LEUVEN (Belgium), MARCH 2, 2026 — Today, the NanoIC pilot line, a
European initiative coordinated by imec and dedicated to accelerating
innovation in chip technologies beyond 2nm, releases two first-of-a-kind
advanced interconnect process design kits (PDKs): a fine-pitch
redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK.
These early-access PDKs bring advanced packaging capabilities within
reach of universities, start‑ups, and industry innovators and mark an
important step in enabling high‑density, energy‑efficient chip‑to‑chip
connectivity.

As the semiconductor industry moves toward ever more complex and
heterogeneous system … Read More → "NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs"

[SUMMARY]

• Imec demonstrates improved metal-oxide resist (MOR) performance when oxygen concentration is raised above atmospheric levels during the EUV lithography post-exposure bake step.
• This marks the first evidence that performing post-exposure lithography steps under controlled ambient environments can reduce EUV exposure dose – delivering a new pathway to higher EUV lithography throughput.
• “Imec’s BEFORCE tool was critical in achieving these results. This unique EUV process and metrology platform … Read More → "Imec unlocks lever for EUV dose reduction: oxygen injection during metal-oxide resist post-exposure bake emerges as game-changer for throughput"