News – Page 625 – EEJournal

CEVA SensPro™ Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)

Functional safety-certified DSP and comprehensive software development kit is ideal for the development of low power automotive sensor fusion SoCs to process and fuse data from cameras, radar, lidar and more for autonomous driving and advanced driver assistance systems (ADAS) applications

November 23, 2021

ROCKVILLE, MD, November 23, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that its SensPro™ sensor hub DSP IP has achieved Automotive Safety Integrity Level B random fault and ASIL D systemic fault-compliant certification. SensPro has already been licensed by multiple leading automotive semiconductor players for next-generation automotive SoCs. As an automotive IP supplier, the SensPro safety certification reflects the company’s commitment to a safety-focused design methodology for its processors, tools and software targeting automotive applications.

The ISO 26262-compliant functional safety standard’s ASIL certification … Read More → "CEVA SensPro™ Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)"

STMicroelectronics Expands Connectivity for Smart-Metering Applications with FCC Certification of G3-PLC Hybrid Chipset

November 23, 2021

Geneva, November 23, 2021 – STMicroelectronics has extended the certification of its ST8500 G3-PLC (Power-Line Communication) Hybrid communication chipset, now covering the US FCC (Federal Communications Commission) band plan from 10kHz to 490kHz, in addition to the CENELEC-A 9kHz-95kHz European band. The move enables higher data rates, enhances design flexibility, and eases … Read More → "STMicroelectronics Expands Connectivity for Smart-Metering Applications with FCC Certification of G3-PLC Hybrid Chipset"

Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire® RISC-V® SoC FPGA for Embedded Vision Applications at the Edge

Platform extends customer options for designing secure and reliable systems in applications ranging from neural network inferencing to Industrial Internet of Things (IIoT) and factory automation

November 23, 2021

CHANDLER, Ariz., Nov. 23, 2021 – Microchip Technology (Nasdaq: MCHP) today announced the second development tool offering in its Smart Embedded Vision initiative for designers using its PolarFire^® RISC-V System on Chip (SoC) Field Programmable Gate Array (FPGA). The industry’s lowest-power SoC FPGA in its class, the PolarFire device is the only mid-range device of its kind that simultaneously supports … Read More → "Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire® RISC-V® SoC FPGA for Embedded Vision Applications at the Edge"

RTI Accelerates Autonomous and Electric Vehicle Innovation with First Data-Centric Software Framework with Functional Safety Certification

RTI Achieves 64% Automotive CAGR Over the Past Three Years

November 22, 2021

SUNNYVALE, Calif.– November 18, 2021 – Real-Time Innovations (RTI), the largest software framework company for autonomous systems, today announced at the RTI Automotive Forum that … Read More → "RTI Accelerates Autonomous and Electric Vehicle Innovation with First Data-Centric Software Framework with Functional Safety Certification"

LDRA tool suite provides software assurance for mission-critical systems powered by NXP S32K3 MCUs

Helps improve code quality, safety, and security while reducing development and certification costs

November 22, 2021

BOSTON—November 18, 2021—Read More → "LDRA tool suite provides software assurance for mission-critical systems powered by NXP S32K3 MCUs"

DDC-I Announces Deos Multicore Platform for Jacinto 7 Developers Targeting High Assurance Aerospace Market

November 22, 2021

Phoenix, AZ – November 17, 2021 – DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, today announced that it will port its Deos DO-178C safety-critical real-time operating system to Texas Instruments’ Jacinto™ 7 family of processors. Jacinto 7 processors running Deos™ provide an ideal platform for developing, deploying and certifying DO-178C avionics software with the most demanding I/O, networking, and control requirements.

The Jacinto 7 processor family features a heterogeneous architecture optimized for control node and intelligent sensor applications. Featuring Arm® Cortex®-A72 cores and a mix of … Read More → "DDC-I Announces Deos Multicore Platform for Jacinto 7 Developers Targeting High Assurance Aerospace Market"

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%

The comprehensive product range covers every application from 1.8 V to 75 V

November 22, 2021

Nijmegen, November 17, 2021: Nexperia, the expert in essential semiconductors, today announced the industry’s first range of A-selection Zener diodes. With a tolerance of just ±1%, the BZT52H-A (SOD123F) and BZX384-A (SOD323) series provide a higher precision voltage reference compared to the B (±2%) and C (±5%) variants. Matching the rising demands of mobile, portable/wearable, automotive and industrial applications and meeting the increasing regulatory requirements, the two series … Read More → "Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%"

Synopsys 3DIC Compiler Qualified for Samsung Foundry’s Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs

Mutual Customers Gain Full Exploration-to-Signoff 3DIC Solution to Manage Complexity of Hundreds of Billions of Transistors

November 22, 2021

MOUNTAIN VIEW, Calif., Nov. 17, 2021 /PRNewswire/ —

Highlights:

Single, unified 3DIC platform enables system-driven PPA per cubic mm silicon optimization
Synopsys and Samsung Foundry are fostering advanced-node and multi-die packaging innovation and productivity for in-demand applications such as HPC, AI, automotive and 5G

To strengthen innovation of complex SoCs for compute-intensive applications such as high-performance computing, … Read More → "Synopsys 3DIC Compiler Qualified for Samsung Foundry’s Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs"

Vishay Intertechnology Continues to Offer Competitive Lead Times for IHLP® Low Profile, High Current Inductors

Available in Case Sizes From 1212 to 8787, Devices Are Available With Lead Times of 10 to 16 Weeks

November 22, 2021

MALVERN, Pa., Nov. 18, 2021 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the lead times for its IHLP^® low profile, high current inductors remain stable and competitive at 10 to 16 weeks. As a result of improved productivity and a capacity expansion, the company is presently experiencing no shortages for its IHLP products. And with Vishay’s continued efforts to expand capacity, the company doesn’t foresee any issues in supplying its customers with the devices for the balance of 2021 and into 2022 and beyond.

Available in 10 case sizes ranging from 1212 to 8787, Vishay’s IHLP … Read More → "Vishay Intertechnology Continues to Offer Competitive Lead Times for IHLP® Low Profile, High Current Inductors"

Percepio Brings Big Debugging Boost for Microsoft Azure RTOS ThreadX Developers

November 22, 2021

New streaming support for Azure RTOS ThreadX enables live visualization and capture of longer software traces
Enhanced DevAlert integration with added Azure cloud support provides observability of IoT devices in the field

Västerås, Sweden, 17 November 2021 * * * Percepio^®, a leader in visual trace diagnostics for embedded systems and the Internet of Things (IoT), today announced improved support … Read More → "Percepio Brings Big Debugging Boost for Microsoft Azure RTOS ThreadX Developers"