Fremont, Calif.—January 14, 2026—Penguin Solutions, Inc. (Nasdaq: PENG) a leading provider of high-performance computing and AI infrastructure solutions, today announced that its SMART … Read More → "Penguin Solutions SMART Modular CXL NV-CMM E3.S 2T Memory Module Achieves CXL Compliance"
Geneva, Switzerland, January 15, 2026 — STMicroelectronics’ SRK1004 synchronous-rectifier controllers save space and increase efficiency in the secondary side of active-clamp, resonant, and quasi-resonant flyback (ACF, AHB, QR) converters for chargers, power adapters, and switched-mode power supplies. The minuscule 2mm x 2mm ICs supersede the SRK1001 and implement a new switch-off algorithm for … Read More → "STMicroelectronics reveals tiny, high-efficiency synchronous-rectifier controllers"
San Jose, CA and Hsinchu, Taiwan, January 15, 2026 – As the automotive industry requirements for increasingly performant vehicle controllers relentlessly drives ahead, Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology Inc., (Nasdaq: MCHP) and United Microelectronics Corporation (NYSE: UMC: TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced today that they have completed full qualification and release to production of SST’s embedded SuperFlash® Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC’s 28HPC+ foundry process platform.
SST developed ESF4 in close partnership with … Read More → "SST and UMC Announce Immediate Availability of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform"
January 15, 2026
TDK Corporation (TSE: 6762) announces the new ModCap UHP (B25648A) series of DC link capacitors, setting a new benchmark for power electronic applications. ‘UHP’ stands for ‘Ultra-High Performance’, and this series enables continuous operation at hotspot temperatures of up to +105 °C without power derating. Compared to previous ModCap generations, which required derating starting at +90 °C, the new design enables higher current density and a longer lifetime in challenging conditions.
By combining a new high-temperature dielectric with a modular design, the ModCap UHP series extends the lifetime of capacitors … Read More → "TDK introduces ModCap UHP for high-current DC link applications with +105 °C operation without derating"
Vienna, Austria – January 14, 2026 – TriLite, developer of the world’s smallest projection displays for AR and automotive applications, will showcase the new Trixel® 3 Cube at this year’s SPIE AR | VR | MR exhibition. The Cube represents the next stage of miniaturized laser beam scanning (LBS) technology, offering a compact display engine with integrated driver electronics and an optimized power profile for all-day wearable AR use.
At booth 6635, TriLite will demonstrate how the Cube’s compact form factor opens new industrial design options for AR glasses. By removing the need for relay optics and reducing … Read More → "TriLite Showcases Trixel® 3 Cube and Advances in Laser Display Technology at SPIE 2026"
SWINDON, United Kingdom, January 14, 2026– Read More → "Sensata Technologies Launches STEV Series High‑Voltage Contactors for Battery Electric and Plug-in Hybrid Vehicles"
Huntsville, Ala., January 14, 2026 – Abaco Systems introduces the SBC3518, a rugged 3U VPX Single Board Computer built on Intel’s Core Ultra Series 3 processors (formerly Panther Lake). Designed for the most demanding commercial, defense and aerospace applications, the SBC3518 … Read More → "Abaco Systems Introduces SBC3518"
Henderson, NV – January 14, 2026 – Aldec, Inc., a pioneer in mixed HDL language simulation and verification solutions for FPGA and ASIC designs, today announced the availability of ALINT-PRO™ 2025.12, delivering a new set of design rules and guidance for mixed-language projects. The update helps engineering teams improve correctness, maintainability, and IP interoperability when combining VHDL and Verilog/SystemVerilog within a single project.
As mixed-language development becomes increasingly common for IP reuse, third-party integration, and long-life product maintenance, design teams face challenges caused by ambiguous mapping, inconsistent parameter passing, and configuration … Read More → "ALINT-PRO™ Adds New Mixed-Language Design Rules for More Predictable Cross-Language Integration"
MALVERN, Pa. — Jan. 14, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has extended its 193 PUR-SI series of miniature snap-in power aluminum electrolytic capacitors with new voltage ratings of 550 V and 600 V. The Vishay BC components devices deliver up to 30 % higher ripple current than standard solutions in similar case sizes and offer a longer useful life.
Traditionally, designers have used three 400 V to 450 V capacitors in series, with voltage balancing resistors across each device, to handle DC bus voltages up to 1100 V — an approach that adds design complexity and potential failure points. With their higher voltage … Read More → "Vishay Intertechnology Extends 193 PUR-SI Series of Snap-in Power Aluminum Capacitors With Voltage Ratings of 550 V and"
