industry news archive
Subscribe Now

Andes and IAR Systems enable leading automotive-focused IC design companies to accelerate time to market

Hsinchu, Taiwan, and Uppsala, Sweden—March 22, 2022—Andes Technology (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, and IAR Systems®, the world leader in software and services for embedded development, together announced that leading IC design companies from Europe and Asia have adopted AndesCore™ RISC-V automotive CPU IP and IAR Systems’ functional safety certified development tools for RISC-V. The joint solutions from Andes and IAR Systems have robust design methodology according to ISO 26262, accelerating time to market for customers by … Read More → "Andes and IAR Systems enable leading automotive-focused IC design companies to accelerate time to market"

TDK offers chip varistor for automotive application Ethernet with strong ESD resistance

• Compact, low capacitance and tight tolerance
• Reliable ESD protection up to 25 kV (IEC61000-4-2)
• Compliant with OPEN Alliance 100BASE-T1 ESD Device Spec ver.2.0
• High operating temperatures up to 150 °C

March 22, 2022

TDK Corporation (TSE:6762) expands its product lineup with a new chip varistor, type AVRH10C101KT4R7YA8, for automotive application Ethernet with strong resistance to ESD. Mass production will begin in March 2022.

Utilizing high-precision multilayer technology and optimizing the manufacturing process and process design, the product implements a tight tolerance of 4.7 ± 0.57 pF in the capacitance range and strong … Read More → "TDK offers chip varistor for automotive application Ethernet with strong ESD resistance"

CEA-Leti Scientist, Elisa Vianello, Receives €3 Million ERC Grant To Develop Nanoscale Memories Inspired by Insect Nervous Systems

GRENOBLE, France – March 22, 2021 – CEA-Leti today announced that Elisa Vianello, senior scientist and Edge AI program coordinator, has received a €3 million grant from the European Research Council (ERC) to build nanoscale memory devices inspired by insect nervous systems for such applications as consumer robotics, implantable medical diagnostic microchips and wearable electronics.

The artificial intelligence (AI) community recently has proposed powerful algorithms that will enable machines to learn from experience and interact autonomously with the environment. Fruit-picking robots and robots that rescue people from collapsed buildings are two potential examples of such machines.

Read More → "CEA-Leti Scientist, Elisa Vianello, Receives €3 Million ERC Grant To Develop Nanoscale Memories Inspired by Insect Nervous Systems"

NVIDIA Introduces Grace CPU Superchip

SANTA CLARA, Calif., March 22, 2022 (GLOBE NEWSWIRE) — GTC—NVIDIA today announced its first Arm® Neoverse™-based discrete data center CPU designed for AI infrastructure and high performance computing, providing the highest performance and twice the memory bandwidth and energy-efficiency compared to today’s leading server chips.

The NVIDIA Grace™ CPU Superchip</ … Read More → "NVIDIA Introduces Grace CPU Superchip"

Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part

TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the W25Q64NE, a 1.2V SpiFlash® NOR Flash IC in a 64Mb density which offers the large code storage capacity and active mode power savings needed by the latest generation of smart wearable and mobile devices.

Winbond was the first Flash memory manufacturer to introduce a 1.2V SPI NOR Flash device, which operates over an extended 1.14V-1.6V supply-voltage range for compatibility with a single alkaline AA battery cell’s output-voltage profile. By extending the 1.2 … Read More → "Winbond extends code storage capacity of its ultra-low power 1.2V SPI NOR Flash family with launch of new 64Mb part"

PLS’ UDE supports Renesas RH850/U2A automotive MCU with cluster multicore debug capabilities

Lauta (Germany), March 16, 2022 – With the latest version of the Universal Debug Engine® (UDE), PLS Programmierbare Logik & Systeme now also provides developers with extensive functions for multicore debugging of the RH850/U2A Automotive MCU from Renesas.

The high-performance microcontroller, designed as a cross-domain controller and equipped with up to 16 MByte flash memory and 3.6 MByte SRAM, allows the integration of multiple applications into a single chip. At the same time, it meets the highest demands in terms of functional safety and cyber security. With up to four cores, each clocked at 400 MHz and with the option to … Read More → "PLS’ UDE supports Renesas RH850/U2A automotive MCU with cluster multicore debug capabilities"

onsemi Unveils New High Power Totem Pole PFC Controller Meeting Challenging Efficiency Standard

PHOENIX – March 21, 2022 – onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, introduced its latest mixed-signal controller dedicated to bridgeless totem pole PFC (TP PFC) topology. The Read More → "onsemi Unveils New High Power Totem Pole PFC Controller Meeting Challenging Efficiency Standard"

Saelig Introduces Affordable Low Compliance Voltage OR-01 OhmRanger-LCV™ Ohmmeter

Fairport, NY: Saelig Company, Inc has introduced the AltoNovus OR-01 OhmRanger-LCV™ Low Compliance Voltage Ohmmeter, an accurate, affordable, portable meter which can measure a wide range of resistances simply and quickly. Individually factory-calibrated, this meter measures resistances from greater than 100Mohms down to 10 Ohms. Additional built-in features include a signal-to-noise measurement, which indicates how much noise, variation, and AC elements are in the signal, as well as maximum and minimum current samples during the reading. Higher resistances (lower currents) are more susceptible to noise errors.

Next-generation EiceDRIVER™ 2EDN gate driver ICs set a new benchmark for form-factor, faster UVLO reaction and active output clamping

Munich, Germany – 18 March, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) releases a new EiceDRIVER™ 2EDN product family. Aiming at space-limited designs, the next-generation devices complement the existing 2EDN driver ICs by providing higher system-level efficiencies, excellent power density, and consistent system robustness with fewer external components. Building upon this expansion, the 2EDN family is now able to drive the power switch device performance in applications such as servers, Read More → "Next-generation EiceDRIVER™ 2EDN gate driver ICs set a new benchmark for form-factor, faster UVLO reaction and active output clamping"

TDK offers PCM120T shielded SMT power inductors with saturation currents of up to 80 A

March 18, 2022 — TDK Corporation (TSE: 6762) introduces the new PCM120T series of shielded SMT power inductors, optimized for high saturation currents and low DC resistances. The PCM120T product family includes 14 inductance values between 0.4 µH and 10 µH, whereby saturation currents of up to 80 A are reached depending on the L value. Optimal saturation properties are achieved through the use of an iron alloy core. Flat wire windings are used to keep losses as low as possible. This results in low ohmic resistance values (RDC) of 0.72 mΩ (0.4 µH) to 9 mΩ (10 µH). The new inductors have an outstanding EMC performance due to … Read More → "TDK offers PCM120T shielded SMT power inductors with saturation currents of up to 80 A"

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...