News – Page 31 – EEJournal

Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors Feature Ultra Compact 0201 Case Size

Devices Save Space While Maintaining High Reliability in Automotive, Industrial, and Telecommunications Applications

February 18, 2026

MALVERN, Pa. — Feb. 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200 qualified thick film chip resistors in the ultra compact 0201 case size. Offering a miniature footprint of just 0.6 mm by 0.3 mm by 0.23 mm, the CRCW0201-AT e3 series devices provide designers with a reliable, space-saving solution for automotive, industrial, and telecommunications applications.

Compared to devices in the next-larger 0402 case size, the resistors released today are available at a competitive price, while reducing PCB requirements by 50 %. For designers, this supports the ongoing downsizing trend in modern electronics, while maintaining stable electrical performance and high … Read More → "Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors Feature Ultra Compact 0201 Case Size"

Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

February 18, 2026

Scalability and functional safety enabled by chiplet technology
Auto-grade quality for large, modern AI NPUs
Advanced power control for higher performance, improved power efficiency and safety
New technology presented at the ISSCC 2026 in San Francisco

TOKYO, Japan and SAN FRANCISCO, Calif., February 18, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures. … Read More → "Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era"

NXP Semiconductors i.MX 91 Processors, Now Available from Mouser Electronics, Support IoT, Edge, Smart Home, Industrial Applications, and More

February 18, 2026

February 17, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new energy-efficient i.MX 91 applications processors from NXP^® Semiconductors. The i.MX 91 processors enable the rapid development of Linux-based edge devices for smart home, consumer, Read More → "NXP Semiconductors i.MX 91 Processors, Now Available from Mouser Electronics, Support IoT, Edge, Smart Home, Industrial Applications, and More"

Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025

February 18, 2026

ROCKVILLE, MD., – February 17, 2026 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the smart edge, today announced that 2025 marked a breakthrough year for its artificial intelligence (“AI”) licensing business, with 10 NeuPro™ neural processing unit (“NPU”) agreements signed and with AI contributing more than 20% of annual licensing revenue in 2025.

As AI expands beyond the cloud into real-world devices, demand is accelerating for optimized, power-efficient neural processing architectures supporting both edge and hybrid AI models. This shift is driving broader adoption of on-device AI inference across diversified smart edge markets and further positions Ceva as … Read More → "Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025"

Imec unveils 7‑bit, 175GS/s massively time-interleaved slope- ADC – pairing record-small footprint and low conversion energy with top sampling speed

Patented linearization and switched input buffer techniques ensure precise signal conversion and wide bandwidth at high speeds

February 17, 2026

At IEEE ISSCC 2026, imec introduces a 7-bit, 175GS/s wireline ADC implemented in 5nm FinFET technology, combining a record-small footprint (250 x 250µm²) and low conversion energy (2.2 pJ per sample).
The design builds on the massively time–interleaved slope–ADC architecture imec debuted in 2024, now enhanced with patented linearization and switched input buffer techniques to ensure precise signal conversion and wide bandwidth at ultra-high sampling rates.

STMicroelectronics’ fast-acting isolated gate drivers for smaller, safer automotive modules

Standard and wide package options meet isolation, insulation, and creepage/clearance specifications

February 17, 2026

Geneva, Switzerland, February 17, 2026 — STMicroelectronics’ STGAP2SA and Read More → "STMicroelectronics’ fast-acting isolated gate drivers for smaller, safer automotive modules"

Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands

February 17, 2026

Compression-based, on-substrate connector and cable assembly optimize signal integrity and efficient power distribution at speeds of 224Gbps PAM-4 and beyond
Impress leverages insights and engineering expertise from NearStack OTS, with over one million units delivered to date
Compact footprint and enhanced durability simplify maintenance and upgrades to future-proof high-density systems

LISLE, IL – February 17, 2026 – Read More →

TDK launches high‑reliability automotive NTC thermistors rated for +175 °C

February 17, 2026

Guarantees operation in high‑temperature environments up to +175 °C

Adopts AgPd terminals compatible with conductive‑glue mounting

AEC‑Q200 compliant (automotive grade)

February 17, 2026

Abaco’s New Fiber Optic Module Improves Data Intelligence Delivery Speeds

February 17, 2026

HUNTSVILLE, Ala., February 17, 2026 — Operations at sea and in the air depend on reliable, adaptable hardware to deliver mission-critical intelligence quickly and securely. Abaco Systems, a leader in rugged, mission-critical embedded computing, meets that challenge with the new FMC600 fiber optic module carrier featuring two PAM4 Optical Modules. With up to eight bi-directional channels, the FMC600 enhances real-time situational awareness and supports faster decision-making by rapidly processing and transmitting vast amounts … Read More → "Abaco’s New Fiber Optic Module Improves Data Intelligence Delivery Speeds"

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

Solution addresses design bottleneck by automating complex workflows

February 17, 2026

SANTA ROSA, Calif.–(BUSINESS WIRE)–Read More → "Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs"