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The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces

Call for Workshop Submissions – Topics To Include New Materials, Process Technologies, Advanced Packaging Solutions, & Advanced Circuit Design Techniques
November 17, 2025

HONOLULU, HI (November 12, 2025) – The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits has announced a Call for Workshop topics in support of the conference theme: “Advancing the AI Frontier Through VLSI Innovation.” The topics and scope of the workshop sessions involve merging research with applications in areas that have not been covered in detail in previous Symposium technical programs and could serve as topics for future Symposium sessions. The workshop sessions will be held in person during the Symposium on Sunday, June 14, 2026, and presentation slides will be … Read More → "The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces"

3D-Micromac Introduces Next-Generation Laser Sample Preparation Platform for Whole Semiconductor Wafer and System-Level Failure Analysis

microPREP® L delivers unmatched sample size scalability, high throughput and precision, and automation-ready workflows for advanced semiconductor failure analysis
November 17, 2025
Overcoming Sample Preparation Bottlenecks

Sample preparation remains one of the most time-consuming and costly steps in semiconductor failure analysis. Traditional preparation methods like mechanical polishing and focused ion beam (FIB) milling cannot meet the stringent needs of today’s advanced applications. Mechanical polishing introduces mechanical stress to the specimen, which can affect the overall quality and yield. FIB milling is constrained by limited ablation rates, very small sample sizes, high tool operating costs, … Read More → "3D-Micromac Introduces Next-Generation Laser Sample Preparation Platform for Whole Semiconductor Wafer and System-Level Failure Analysis"

MinIO Unveils ExaPOD™, The Reference Architecture for Exascale AI

Designed in collaboration with Intel, Solidigm, and Supermicro, ExaPOD™ delivers the next-generation AI data foundation with industry-leading density, performance, and economics
November 17, 2025

REDWOOD CITY, Calif., November 13, 2025 — MinIO, the data foundation for Enterprise AI, today announced MinIO ExaPOD™, a modular reference architecture for building and operating exascale AI. Developed in collaboration with Intel, Solidigm, and Supermicro, ExaPOD is powered by MinIO AIStor – the Exascale Data Store for the AI Enterprise – and extends MinIO’s proven Read More → "MinIO Unveils ExaPOD™, The Reference Architecture for Exascale AI"

Molex Extends eHV High-Voltage Connector Portfolio to Ensure Safe, Reliable and Efficient Electrical Connections in Electric and Hybrid Vehicles

November 17, 2025
  • New eHV60 Connector suited for auxiliary high-voltage functions, including DC/DC converters, onboard chargers, electric compressors and e-axles in electric and hybrid vehicles
  • Designed to meet stringent industry standards while offering compact, efficient alternatives to legacy products for easier integration into space-constrained systems
  • Validated second-source options reduce supply chain risk while increasing sourcing flexibility, eliminating costly redesigns and accelerating time-to-market

Study by Incheon National University Could Transform Skin Cancer Detection with Near-Perfect Accuracy

New deep learning system integrates images and clinical details, improving early skin cancer diagnosis and aiding in smart healthcare
November 17, 2025

Melanoma is the deadliest form of skin cancer, responsible for thousands of deaths each year; but early detection can dramatically increase survival rates. Now, scientists have developed an advanced artificial intelligence (AI) model that can detect melanoma more accurately by combining skin images with patient metadata. The study achieved 94.5% accuracy, marking a breakthrough in AI-powered early detection of melanoma, thereby advancing smart healthcare systems.

Melanoma remains one of the hardest skin cancers to diagnose because it often mimics harmless moles or lesions. While most artificial intelligence (AI) tools rely on dermoscopic images alone, they often overlook crucial … Read More → "Study by Incheon National University Could Transform Skin Cancer Detection with Near-Perfect Accuracy"

IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter Ready SoCs

First product based on collaboration, the IntelPro IPRO7AI, integrates multi mode wireless, security, multimedia, and AI processing to power next generation smart home, industrial, and consumer IoT devices
November 17, 2025

ROCKVILLE, MD – November 13, 2025 – As artificial intelligence and seamless connectivity converge to redefine the Internet of Things (IoT), demand is rising for platforms that combine low‑power wireless, security, multimedia, and on‑device AI. Addressing this trend, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that IntelPro Inc., a Taiwan-based semiconductor and AIoT solutions provider, will debut its new IntelPro IPRO7AI system‑on‑chip (SoC). The IPRO7AI integrates the Read More → "IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter Ready SoCs"

OmniOn Power™ Provides Modular, Scalable DC Power System Monitoring and Control with New Pulsar 200 Controller

November 13, 2025
  • Plug-and-play controller platform provides adaptive energy management, simplifies scalability, enables tailored configurations, and supports rapid, low-disruption upgrades.
  • The controller is designed for secure edge operation with built-in zero-trust security and provides adaptive intelligence for optimized, data-driven control.
  • Retrofit kit modernizes existing installed base of power systems with advanced monitoring and control.

Read More → "OmniOn Power™ Provides Modular, Scalable DC Power System Monitoring and Control with New Pulsar 200 Controller"

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