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Accellera at DVCon U.S. 2026

January 27, 2026

Elk Grove, Calif., USA, January 27, 2026 – Accellera Systems Initiative (Accellera), the electronics industry organization focused on electronic design automation (EDA) and intellectual property (IP) standards, will host three workshops, one tutorial and an evening reception during DVCon U.S. 2026.

When/Where
DVCon U.S. 2026 runs Monday, March 2-Thursday, March 5 at the Hyatt Regency Santa Clara.

Accellera-Sponsored Events:

Monday, March 2:

Read More → "Accellera at DVCon U.S. 2026"

Robotiq Launches Tactile Fingertips for 2F Grippers, Bringing the Sense of Touch to Physical AI

Combining adaptive gripping with high-frequency tactile sensing enables robots to generalize across objects, tasks and environments without the cost and complexity of anthropomorphic hands.
January 27, 2026

QUEBEC CITY— January 27, 2026— Robotiq today announced the launch of its TSF-85 tactile sensor fingertips for the 2F-85 Adaptive Gripper, giving Physical AI systems the sense of touch needed for real-world manipulation. With integrated tactile sensing, Robotiq enables robots to not only see the world, but to feel, understand, and reliably interact with it at scale. The Tactile … Read More → "Robotiq Launches Tactile Fingertips for 2F Grippers, Bringing the Sense of Touch to Physical AI"

Fujitsu launches new platform enabling autonomous operation of generative AI optimized for in-house applications in a dedicated environment

January 26, 2026

Kawasaki, January 26, 2026

Fujitsu today announced the launch of a dedicated AI platform that allows enterprises to autonomously manage the entire generative AI lifecycle, including optimal model development, operation, and incremental learning as well as continuous improvement of models and agents. The platform will be rolled out sequentially in Japan and Europe, with preliminary trial registration slated to begin … Read More → "Fujitsu launches new platform enabling autonomous operation of generative AI optimized for in-house applications in a dedicated environment"

Synopsys Announces New Converge Conference, March 11-12, to Drive Intelligent Systems Innovation

For the first time, Synopsys is hosting SNUG Silicon Valley, Simulation World, and Executive Forum simultaneously, blending leadership insights, technical deep-dives, and advanced simulation into one powerful event
January 26, 2026

SUNNYVALE, Calif., Jan. 20, 2026 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) today unveiled its inaugural Converge Conference, a new, industry-defining event taking place March 11-12 at the Santa Clara Convention Center. Designed … Read More → "Synopsys Announces New Converge Conference, March 11-12, to Drive Intelligent Systems Innovation"

STMicroelectronics’ hybrid controller simplifies full-feature implementation of USB-C sink premium applications

January 22, 2026
  • New ST-patented hybrid mode relieves software development for USB PD advanced features
  • Updated ST-proprietary AUTORUN algorithms for software-free basic operation

Geneva, Switzerland, January 22, 2026 — STMicroelectronics’ STUSB4531 USB Power Delivery (PD) sink controller introduces a new, patented hybrid mode that simplifies implementing … Read More → "STMicroelectronics’ hybrid controller simplifies full-feature implementation of USB-C sink premium applications"

Arkisys announces the return of NASA’s Astrobee

January 22, 2026

LOS ALAMITOS, Calif. (January 21, 2026) – Arkisys™, a provider of on-orbit services on long-duration platforms for post launch applications, announces the return of Astrobee, NASA’s bee-inspired free-flying robotic system, as the technology has officially activated operational status.

Astrobee, known for its unique cube-shaped design, has played a vital role in supporting research and technology demonstrations aboard the International Space Station (ISS). Under … Read More → "Arkisys announces the return of NASA’s Astrobee"

Clever-Click module carrier frames for HEAVYCON connectors

Simple and tool-free assembly for heavy-duty connectors
January 22, 2026

Middletown, PA – Phoenix Contact’s new HEAVYCON Clever-Click modular insert carrier frame simplifies the assembly and installation of heavy-duty connectors. The tool-free, click-in latching system enables the modular insert assembly to be mounted inside HEAVYCON housings quickly and reliably – without any screws.

An audible and tactile click signals the correct position, ensuring maximum process reliability while minimizing time expenditure. The ground conductor uses proven Push-in Technology for easy connection. As a bonus, the ground conductor contact can also be fitted while the frame is installed in a panel mounting base, … Read More → "Clever-Click module carrier frames for HEAVYCON connectors"

Vishay Intertechnology 100 V Gen 2 TMBS® Rectifier Modules Deliver Forward Voltage Drop Down to 0.83 V in SOT-227 Package

Devices Offer Drop-in Replacements to Reduce Conduction Losses and Increase Efficiency in Industrial Applications
January 22, 2026

MALVERN, Pa. — Jan. 21, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced four new 100 V Gen 2 Trench MOS Barrier Schottky (TMBS®) rectifier modules in the compact, fully insulated SOT-227 package. Optimized for power conversion in industrial applications, the devices offer best-in-class forward voltage drop down to 0.83 V to reduce conduction losses.

The Vishay Semiconductors rectifier modules released today consist of the dual-diode 100 A VS-QA100FA10, 200 A VS-QA200FA10, and 400 A VS-QA400FA10 in parallel configurations, and the 150 A single phase bridge VS-QA150BA10. With their industry-standard SOT-227 package, the devices can be used as drop-in replacements for competing solutions … Read More → "Vishay Intertechnology 100 V Gen 2 TMBS® Rectifier Modules Deliver Forward Voltage Drop Down to 0.83 V in SOT-227 Package"

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