News – Page 528 – EEJournal

New startup MachineWare enables ultra-fast RISC-V simulation

June 29, 2022

Aachen, Germany, 28 June 2022 – Headquartered in Aachen and emerging from stealth mode in May, MachineWare is set to revolutionize semiconductor design with its high-speed functional RISC-V simulator, SIM-V.

SIM-V, the company’s flagship product, combines unprecedented simulation performance with exceptional customizability for applications ranging from the tiniest embedded devices to warehouse-scale supercomputers. SIM-V enables software developers to test full software stacks – including firmware, … Read More → "New startup MachineWare enables ultra-fast RISC-V simulation"

congatec to enter the functional safety market Functional safe computing platforms for mixed-critical applications

June 29, 2022

Nuremberg/Germany, San Diego/CA, 21 June, 2022 * * * At embedded world Hall 5/Booth 135, congatec – a leading vendor of embedded and edge computing technology – announced that it is making massive investments in functional safety (FuSa). Functionally safe embedded computing platforms are needed in many new applications ranging from industrial machinery and collaborative robotics to autonomous vehicles on shopfloors, rails, and roads. For all of these applications there is also a trend towards hardware consolidation that leads to the need to operate mixed-critical applications on functionally safe multicore embedded systems to manage multiple safety and non-safety critical tasks in parallel. Embedded x86 multicore … Read More → "congatec to enter the functional safety market Functional safe computing platforms for mixed-critical applications"

STMicroelectronics releases next-generation Bluetooth® system-on-chip, enhanced with latest positioning capabilities

June 28, 2022

Geneva, June 28, 2022 – STMicroelectronics has introduced its third-generation Bluetooth^® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.

By determining the direction of a Bluetooth Low Energy (BLE) signal, the Bluetooth 5.3 certified BlueNRG-LPS SoC can precisely estimate movement and … Read More → "STMicroelectronics releases next-generation Bluetooth® system-on-chip, enhanced with latest positioning capabilities"

Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller

June 28, 2022

DCD-SEMI, a leading IP Core provider and SoC design house from Poland has mastered unique DeSPI IP Core. It is a fully configurable eSPI master/slave device supporting all features described in the Enhanced Serial Peripheral Interface Base Specification rev. 1.0. The DESPI master is to be used by the microcontroller to communicate with eSPI peripheral devices. The DESPI slave is to be used as an eSPI peripheral device, e.g., an Embedded Controller attached to the Intel CPU system.

Bytom, Poland June the 28th, 2022. The eSPI bus is an LPC … Read More → "Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller"

CUI Devices Adds New Circular Cable Assemblies Product Line

June 28, 2022

LAKE OSWEGO, Ore. — June 28, 2022 — CUI Devices’ Interconnect Group today announced the introduction of Read More →

New Pixus SlotSaver SOSA™ Aligned Chassis Manager Plugs Into Rear Side of Backplane

June 28, 2022

Waterloo, Ontario — June 27, 2022 – Pixus Technologies, a provider of embedded computing and SOSA aligned enclosure solutions, is now offering a SOSA aligned VITA 46.11 compliant chassis manager that sits behind an OpenVPX backplane. This mezzanine-based approach allows for chassis management without sacrificing a slot.

The SHM300 SlotSaver VPX chassis manager is designed to the latest SOSA requirements and utilizes 100% US-based software/firmware. The chassis manager is used to monitor/manage the FRUs (Field Replacement Units) plugged into the SOSA/OpenVPX chassis platform. Features include chassis discovery of plug-in boards, information storage, cooling management, SDR-based sensor … Read More → "New Pixus SlotSaver SOSA™ Aligned Chassis Manager Plugs Into Rear Side of Backplane"

element14 Celebrates the “Summer of Sensors” with Series of Four Design Challenges

Community members have four ways to expand their sensors knowledge and win great prizes

June 28, 2022

Chicago – June 28, 2022: element14, an Avnet community, is continuing its “Summer of Sensors” with a series of four design challenges that encourage participants to advance their skillsets and showcase what sensors can do.

For each challenge, participants will receive one of four free kits provided by “Summer of Sensors” sponsors: Renesas, ST Microelectronics, Vishay and Mikroe. For each challenge, sponsored participants must … Read More → "element14 Celebrates the “Summer of Sensors” with Series of Four Design Challenges"

Macronix Octaflash UW Series Memory Provides High-Density Flash Solutions for NXP S32Z and S32E Real-Time Processors

June 28, 2022

TAIPEI, Taiwan – June 28, 2022 — Macronix International Co., Ltd. (TSE:
2337) today announced that Macronix’s MX25UW high efficiency octaflash
flash memory family has been selected for NXP® Semiconductor’s S32Z and S32E real-time processors for safe integration of real-time
applications. The selection marks the companies’ next step in deploying
Macronix OctaBus Memory technology in NXP’s S32 Automotive Platform,
whose MCUs and processors are designed to address vehicles’
connectivity, security and safety challenges. This development also
reflects the growing need for performance, flexibility and temperature
tolerance in both processors and … Read More → "Macronix Octaflash UW Series Memory Provides High-Density Flash Solutions for NXP S32Z and S32E Real-Time Processors"

Liquid Instruments Brings Additional Capabilities and Flexibility to Engineering and Education Test Solutions

June 28, 2022

Adds Protocol Analyzer, Multi-Instrument Mode and FPGA Programmability to Moku:Go
Improves Phasemeter and Frequency Response Analyzer for Moku:Pro

SAN DIEGO and CANBERRA, Australia, June 28, 2022 —Read More → "Liquid Instruments Brings Additional Capabilities and Flexibility to Engineering and Education Test Solutions"

Siemens to show integrated technologies accelerating decarbonization of buildings

June 28, 2022

Highlight: sustainable hydrogen solution for residential boilers
Intelligent, digitalized heat interface unit for multi-family apartment buildings
LMV6 burner management system for medium and high capacity burners boosts efficiency
New function for self-optimizing dynamic valves saves up to 30% energy
At Mostra Convegno Expocomfort (MCE) trade show, Siemens Smart Infrastructure will present a completely renewed portfolio designed to accelerate the decarbonization of commercial, industrial, and residential buildings. Under the motto “Transform the Everyday,” Siemens will also display products and solutions for original equipment manufacturers (OEMs) that make buildings more efficient, digital, connected, and … Read More → "Siemens to show integrated technologies accelerating decarbonization of buildings"