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Marvell to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026

SANTA CLARA, Calif. – February 24, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its latest data center connectivity products and technologies driving the next wave of AI innovation at DesignCon 2026—February 24 to 26 at the Santa Clara Convention Center in Santa Clara, California.

The primary bottleneck in AI data center infrastructure has shifted from compute to connectivity. Data center operators require scalable, ultra-high performance connectivity solutions to address the massive growth of new, more demanding AI workloads. To meet this challenge, Marvell is … Read More → "Marvell to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026"

Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model

  • Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new RAV4 model
  • R-Car V4H performs core ADAS signal processing such as camera, radar sensing and Driver Monitor, supporting higher levels of vehicle safety

TOKYO, Japan, February 24, 2026―Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its ADAS automotive system-on-chip (SoC), R-Car V4H, has been selected for the TSS(LSS) control unit used in Toyota Motor Corporation’s new RAV4 model, which debuted in … Read More → "Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model"

MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive

BRIDGEWATER, N.J., Feb. 24, 2026 – The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced major updates to two of its foundational specifications. MIPI … Read More → "MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive"

Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction

RIVERSIDE, Calif., February 23, 2026 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor Series: the CE0603G</ … Read More → "Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction"

Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection

[Langen/Germany, Yokohama/Japan. February 23, 2026] – Socionext and Innatera today announced a jointly developed human-presence detection solution that combines 60 GHz FMCW radar sensing with neuromorphic edge AI to deliver reliable, always-on detection with drastically reduced power consumption. A live demonstration of technology will be showcased at Embedded World 2026 in Nuremberg (Booth 4A-628).

The solution integrates Socionext’s compact 60 GHz FMCW radar, which captures detailed 3D environmental information under all lighting and weather conditions, with Innatera’s ultra-low-power Spiking Neural Processor, which interprets radar patterns directly at the sensor edge. The neuromorphic processor distinguishes human … Read More → "Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection"

Rohde & Schwarz highlights its comprehensive embedded systems test solutions at embedded world 2026

Embedded systems are fundamental to modern electronics, encompassing everything from power input and control PCBs to motors, sensors and user interfaces. Each of these comes with its own testing needs to guarantee optimal performance, reliability and a fast market release of the final product. At embedded world 2026, Rohde & Schwarz will highlight its comprehensive portfolio of advanced test solutions, addressing these critical needs, from the earliest stages of development to compliance and certification through to final production.

</ … Read More → "Rohde & Schwarz highlights its comprehensive embedded systems test solutions at embedded world 2026"

SEGGER Receives ISO 27001 Certification, Strengthening Information Security and Customer Trust

Monheim am Rhein, Germany — February 20, 2026 — Information security is a long-standing priority at SEGGER, guiding the protection of intellectual property and the responsible handling of customer data. ISO/IEC 27001 certification confirms that these principles are firmly anchored in defined organizational processes.

The certified ISMS establishes clear responsibilities, formalized procedures, and measurable controls across key operational areas, including software development, internal IT infrastructure, product releases, and the handling of sensitive information. It ensures that security measures are regularly reviewed and adapted to evolving requirements.

For customers and partners, certification serves as documented third-party validation that SEGGER’s … Read More → "SEGGER Receives ISO 27001 Certification, Strengthening Information Security and Customer Trust"

Taara Unveils Photonics Platform for Wireless Communication, and Taara Beam, Latest Product in Taara’s Portfolio and First on the New Photonic Core

Sunnyvale, CA – February 23, 2026 – Taara, a graduate of X, Google’s Moonshot Factory, today announced a breakthrough approach to commercial communications and connectivity infrastructure, unveiling Taara Photonics, the world’s first wireless communication platform based on optical phased arrays, along with Taara Beam, its first product based on this photonic core. By moving the core functionality of high-speed wireless optical communication into an integrated circuit that controls light electronically, Taara now enables networks that can be deployed in hours, scaled more flexibly, and improved over time, without the constraints of trenching fiber or securing scarce spectrum.

Read More → "Taara Unveils Photonics Platform for Wireless Communication, and Taara Beam, Latest Product in Taara’s Portfolio and First on the New Photonic Core"

TDK introduces two new DC link capacitor series optimized for on-board chargers in electric vehicles

February 19, 2026

TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms. Due to their compact design and high ripple current capability, such capacitors are commonly used in applications requiring maximum efficiency and reliability in confined spaces.

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