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CAN-LIN SBC Click from MIKROE provides high-speed communication over both CAN and LIN for automotive and industrial systems

C-BATT advances Obsidia™ anode material to strengthen U.S. military readiness and American energy independence

</ … Read More → "C-BATT advances Obsidia™ anode material to strengthen U.S. military readiness and American energy independence"
ORLANDO, Fla. (Dec. 15, 2025) – With batteries now central to modern energy infrastructure and defense strategy, C-BATT is moving forward with a major leap in American-made battery technology, preparing Obsidia™ to deliver the performance, durability and independence required for the next era of battery storage.

STMicroelectronics’ precision op amp brings accuracy, speed, and stability

Geneva, Switzerland, December 15, 2025 — STMicroelectronics’ TSZ901 operational amplifier (op-amp) combines precision and zero-drift properties with 10MHz gain-bandwidth (GBW), adding enhanced stability to applications that demand high speed with high accuracy.

Leveraging chopper-stabilization, unusual among 10MHz op amps, the TSZ901 has input-offset voltage of just 5µV at 25°C … Read More → "STMicroelectronics’ precision op amp brings accuracy, speed, and stability"

SiFive and IAR collaborate to drive RISC-V innovation in Automotive electronics

Uppsala, Sweden – December 15, 2025 – IAR, a global leader in embedded development software, and SiFive, a leading provider of commercial RISC-V processor IP and silicon solutions, today announced the full support of IAR’s toolchain for SiFive’s Automotive IP cores. With the latest release of Embedded Workbench for RISC-V, IAR expands its support from the E6-A series to include the SiFive Essential™ E7-A and S7-A series products, providing automotive developers with a complete, commercial-grade solution that accelerates time-to-market.

IAR Embedded Workbench is a leading commercial … Read More → "SiFive and IAR collaborate to drive RISC-V innovation in Automotive electronics"

Synopsys to Showcase Future of Automotive Engineering at CES 2026

Sunnyvale, Calif., December 11, 2025 – Synopsys, Inc. (NASDAQ: SNPS) will exhibit at CES 2026, January 6-9 in Las Vegas, showcasing systems-to-silicon engineering solutions that advance AI-driven and software-defined automotive engineering. For the first time, Synopsys will have a dedicated booth at CES in the West Hall, #6701, featuring cutting-edge vehicle displays and demonstrations of the company’s latest solutions and technology collaborations with industry leaders.

Read More → "Synopsys to Showcase Future of Automotive Engineering at CES 2026"

Abaco Systems Introduces SBC3801

Huntsville, Ala., December 11, 2025 Abaco Systems announces the launch of the SBC3801, a next-generation SOSA aligned 3U VPX Secure Single Board Computer (SBC) designed to deliver uncompromising security and performance for mission-critical applications. This SBC3801 integrates SecurShield™ Agent based on technology from General Dynamics Mission Systems, enabling a programmable hardware root of trust for advanced cybersecurity protection in a rugged design for deployment in harsh environments.

SecurShieldTM</ … Read More → "Abaco Systems Introduces SBC3801"

Imec advances 2D-material based device technology beyond state of the art in support of the future logic technology roadmap

LEUVEN (Belgium), December 10, 2025— This week, at the 2025 IEEE International Electron Devices Meeting (IEDM), imec, world-leading research center in advanced semiconductor technologies, presents breakthrough performance of p-type FETs with monolayer WSe2 channels, and improved fab-compatible modules for source/drain contact formation and gate stack integration. These results, achieved through collaborations with leading semiconductor manufacturers, mark a significant advance for 2D-material based technology, which is considered a promising long-term option for extending the logic technology roadmap.

Replacing Si conduction … Read More → "Imec advances 2D-material based device technology beyond state of the art in support of the future logic technology roadmap"

Molex Unveils MX-DaSH Modular Wire-to-Wire Connectors, Cutting Cost and Complexity of Automotive Wiring Harness and Zonal Architecture Applications

  • Cartridge-based, automation-friendly platform combines power and signal terminals into a single interface for significant wiring-harness weight, size and space savings
  • Improved design flexibility increases support for ongoing transitions to centralized, zonal systems, along with easier upgrades and addition of new automotive features
  • Localized manufacturing and compatibility with industry standards spur global adoption by automotive OEMs, including MY26 Chinese vehicles
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