News – Page 2250 – EEJournal

Press-fit pins for solder-less assembly of power modules

May 12, 2011

May 11th 2011 – Solder pins have been the interface of choice for power modules for many years. In this day and age, when cost saving very often leads to compromises in quality, Vincotech’s new Press-fit technology goes against the trend. The new Press-fit pin takes the assembly properties of Vincotech power modules a step further: the solder-less assembly of the modules, equally easy on both sides of the PCB, leads to higher reliability and design flexibility, and drastically reduces production costs.

The aim of the development was an interconnect technology that would eliminate the … Read More → "Press-fit pins for solder-less assembly of power modules"

Cadence to Unveil OrCAD Capture Marketplace With Industry-First Online Apps; Puts a PCB Design ‘Universe’ at Engineers’ Fingertips

May 12, 2011

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today unveiled OrCAD Capture Marketplace, a unique Web-enabled environment that brings a complete PCB ecosystem — including an industry-first online store for applications — to engineers’ fingertips. Accessible within the new version of the Cadence® OrCAD® Capture schematic design tool, the marketplace fundamentally changes the way PCB designers can access design data, stay informed and discover new resources, including apps to customize and extend the OrCAD environment.

The OrCAD … Read More → "Cadence to Unveil OrCAD Capture Marketplace With Industry-First Online Apps; Puts a PCB Design ‘Universe’ at Engineers’ Fingertips"

Maxim to Demo Real-Time Power Efficiency Inside LED Ballast at LIGHTFAIR with Teridian Energy-Measurement SoC

May 12, 2011

SUNNYVALE, CA—May 11, 2011—Next week at LIGHTFAIR(R) International in Philadelphia, Teridian Semiconductor, a subsidiary of Maxim Integrated Products (NASDAQ: MXIM), will demonstrate both AC- and DC-power measurement suitable for high-power LED-lighting ballasts. Using the Teridian/Maxim 78M6613 energy-measurement system-on-chip (SoC), the demo, located at Maxim’s booth #3351, will validate the interoperability of various components to create a ballast capable of measuring its own power efficiency.

Targeted for applications such as warehouse, architectural, garage, parking lot, street, and highway lighting, the demo will feature a lighting ballast that has both Digital Addressable Lighting Interface ( … Read More → "Maxim to Demo Real-Time Power Efficiency Inside LED Ballast at LIGHTFAIR with Teridian Energy-Measurement SoC"

Quantum3D Thermite Tactical Visual Computers Integrated into AAI Man-Portable Aircraft Survivability Trainer

May 12, 2011

SAN JOSE, Calif. – May 11, 2011 – Quantum3D, Inc., a leading provider of visual computing solutions for government and commercial applications, today announced its Thermite^® TL tactical visual computer has been integrated into the Man-portable Aircraft Survivability Trainer (MAST) developed by AAI Test & Training, an operating unit of Textron Systems, a Textron Inc. (NYSE: TXT) company. Recently selected by the U.S. Army Program Executive of Office for Simulation, Training and Instrumentation (PEO STRI) for strategic training initiatives, MAST replicates effects of an infrared (IR) threat-based weapon and activates aircraft survivability equipment … Read More → "Quantum3D Thermite Tactical Visual Computers Integrated into AAI Man-Portable Aircraft Survivability Trainer"

Tanner EDA to Give One-day Hands-on Training at Workshop on Affordable Design and Production of Mixed-signal ASICS for SMEs in Switzerland

May 12, 2011

MONROVIA, California – May 12, 2011 — Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs), will give one-day hands-on training on schematic entry, simulation, IC layout, and DRC/ LVS at the Workshop on Affordable Design and Production of Mixed Signal ASICs for Small and Medium Enterprises (SMEs) in Windisch, Switzerland on May 18^th, 2011. The Workshop, which takes place on May 17^{th</ … Read More → "Tanner EDA to Give One-day Hands-on Training at Workshop on Affordable Design and Production of Mixed-signal ASICS for SMEs in Switzerland"}

Green Hills Software Announces Support for Multicore Processors in INTEGRITY-178B High-Assurance Multi-Level-Secure Real-Time Operating System

May 11, 2011

SANTA BARBARA, CA — May 11, 2011 — Green Hills Software, the proven worldwide leader in FAA/EASA- and NSA-certified high-assurance operating systems, today announced that its newest version of the INTEGRITY-178B real-time operating system (RTOS) supports multicore processors with initial availability on Freescale Semiconductor’s family of QorIQ™ processors. Green Hills Software has raised the bar by offering the embedded computing markets a safety- and security-critical operating system for multicore processors from a trusted and reliable supplier of high-assurance operating systems. This update of INTEGRITY-178B maintains its exceptional support for robust partitioning, yet now provisions this … Read More → "Green Hills Software Announces Support for Multicore Processors in INTEGRITY-178B High-Assurance Multi-Level-Secure Real-Time Operating System"

Microchip Introduces Accessory Development Kits for Android™

May 11, 2011

CHANDLER, Ariz., May 10, 2011 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced its Accessory Development Starter Kits for Android™, which enable accessory development for Google’s Android platform. Specifically, Android versions 2.3.4 and 3.1 and later include a new framework that allows apps to communicate directly with an accessory connected to a smartphone or tablet, via USB. The kits consist of a development board and a software library, available via free download from http://www.microchip. … Read More → "Microchip Introduces Accessory Development Kits for Android™"

Cadence Acquires Altos Design Automation

May 11, 2011

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it has acquired Altos Design Automation, Inc., the technology leader in enabling foundation IP development for the delivery of complex SoCs at advanced nodes. Shrinking process geometries increase process variations and make creation of accurate noise, power and timing models for foundation IP very complex given smaller time-to-market windows. Altos tools enable ultra-fast and accurate characterization of memory, standard cell libraries and other foundation IP, generating required models for … Read More → "Cadence Acquires Altos Design Automation"

IAR Systems announces support for ARM application processors

May 11, 2011

Embedded Systems Expo, Tokyo, Japan and Uppsala, Sweden—May 11, 2011—IAR Systems® today announced that its software development tool suite IAR Embedded Workbench® now supports code generation and debugging on the ARM Cortex-A8 and ARM Cortex-A9 processor cores. IAR Embedded Workbench allows engineers to build and debug software for applications requiring high computing performance and low power consumption.

“We are committed to provide customers with reliable and powerful development tools for current and future ARM processors” said Stefan Skarin, CEO of IAR Systems. The availability of a … Read More → "IAR Systems announces support for ARM application processors"

Renesas Electronics America Introduces Three New Intelligent Power Devices for Automotive Lighting Applications

May 11, 2011

SANTA CLARA, Calif., May 10, 2011-Renesas Electronics America Inc., a premier provider of advanced semiconductor solutions, today announced three new intelligent power devices (IPDs), the μPD166011, μPD166013 and μPD166014, for use in automotive lighting systems for turn signals and brake light applications. The new IPDs integrate into a single package power metal-oxide-semiconductor field-effect transistors (power MOSFETs) as switching elements and control circuits for protection and self-diagnostic functions.

The new IPDs include the μPD166011 device with a 12-pin power HSSOP package and two output channels with an on-state … Read More → "Renesas Electronics America Introduces Three New Intelligent Power Devices for Automotive Lighting Applications"

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