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Marvell Launches Strategic Initiative to Accelerate AEC Ecosystem and Hyperscaler Adoption

New “Golden Cable” Initiative Accelerates Time-to-market for Next-generation, High-performance AEC Deployments
December 11, 2025

SANTA CLARA, Calif. – December 9, 2025 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today introduced its Golden Cable initiative, a strategic program designed to accelerate and broaden the active electrical cable (AEC) ecosystem and enable faster time-to-market for hyperscaler AI deployments. The program delivers a complete offering with industry-leading software, validated reference designs and comprehensive support, empowering ecosystem partners to quickly design and … Read More → "Marvell Launches Strategic Initiative to Accelerate AEC Ecosystem and Hyperscaler Adoption"

Lightrun ‘Runtime Context’ Empowers AI Coding Agents to Build Software That Works in the Real World

Safe, Direct Access to Runtime Code Across Staging, Pre-prod and Production via MCP Enables Fundamental Step Forward in Autonomous Software Delivery and Reliability for Enterprises
December 11, 2025

NEW YORK, December 10, 2025 — Lightrun, a leader in software reliability, today launched its new Model Context Protocol (MCP) solution, enabling the industry’s first fully integrated Runtime Context for AI coding agents. This new capability is a step change in autonomous code writing that gives tools like Cursor and GitHub Copilot full visibility into how code behaves after deployment, filling a missing piece of the AI development ecosystem for enterprises.</ … Read More → "Lightrun ‘Runtime Context’ Empowers AI Coding Agents to Build Software That Works in the Real World"

SEGGER accelerates production programming for high-capacity storage with exFAT support Storage Image Creator updates allow for the generation of compact, sector-only images for modern eMMC and SD cards

December 10, 2025

Monheim am Rhein, Germany — December 10, 2025

Infineon extends the CoolSiC™ MOSFET 750 V G2 family featuring ultra-low RDS(on) and new packages

December 10, 2025

Munich, Germany – 10 December 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new packages for the CoolSiC™ MOSFET 750 V G2 technology, engineered to deliver highest system efficiency and power density in automotive and industrial power conversion applications. This latest innovation is now available in a range of packages, including Q-DPAK and D2PAK, offering a portfolio with typical RDS(on) values up to 60 mΩ at 25°C.

The portfolio extension includes products for various applications, such as onboard chargers and HV-LV … Read More → "Infineon extends the CoolSiC™ MOSFET 750 V G2 family featuring ultra-low RDS(on) and new packages"

TECHWAY is bridging the FPGA and GPU worlds

December 10, 2025

In today’s world of high-performance embedded computing, systems need to handle massive data streams in real time, making every nanosecond matter. TECHWAY is pushing these limits by integrating NVIDIA’s GPUDirect® RDMA technology into its PCIe FPGA platforms, providing a direct and highly efficient data path between acquisition hardware and GPU processing. This approach opens the door to a new generation of responsive, low-latency applications across defense, aerospace, industrial systems, AI acceleration and embedded vision.

TECHWAY’s PCIe solutions, built on AMD/Xilinx ® Kintex-7 and UltraScale+ ® FPGAs, integrate GPUDirect® RDMA as a … Read More → "TECHWAY is bridging the FPGA and GPU worlds"

Vishay Intertechnology Introduces New AEC-Q200 Qualified, Glass Protected NTC Thermistor in 0402 Case Size

Device Combines High B25/85 Value of 4311 K With R25 Value of 100 kΩ and Tolerances Down to ± 1 %
December 10, 2025

MALVERN, Pa. — Dec. 10, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified, glass protected NTC thermistor in the widely used 0.5 mm by 0.5 mm by 1 mm 0402 case size. The Vishay BCcomponents NTCS0402E3104*XT combines a high beta (B25/85) value of 4311 K with an electrical resistance value at +25 °C (R25) of 100 kΩ.

Fully glass coated and protected, the thermistor released today offer tolerances down to ± 1 % for both its R25 and B25/85 values for precise temperature sensing, protection, and compensation over a wide temperature range of -55 °C to +150 °C. The device offers ESD withstand of > 25 … Read More → "Vishay Intertechnology Introduces New AEC-Q200 Qualified, Glass Protected NTC Thermistor in 0402 Case Size"

Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications

New Dual-Band Solutions Support 2.4GHz and 5GHz on Renesas’ Low-Power RA MCU Architecture
December 10, 2025

TOKYO, Japan, December 10, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU that integrates both Wi-Fi 6 and Bluetooth® Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT devices across smart home, industrial, medical and consumer applications. Renesas also launched fully integrated modules that accelerate development with built-in antennas, wireless protocol stacks, and pre-validated RF connectivity.

Ultra-Low-Power Operation for Always-Connected IoT 

Today’s IoT devices must stay always connected to … Read More → "Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications"

Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography

Breakthrough enables scalable, high-precision biosensing applications in life sciences and healthcare
December 10, 2025

LEUVEN (Belgium), DECEMBER 9, 2025— At this year’s IEEE International Electron Devices Meeting (IEDM 2025), imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents the first successful wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography. Solid-state nanopores are emerging as powerful tools for molecular sensing but haven’t been commercialized yet. This proof of concept is a crucial step towards their cost-effective (mass) production. 

Solid-state nanopores are tiny … Read More → "Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography"

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