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Ansys Collaborates with Microsoft to Drive Innovation Forward with Chip Development, Simulation, and Cloud Computing

  • Ansys Cloud will automatically upgrade to offer the AMD EPYC 7003 Series processors with AMD 3D V-Cache technology today
  • 3rd Gen AMD EPYC processors with AMD 3D V-Cache use 3D stacking technology to provide fantastic performance for technical computing workloads

PITTSBURGH, PA, March 21, 2022 – Ansys (NASDAQ: ANSS) customers will have automatic cloud access to the latest 3rd … Read More → "Ansys Collaborates with Microsoft to Drive Innovation Forward with Chip Development, Simulation, and Cloud Computing"

Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

Munich, Germany – 21 March, 2022 – Megatrends like digitalization, urbanization, and electromobility lead to increased power consumption. At the same time, energy efficiency is getting more and more important. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) responds to these megatrends and resulting demands by offering a new family of CoolSiC™ 650 V silicon carbide (SiC) MOSFETs to deliver reliable, easy-to-use, and cost-effective top performance. The devices build on Infineon’s state-of-the-art SiC trench technology and come in a compact D 2PAK SMD 7-pin package with .XT interconnection technology. They target high power applications including Read More → "Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation"

STXI Motion Will Showcase Cutting-Edge Low-Voltage Mobile Motion Platforms for AGVs, AMRs, and Shuttle Systems at MODEX 2022

PETACH TIKVA, Israel — March 17, 2022 — STXI Motion, a global motion control and servo solution company, will present a variety of low-voltage mobile motion platform solutions intended for autonomous mobile robots (AMRs), automated guided vehicles (AGVs), and shuttle system deployment at MODEX 2022, held March 28–31 in Atlanta, Georgia.

Headache-Free AGV Motion Solutions, Optimized for Your Needs 

STXI Motion … Read More → "STXI Motion Will Showcase Cutting-Edge Low-Voltage Mobile Motion Platforms for AGVs, AMRs, and Shuttle Systems at MODEX 2022"

NXP and Hitachi Energy Collaborate on Power Module to Accelerate Silicon Carbide Adoption in E-mobility

What’s new: NXP® Semiconductors has announced a collaboration with Hitachi Energy to accelerate the adoption of silicon carbide (SiC) power semiconductor modules in e-mobility. The project aims to provide more efficient, reliable and functionally safe SiC MOSFET-based solutions for powertrain inverters comprised of NXPs advanced, high-performance GD3160 isolated HV Gate Drivers and Hitachi Energy’s RoadPak automotive SiC MOSFET power modules.</ … Read More → "NXP and Hitachi Energy Collaborate on Power Module to Accelerate Silicon Carbide Adoption in E-mobility"

Pusan National University Researchers Develop “Corrosion-Free” Copper Thin Films

Copper is the most commonly used metal in the electronics industry but its life is limited by unwanted corrosion i.e., oxidation on copper surfaces. Now, scientists from Pusan National University, Sungkyunkwan University, and Mississippi State University, have developed a new method to fabricate atomically flat single-crystal copper thin films with semi-permanent oxidation-resistance, as well as revealed the mechanism behind the oxidation of copper.
Copper (Cu) is of fundamental importance to our daily lives due to its excellent electrical conductivity, as well as other valuable physical properties, such as the ability to draw copper into … Read More → "Pusan National University Researchers Develop “Corrosion-Free” Copper Thin Films"

Microchip Unveils Industry-Leading 3.3 kV Silicon Carbide (SiC) Power Devices Enabling New Levels of Efficiency and Reliability

CHANDLER, Ariz., March 21, 2022 (GLOBE NEWSWIRE) — System designers of traction power units (TPUs), auxiliary power units (APUs), solid-state transformers (SSTs), industrial motor drives and energy infrastructure solutions require high-voltage switching technology to increase efficiency, reduce system size and weight and enhance reliability. Microchip Technology Inc. (Nasdaq: MCHP) today announced the expansion of its SiC portfolio with the release of the industry’s Read More → "Microchip Unveils Industry-Leading 3.3 kV Silicon Carbide (SiC) Power Devices Enabling New Levels of Efficiency and Reliability"

Anritsu Introduces Rack Mount Remote Spectrum Monitors with Frequencies Up To 43.5 GHz

Morgan Hill, CA – March 1, 2022 – Anritsu Company introduces the MS27201A Remote Spectrum Monitor series that includes the industry’s first remote spectrum monitor that covers 43.5 GHz to support new satellite downlink bands. Combining high RF performance with supporting PC software, the MS27201A series delivers a unique package for long-term monitoring in a variety of commercial and regulatory environments.

The MS27201A series includes 9 GHz and 20 GHz remote spectrum monitors, in addition to the 43.5 GHz model. A wide 110 MHz measurement bandwidth to support common satellite downlink spans complements the 43.5 GHz model. With a displayed average noise level ( … Read More → "Anritsu Introduces Rack Mount Remote Spectrum Monitors with Frequencies Up To 43.5 GHz"

Moxa Unveils Next-Generation Networking Switches to Help Futureproof Industrial Automation

BREA, CA, MARCH 16, 2022 — Moxa Inc., a leader in industrial communications and networking, announced the launch of its next-generation industrial Ethernet switches, the EDS-4000/G4000 Series. The new Series includes 68 models that will help Moxa’s customers build futureproof industrial networks to strengthen operational resilience in industrial sectors such as power, transportation, maritime, and factory automation.

TDK announces new ultra-low profile µPOL™ DC-DC converters

• Advanced ultra-low profile packaging and 3D technology are key drivers for next-generation high performance energy efficient designs
• High-density solution for space-constrained applications requiring a low-profile power source
• Scalable and highly configurable with multi-time programmable memory, offering a wide range of flexibility using Digital Communication (I2C and PMBUS)
• Premiering at APEC 2022 in Houston, TX, March 20-24, TDK booth #814

March 17, 2022

TDK Corporation (TSE:6762) announces the availability of FS1412 microPOL (μPOL™) power module. At 5.8. mm x 4.9 mm x 1.6 mm, the FS1412 is part of a new series of µPOL™ DC-DC converters with increased performance, … Read More → "TDK announces new ultra-low profile µPOL™ DC-DC converters"

Wind River Studio Addresses Challenges of Managing Secure Linux-Based Intelligent Systems

NEWS HIGHLIGHTS
  • Wind River eases costly management challenges typical of embedded Linux platforms for the full lifecycle.
  • New managed services help teams achieve and maintain Linux platform stability, quality, and security, freeing resources to continue innovation and feature development.
  • Wind River experts assess, recommend, and implement solutions aligned with functional, architecture, and performance requirements.
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