (MPU) and the low-power … Read More → "Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution Combining Advanced Vision and Voice Technologies"
SANTA CLARA, CALIF. – JULY 27, 2021 – Greenliant is now sampling SATA M.2 2242 ArmourDrive™ PX Series solid state drives (SSDs) that support 5K program-erase (P/E) cycles and advanced EX series SSDs with superior data retention and high endurance that support 60K, 120K and industry-leading 300K P/E cycles. SATA M.2 2242 ArmourDrive SSDs operate at industrial temperatures (-40 to +85 degrees Celsius) and are rigorously tested for shock and vibration to withstand the most extreme environments. See SATA M.2 ArmourDrive product information at Read More → "Greenliant Samples Ultra-High Endurance Industrial SATA M.2 SSDs"
IRVINE, Calif., July 28, 2021 (GLOBE NEWSWIRE) — Mobix Labs Inc., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, today introduced its MBX10 True5G™ mmWave beamformer AIP (antenna-in-package) and its MIC600 single-chip, single-die beamformer IC (integrated circuit) that deliver ultra-wideband performance from 24.25 – 43.5 GHz.
The MBX10 is a complete 16-channel RF front-end which includes all power amplifiers, low noise amplifiers, phase shifters, variable gain amplifiers, switches, and matching circuits with an integrated 2×2 antenna in package (7.5mm x 7.5mm x 1.8mm) that provides unprecedented levels of integration and scalability in a cost-effective, Bulk CMOS-based solution.
“ … Read More → "Mobix Labs Introduces Ultra-Wideband mmWave 5G Beamformer"
GAINESVILLE, Fla., July 28, 2021 (GLOBE NEWSWIRE) — The 2022 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for panel, short workshop, and tutorial proposals. Read More → "DVCon U.S. 2022 Announces Call for Panel, Short Workshop and Tutorial Proposals"
Nijmegen, July 27 2021: Nexperia, the expert in essential semiconductors, today announced the world’s smallest and lowest profile 14,16, 20 and 24 pin packages for standard logic devices. For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. Not only has it a smaller footprint compared to competitors, but the new package also offers a 25% saving in PCB area.
Measuring just 2 … Read More → "World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins"
LAKE OSWEGO, Ore. — July 27, 2021 — CUI Devices’ Interconnect Group today announced the addition of modular connectors to its Read More → "CUI Devices Adds Modular Connectors Line to Connectors Portfolio"
Heidelberg, Germany – July 27, 2021 – InnovationLab, the expert in printed electronics “from lab to fab”, today announced that it has been working with Trelleborg Sealing Solutions to integrate its printed sensors into an innovative logistics application. Trelleborg’s IntelliStok® inventory management … Read More → "InnovationLab and Trelleborg develop an innovative logistics system based on printed sensors"
