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Infineon expands AURIX™ TC3x with 400 MHz option to add real-time compute headroom without a platform change

March 3, 2026

Munich, Germany – 3 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a 400 MHz performance class for its AURIX™ TC3x automotive microcontroller family. The new performance option addresses increasing software complexity and real-time processing demands in powertrain, chassis, and zone or domain control designs, allowing OEMs and Tier-1 suppliers to upgrade functionality without the need for a costly platform migration. By extending performance within the proven AURIX TC3x architecture, the 400 MHz devices enable faster deployment and lower integration risk while … Read More → "Infineon expands AURIX™ TC3x with 400 MHz option to add real-time compute headroom without a platform change"

ASRock Industrial Launches the iEPF-11000S Series to Push AI Workloads beyond Limits

March 3, 2026

Taipei, Taiwan (Mar 3, 2026) ASRock Industrial announces the launch of the iEPF-11000S Series, a powerful Expandable Edge AIoT Platform engineered for next-generation edge AI applications. Powered by Intel® Xeon® 600 processors with W890 chipset, the iEPF-11000S Series delivers professional grade CPU performance, support for up to four graphic cards, PCIe Gen5 connectivity, and up to 2TB of RDIMM/RDIMM-3DS DDR5 memory with ECC protection for mission-critical edge processes. Designed for versatility, the iEPF-11000S Series features a comprehensive I/O with multiple expansion slots, high-speed networking including 10 GbE, and advanced storage capabilities. Built for professional computing environments, it … Read More → "ASRock Industrial Launches the iEPF-11000S Series to Push AI Workloads beyond Limits"

e‑peas to showcase a simplified path to powering the Ambient IoT at Embedded World: Booth #4A 301

Demonstrations will highlight benefits across consumer, logistics and transportation, and smart building applications while showcasing the industry’s first single-chip PMIC for hybrid indoor-outdoor photovoltaic systems
March 3, 2026
Louvain-la-Neuve, Belgium, 3rd March 2026 – e‑peas, a pioneer in ultra-low-power energy harvesting power management technologies, will showcase its range … Read More → "e‑peas to showcase a simplified path to powering the Ambient IoT at Embedded World: Booth #4A 301"

TDK to highlight innovative solutions shaping current and future power electronics technology at APEC 2026

March 3, 2026
  • TDK Showcases solutions for multiple applications including automotive, energy systems, solid-state transformers, optical solutions, data center, robotics and more
  • TDK will be at booth #1419, March 23-25, 2026, in San Antonio, TX

March 3, 2026

TDK Corporation (TSE:6762) announces its participation at the 2026 Applied Power Electronics Conference (APEC) highlighting solutions for a broad range of applications on March 23-25, 2026, at Henry B. Gonzalez Convention Center in San Antonio, Texas. TDK Corporation of America and TDK-Lambda Americas will be located at booth #1419.

TANAKA Establishes Transfer Technology for its Sintered Gold (Au) Bonding Technology “AuRoFUSE™ Preforms”

The seamless application on substrates with complex shapes will improve semiconductor performance through enhanced miniaturization of semiconductor wiring and greater integration for various types of chips
March 3, 2026

Tokyo, Japan, March. 3, 2026 – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd., a company engaged in the industrial precious metals business of TANAKA, today announced a gold bump*1 transfer technology for the sintered gold (Au) bonding technology “AuRoFUSE™ Preforms.” This technology allows AuRoFUSE™ Preforms (gold bumps) to be formed even on semiconductor chips and substrates*2 with complex structures.

■ Advantages of being able to transfer gold bumps

In this technology, at first, gold bumps are formed on a substrate (transfer substrate). Then, the gold bumps are transferred … Read More → "TANAKA Establishes Transfer Technology for its Sintered Gold (Au) Bonding Technology “AuRoFUSE™ Preforms”"

Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices

Innatera adopts Synopsys simulation technology to help design neuromorphic chips that enable low-power AI for wearables, smart home devices, and digital twin industrial sensors
March 2, 2026

Key Highlights

  • Synopsys helps Innatera design chips that enable real-time, energy-efficient AI processing at the edge, catalyzing the development of next-generation applications in physical AI
  • Synopsys PathFinder-SC™ signoff solution delivers improved precision for more accurate layout-level outcomes, expertly manages design requirements, and enables early-phase analysis
  • Synopsys Totem™ power integrity platform enables transistor-level analysis for reliable power delivery and performance optimization for ultra-low-power AI processors

SUNNYVALE, Calif., March 2, 2026 /Read More → "Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices"

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