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New Kistler CoMo Injection Firmware Software Version 2.2.3 Offers Enhanced Real-Time Injection Molding Data Analysis Capabilities

May 31, 2011

May 23, 2011,  Farmington Hills, Michigan, USA – Kistler (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure, force, torque and acceleration, has introduced CoMo Injection Firmware software version 2.2.3, designed for greater functionality and enhanced zero-defect process monitoring capabilities within supported automotive, medical, electrical and two-shot injection molding operations. 

Developed in response to customer demand and with direct compatibility to Kistler CoMo Injection versions 2869A and 2869B, version 2.2.3 firmware software includes real-time curve display … Read More → "New Kistler CoMo Injection Firmware Software Version 2.2.3 Offers Enhanced Real-Time Injection Molding Data Analysis Capabilities"

Nimbic Launches Scalable and Secure Cloud Computing Solution for Electronic Design Automation

May 31, 2011

MOUNTAIN VIEW, CA –May 31, 2011 – Nimbic (formerly Physware) today announced the open beta launch of nCloud, the world’s first scalable and secure cloud computing platform for electronic design automation (EDA). Effective immediately, nWave, the leading 3D full-wave EM solver for signal and power integrity (formerly PhysWAVE), and nApex, the leading 3D accelerated parasitic extractor (formerly PhysAPEX), are available on nCloud.

< … Read More → "Nimbic Launches Scalable and Secure Cloud Computing Solution for Electronic Design Automation"

Caswell & Cavium Collaborate to Deliver Breakthrough Energy Efficient Servers With Massive OCTEON(R) Processor Arrays for Cloud Computing

May 31, 2011

Cavium Networks (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for networking, communications, and the digital home, announced today the collaboration with Caswell, Inc., a leader in design and manufacturing of high performance communication appliance and storage solutions, to deliver Multi-Motherboard Blade Servers (MMBS) powered by a massive array of OCTEON® processors for energy efficient cloud computing applications. This high computing throughout is delivered using up to 10 systems in a server rack, with each system consisting of a 4U … Read More → "Caswell & Cavium Collaborate to Deliver Breakthrough Energy Efficient Servers With Massive OCTEON(R) Processor Arrays for Cloud Computing"

CoFluent Design Announces CoFluent Studio Version 4 For Accelerated Creation And Integration Of SystemC TLM Models

May 31, 2011

San Jose, California – May 31, 2011 – CoFluent Design, a leading Electronic System Level (ESL) company that provides system-level modeling and simulation to accelerate innovation in embedded devices, today announced the new v4.0 major release of its flagship product, CoFluent Studio.

System designers use CoFluent Studio for hardware/software system modeling and simulation in consumer, communication, transportation and industrial electronics. CoFluent Studio generates SystemC code from graphics described either in standard UML/SysML or in CoFluent domain-specific language. 

CoFluent Studio translates graphical diagrams into SystemC for hardware modeling and … Read More → "CoFluent Design Announces CoFluent Studio Version 4 For Accelerated Creation And Integration Of SystemC TLM Models"

Micron Announces Sample Availability for Its Third-Generation RLDRAM(R) Memory

May 30, 2011

BOISE, Idaho, 2011-05-26 06:15 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq:MU) today announced that early engineering samples are available for its third-generation reduced latency DRAM (RLDRAM 3 memory). RLDRAM 3 is a high-bandwidth memory technology that enables a more efficient transfer of information across the network. Designed for high-performance networking applications, including high-end routers and switches that require back-to-back READ/WRITE operations or completely random access, RLDRAM 3 memory is an ideal choice for 40 Gigabit Ethernet (GbE) and 100 GbE designs, packet buffering and inspection, and lookup tables. Additionally, RLDRAM 3 memory offers significant improvements in speed, density, latency and power consumption. & … Read More → "Micron Announces Sample Availability for Its Third-Generation RLDRAM(R) Memory"

Imec extends 3D research agreement with Qualcomm focusing on advanced technologies and devices

May 30, 2011

Leuven, Belgium – May 25, 2011 – imec today announced their continued research arrangement with Qualcomm Incorporated on 3D technology which broadens the collaboration with Qualcomm participating in imec’s INSITE program focusing on designing with advanced technologies. This extended collaboration gives Qualcomm early insight on the system design impact of 3D and advanced process technologies including device structures, interconnects and lithography for the sub-20nm node.

Since 2008, Qualcomm has participated in the imec industrial affiliation program (IIAP) on 3D integration providing Qualcomm early access to new 3D technologies for its future wireless … Read More → "Imec extends 3D research agreement with Qualcomm focusing on advanced technologies and devices"

austriamicrosystems announces aggressive plan to be 100% carbon neutral by 2015

May 30, 2011

Unterpremstaetten, Austria (May 30, 2011) – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog semiconductors,today announced ambitious plans to reach full carbon neutrality by 2015 and become the first semiconductor manufacturer worldwide to do so. In its aggressive, ongoing efforts to be environmentally responsible, austriamicrosystems has been actively reducing its carbon footprint since 2004, achieving a reduction of 50% of CO2 equivalents or 31,000 tons until 2010 since implementing actions. Over the last two years austriamicrosystems has completely mapped the CO2 generation of all company activities … Read More → "austriamicrosystems announces aggressive plan to be 100% carbon neutral by 2015"

Linaro partners with Samsung ecosystem to deliver exciting new low cost board ‘Origen’ to Open Source developers

May 30, 2011

TAIPEI, TAIWAN – May 30, 2011 – Linaro welcomes the news that developers will be able to buy low cost, high performance ‘Origen’ development boards using Samsung’s Exynos 4210 chipset, and run free open source software and tools that have been optimized by Linaro. 

Software developers now have low cost access to the high performance Exynos mobile computing platform that packs features such as the latest multi-core Cortex-A9 CPU and multi-core Mali400 GPU, with 1GB of high end DDR3 memory.  This board will be popular with developers of tablets, smartphones and other connected screens where leading edge performance, … Read More → "Linaro partners with Samsung ecosystem to deliver exciting new low cost board ‘Origen’ to Open Source developers"

Management Day at the 48th DAC: Decision-making at the Cutting Edge of Business and Technology

May 30, 2011

LOUISVILLE, Colo. – May 27, 2011 – The rubber meets the road at the intersection of high-performance Systems-on-Chip design and the adoption of emerging technologies. Management Day at the 48th Design Automation Conference (DAC) provides engineering and business managers with essential information to make the right decisions at the intersection of business and technology.

Read More → "Management Day at the 48th DAC: Decision-making at the Cutting Edge of Business and Technology"

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