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Sequans Demonstrates Market Leadership with Breakthrough 5G eRedCap and RF Technologies at MWC 2026

February 26, 2026

Paris, France–(Newsfile Corp. – February 25, 2026) – Sequans Communications S.A. (NYSE: SQNS), a pioneer in cellular IoT solutions, will showcase its newest innovations at Mobile World Congress 2026 in Barcelona (March 2-5), Hall 5, Stand 5D81. The company will highlight:

Salience Labs and Tower Semiconductor Partner to Manufacture At-Scale Optical Circuit Switches for Next-Generation Data Centers

Salience Lab’s Innovative Architecture leverages Tower’s differentiated Silicon Photonics platforms to deliver ultra-low latency, high-bandwidth and lower-power optical connectivity for AI clusters
February 26, 2026
MIGDAL HAEMEK, Israel, and OXFORD, England, February 25, 2026 — Tower Semiconductor, the leading foundry of high-value analog semiconductor solutions, and < … Read More → "Salience Labs and Tower Semiconductor Partner to Manufacture At-Scale Optical Circuit Switches for Next-Generation Data Centers"

Kioxia Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications

Enhanced Interface Speed Enables High-Performance On-Device AI Features in Smartphones
February 26, 2026

SAN JOSE, Calif., February 23, 2026 – KIOXIA America, Inc. today announced that it has begun shipping evaluation samples1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC®2.

UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equipped with on-device AI functions. It utilizes MIPI® M-PHY® version 6.0 for the physical layer and UniPro® version 3.0 for the protocol. M-PHY … Read More → "Kioxia Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications"

Samtec Interconnects Selected for VITA 90 VNX+

Samtec interconnects selected to improve signal integrity and reduce SWaP of evolving VITA standards requiring miniaturization and functionality advancements.
February 25, 2026

VITA™ 90 VNX+™ is a new rugged, high-performance small-form-factor standard recently ratified by ANSI and VITA for addressing the robust embedded computing requirements of UAVs, UUVs, missiles, satellites, and cube satellites commonly deployed in industrial, military and aerospace applications. Samtec’s rugged high-density, high-performance interconnects and alignment products were selected for the VITA 90 standard for use on both the plug-in module (PIM) and the backplane enabling a SWaP alternative to 3U OpenVPX. VNX+ modules are a fraction of the size of existing OpenVPX modules.

Suitable for rugged, high reliability system applications, VITA 90 VNX+ adheres … Read More → "Samtec Interconnects Selected for VITA 90 VNX+"

Lightrun Launches Industry’s First AI SRE With Live Dynamic Runtime Context

Autonomously Remediates Software Issues, Generates Missing Runtime Evidence on Demand, and Validates Hypotheses Against Live Execution from Code to Production
February 25, 2026

NEW YORK, February 25, 2026 — Lightrun, a leader in software reliability, today announced the industry’s first and only real-time AI SRE built on live, in-line runtime context. This allows AI agents and engineering teams to create missing evidence dynamically without redeployments, prove root causes with live execution data (“ground truth”), and validate fixes directly in live environments.

The mass adoption of AI agents and coding assistants … Read More → "Lightrun Launches Industry’s First AI SRE With Live Dynamic Runtime Context"

Junkosha expands high-frequency test leadership with new 0.5 psec skew matching solutions at DesignCon

Interconnect pioneers use premier electronics industry event to launch new cable solutions for high-speed digital applications
February 25, 2026

DesignCon booth: 1060

February 24th, 2026 – Junkosha, global leaders in high-performance cable solutions, have announced the launch of their latest Microwave/mmWave Coaxial Cable Assemblies at this year’s DesignCon, engineered to support ultra high-speed signal transmission up 110 GHz and 120 GHz with skew matched to 0.5 psec. The MWX001 and MWX002 cables address the quest for ever faster data transfer speeds for next-generation high-speed digital systems, including data center communication and precision test environments. In addition to this debut, Junkosha’s MWX0A5, the first 0.5 mm connector cable capable of transmitting signals from DC to 250 GHz, will be … Read More → "Junkosha expands high-frequency test leadership with new 0.5 psec skew matching solutions at DesignCon"

DigiKey Spotlights New Products at Embedded World 2026

The company’s booth will highlight product demos from Arduino, Microchip, NXP, STMicroelectronics and more
February 25, 2026

NUREMBERG, Germany ­— DigiKey, the global distribution leader of electronic components and automation products,will feature the latest embedded system products from top suppliers at its booth, 4A-633, during embedded world 2026, March 10-12, in Nuremberg, Germany. The company will … Read More → "DigiKey Spotlights New Products at Embedded World 2026"

SiMa.ai and STIGA S.p.A. Announce Strategic Partnership in Physical AI

Collaboration unlocks new real-time, efficient and class-leading AI solutions for robotic lawn mowers
February 25, 2026

SAN JOSE, Calif., Feb. 25, 2026 /PRNewswire/ — STIGA S.p.A., the leading European manufacturer and distributor of garden machinery and equipment, and SiMa Technologies Inc., the Physical AI company, today announced a strategic partnership to bring AI-powered solutions to robotic lawn mowers. STIGA will lead the industry with real-time decision-making on an ultra-low-latency and power-draw platform from SiMa, providing a scalable solution architecture for all robotic lawn mower products — domestic and commercial.

STIGA has established itself as a leader in lawn and garden technology, known for combining engineering excellence with … Read More → "SiMa.ai and STIGA S.p.A. Announce Strategic Partnership in Physical AI"

TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive

February 25, 2026

February 25, 2026

TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series, 
now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV 
(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and … Read More → "TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive"

Vishay Intertechnology Phototransistor Optocouplers Deliver Accuracy and Energy Efficiency for Industrial Applications

Devices Combine High, Linear CTR Range With Low Forward Current of 0.5 mA and High Temperature Operation to +125 °C in Four Package Options
February 25, 2026

MALVERN, Pa. — Feb. 25, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of phototransistor optocouplers that combine a high and linear current transfer ratio (CTR) over temperature with a low forward current of 0.5 mA. Offering high temperature operation up to +125 °C in a choice of four packages — the DIL-4; long creepage LSOP-4; compact SOP-4; and half-pitch SSOP-4 — the Vishay Semiconductors VOx619A series is designed to deliver accuracy and energy efficiency in industrial applications.

Offering 50 % lower forward current than the previous-generation solution, the optocouplers released today reduce power consumption for more energy-efficient designs in micro mobility, … Read More → "Vishay Intertechnology Phototransistor Optocouplers Deliver Accuracy and Energy Efficiency for Industrial Applications"

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