News – Page 27 – EEJournal

Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles

January 14, 2026

Munich, Germany – 8 January 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and HL Klemove have signed a Memorandum of Understanding (MoU) to strengthen their strategic collaboration in automotive technologies. The partnership aims to combine Infineon’s semiconductor expertise and system understanding with HL Klemove’s capabilities in advanced autonomous driving systems to accelerate innovation in vehicle electronic architecture for the Software-Defined Vehicle (SDV) era and advance autonomous driving technologies.

Under the MoU, the two companies will cooperate in … Read More → "Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles"

Innodisk Unveils the New “AI on Dragonwing” Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm’s SoC

The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing™ SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.

January 14, 2026

Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc . The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI performance while maintaining low power consumption and wide-temperature reliability from -40°C to 85°C. The Qualcomm Dragonwing™ SoCs also offers longevity support through 2038, ensuring supply stability for long-term industrial deployments. As the first product line within Innodisk’s AI on ARM portfolio, the series opens a new chapter for customers seeking sustainable and scalable ARM-based Edge AI solutions.

Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers

Solution delivers secure boot, power management and system control for complex computing

January 14, 2026

CHANDLER, Ariz., January 8, 2026 — Microchip Technology (Nasdaq: MCHP) has announced the release of custom-designed firmware for its MEC1723 Embedded Controller (EC), specifically tailored to support NVIDIA DGX Spark personal AI supercomputers. The software is designed to optimize the MEC1723 EC’s … Read More →

From Space to Earth: LYNRED launches an eSWIR sensor to better measure critical resources and climate signals

Presented at SPIE Photonics West 2026 (20–22 January, booth 1866), Sirocco SW brings Space-grade spectroscopy to mining, agriculture and environmental monitoring.

January 13, 2026

Grenoble, France, January 12, 2026 — As pressure mounts on access to critical raw materials, food security and climate data, the ability to accurately analyze soils, materials and gases has become a strategic challenge. LYNRED, a global leader in infrared imaging technologies, today announces the launch of Sirocco SW, a new extended-SWIR (eSWIR) detector designed for high-impact industrial and environmental applications, taking benefit of its Space-proven technology.

Capable of detecting wavelengths up to 2.5 microns in VGA resolution (640 × 512), Sirocco SW extends spectral analysis well beyond the limits of conventional SWIR sensors. This range is essential for identifying chemical species, differentiating … Read More → "From Space to Earth: LYNRED launches an eSWIR sensor to better measure critical resources and climate signals"

SGET Shakes Up FPGA Market with World Premiere of oHFM: The Open Harmonized FPGA Module Standard

January 13, 2026

Munich, Germany – January 8, 2026 – The Standardization Group for Embedded Technologies e.V. (SGET) today announced a paradigm shift in embedded design with the official release of the Open Harmonized FPGA Module (oHFM) specification. As the world’s first open and vendor-independent FPGA module standard, oHFM brings the proven success of Computer-on-Module (COM) principles to the FPGA ecosystem, offering a new level of flexibility for developers and silicon partners alike.

Enhancing Design Flexibility

Traditionally, FPGA-based designs required highly specialized carrier board layouts, often tailored to a specific silicon architecture. The oHFM standard introduces a harmonized pinout and … Read More → "SGET Shakes Up FPGA Market with World Premiere of oHFM: The Open Harmonized FPGA Module Standard"

Innodisk Achieves IEC 62443-4-1 Certification to Standardize Secure Development for Edge AI and Industrial Solutions

January 13, 2026

The certification validates Innodisk’s secure development lifecycle across its full product portfolio, aligning its edge AI and industrial solutions with international cybersecurity and regulatory requirements.

Innodisk, a global leader in edge AI and industrial-grade storage solutions, today announced that it has officially obtained IEC 62443-4-1 certification for its security development lifecycle (SDL).This achievement reinforces Innodisk’s capability to deliver comprehensive security assurance across its product portfolio and product lifecycles, meeting the cybersecurity expectations of global supply chain partners and proactively aligning with upcoming international regulatory requirements such as the EU Cyber Resilience Act (CRA).</ … Read More → "Innodisk Achieves IEC 62443-4-1 Certification to Standardize Secure Development for Edge AI and Industrial Solutions"

NXP’s New UCODE X Delivers Industry-Leading RAIN RFID Performance for High-Volume Applications

UCODE X delivers high read and write sensitivity and customizable configurations, enabling RAIN RFID adoption in new product categories.

January 13, 2026

What’s New:

NXP Semiconductors today announced the new UCODE X, delivering industry-leading read and write sensitivity, flexible configurations, and the industry’s lowest power consumption. UCODE X supports smaller RAIN RFID labels, enabling a wide range of new, high-volume RAIN RFID applications, including retail, logistics, healthcare, and more.

Why it Matters:

Global regulations around product traceability and consumer safety continue to evolve, including the EU Digital Product Passport and U.S. FSMA 204. UCODE X provides the flexibility needed to meet … Read More → "NXP’s New UCODE X Delivers Industry-Leading RAIN RFID Performance for High-Volume Applications"

LambdaTest Rebrands to TestMu AI, the Agentic AI platform for Quality Engineering

Introducing Vibe Testing for the Age of Infinite Code: As Agentic AI transforms software development, TestMu AI introduces autonomous agents to ensure quality keeps pace with infinite code, powering 1.5+ billion tests across 18,000 enterprises.

January 12, 2026

SAN FRANCISCO, CALIFORNIA – January 12, 2026; LambdaTest, the AI-native, agentic quality engineering platform, today announced its rebrand to TestMu AI, marking a bold step forward in its evolution from a cloud testing platform to the world’s first full-stack Agentic AI Quality Engineering platform.

Founded in 2018, LambdaTest rapidly became one of the most trusted names in cloud-based test orchestration and execution. They built a scalable, high-performance test cloud that removed flakiness, improved developer feedback loops, and drastically accelerated release velocity.

In 2022, the company began a deep transformation, moving deep into agentic AI across its products and workflows … Read More → "LambdaTest Rebrands to TestMu AI, the Agentic AI platform for Quality Engineering"

Zapata and University of Maryland Collaborate to Advance New Paradigm in Quantum Software

Initiative aims to publish a formally verified implementation of Shor’s quantum factoring algorithm with relevance to cryptography and other high-value domains

January 12, 2026

Boston, Mass, January 12, 2026 — Zapata Quantum, Inc. (OTC: ZPTA) (“Zapata”, “Zapata Quantum” or the “Company”), a pioneer in quantum computing application and algorithm development, today announced a collaborative research effort with the University of Maryland (UMD), a global leader in quantum computing and quantum information science. The effort will demonstrate a fundamentally new approach to building quantum applications grounded in formal verification.

“We are honored to partner with UMD, one of the world’s leading academic institutions in quantum computing,” said Sumit Kapur, Chief Executive Officer of Zapata Quantum. “This collaboration positions Zapata at the forefront of the … Read More → "Zapata and University of Maryland Collaborate to Advance New Paradigm in Quantum Software"

OMRON Launches P6K Sockets Compatible with G6K Relay Series to Simplify Assembly and Maintenance

January 12, 2026

HOFFMAN ESTATES, Ill.–(BUSINESS WIRE)–OMRON Electronic … Read More → "OMRON Launches P6K Sockets Compatible with G6K Relay Series to Simplify Assembly and Maintenance"

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