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QuickLogic to Showcase Longer Battery Life, Bright Sunlight Viewability, and Faster USB Sideloading Solutions at Qualcomm’s Uplinq Conference

SUNNYVALE, CA–(Marketwire – May 31, 2011) – QuickLogic Corporation (NASDAQ: QUIK), the leader in low power Customer Specific Standard Products (CSSPs), today announced that it will demonstrate its system-proven Visual Enhancement Engine (VEE) and Display Power Optimizer (Read More → "QuickLogic to Showcase Longer Battery Life, Bright Sunlight Viewability, and Faster USB Sideloading Solutions at Qualcomm’s Uplinq Conference"

Flexible 365W low profile power supplies on short lead times from Gresham Power

Gresham Power Electronics, the Salisbury based MIL and Commercial power conversion specialist, is able to offer customers fast deliveries of its HD365 series of high-density AC to DC switch-mode power supplies. The HD365 provides a class leading 365 watts in the industry standard 76.2 x 127mm (3 x 5”) footprint.  With a height of only 33mm (1.30 inches) these power supplies are ideally suited for low profile, 1U High applications.

The Gresham Power HD365 range of single-output power supplies offer standard output voltages of 12, 24 and 48 VDC and may be used as bulk converters in a wide range of applications. </ … Read More → "Flexible 365W low profile power supplies on short lead times from Gresham Power"

GLOBALFOUNDRIES to Showcase Innovative Design Solutions for 28nm and Beyond at DAC 2011

Milpitas, Calif. – June 1, 2011 – At next week’s 48th Design Automation Conference (DAC) in San Diego, Calif., GLOBALFOUNDRIES will demonstrate how its innovative approach to ecosystem collaboration has helped deliver the industry’s most comprehensive design platform for advanced technologies. The company will feature a full complement of design infrastructure for its 28nm High-k Metal Gate (HKMG) technology, including silicon-validated flows, process design kits (PDKs), design-for-manufacturing (DFM), and intellectual property (IP) from leading companies. GLOBALFOUNDRIES also will showcase approaches to overcoming new design challenges as the industry moves to 20nm and beyond.</ … Read More → "GLOBALFOUNDRIES to Showcase Innovative Design Solutions for 28nm and Beyond at DAC 2011"

Synopsys Hosts Special Events with Industry Leaders at DAC 2011

MOUNTAIN VIEW, Calif., June 1, 2011—Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, will host several customer special events at DAC 2011 in San Diego, Calif. Attendees will get to hear panels of technical industry experts from leading companies speak about real-world semiconductor design, verification and foundry challenges and solutions. 

Monday, June 6, 2011

WHAT: IC Compiler Luncheon

TOPIC: Gigascale Designs with … Read More → "Synopsys Hosts Special Events with Industry Leaders at DAC 2011"

Xilinx Research Labs Fellow Steve Trimberger to be Honored at ACM Induction Ceremony with 2010 Class of Fellows

SAN JOSE, Calif., June 1, 2011 – Xilinx Inc. (NASDAQ: XLNX) today announced that Xilinx Research Labs Fellow, Steve Trimberger, has been chosen by the Association for Computer Machinery (ACM) to be inducted into the class of 2010 ACM fellows for his achievements in computer science and information technology.  

Recognition as an ACM fellow is the most prestigious member grade granted to the top one percent of ACM members for outstanding accomplishments in computing and information technology and/or outstanding service to ACM and the larger computing community.  Trimberger is being honored for his contributions … Read More → "Xilinx Research Labs Fellow Steve Trimberger to be Honored at ACM Induction Ceremony with 2010 Class of Fellows"

MIPS Technologies and Ingenic Semiconductor Collaborate to Bring Android™ ‘Honeycomb’ to New 1GHz MIPS-Based™ Mobile SoC

SUNNYVALE, Calif. – May 31, 2011 – MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, and Ingenic Semiconductor, a leading China-based CPU provider for mobile multimedia applications, today announced that they are collaborating to bring Android™ 3.0, also known as ‘Honeycomb’, to Ingenic’s new JZ4770 mobile applications processor, which leverages a MIPS-Based™ XBurst™ CPU running at 1GHz. Honeycomb is … Read More → "MIPS Technologies and Ingenic Semiconductor Collaborate to Bring Android™ ‘Honeycomb’ to New 1GHz MIPS-Based™ Mobile SoC"

NetLogic Microsystems Announces Production Orders into LTE Base Stations for Ground-Breaking XLP® Multi-Core Processors

Santa Clara, Calif. – May 31, 2011 – NetLogic Microsystems, Inc. [NASDAQ: NETL], a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced that it has received, and is now accepting orders for volume production for its best-in-class XLP316L multi-core, multi-threaded processors from customers developing next-generation LTE base stations. NetLogic Microsystems’ industry-leading XLP316L multi-core processor delivers unparalleled performance and sets a new standard for Tier One OEMs developing highly differentiated eNodeB solutions for LTE and LTE-Advanced.

The XLP316L multi-core processor integrates 16 high-performance NXCPUs™ … Read More → "NetLogic Microsystems Announces Production Orders into LTE Base Stations for Ground-Breaking XLP® Multi-Core Processors"

MIPS Technologies Advances ‘Apps on MIPS’ Development

SUNNYVALE, Calif. – May 31, 2011 – MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, announced the launch of a new MIPS Application Development (MAD) Program designed to promote rapid development of applications on the MIPS® architecture. The program offers technical support and services for performance testing and compatibility to verify that applications will run as designed on MIPS-Based™ devices. Through the program—the latest offering available through the new MIPS Developer Community& … Read More → "MIPS Technologies Advances ‘Apps on MIPS’ Development"

EnSilica and Evatronix collaborate on USB connectivity for eSi-RISC processors

Wokingham, UK and Bielsko-Biala, Poland – 31st May 2011.  EnSilica, a leading independent provider of front-end IC design services and system solutions, has announced a collaboration with silicon Intellectual Property (IP) provider, Evatronix SA, to offer fully featured eSi-RISC processor SoC solutions incorporating USB 1.1, 2.0 and 3.0 connectivity. The collaboration with Evatronix adds an important building block to EnSilica’s strategy of providing customers with eSi-RISC processor sub-systems complete with integrated peripherals. The collaboration also broadens the Evatronix USB IP sub-system portfolio with RISC processor combinations.

“USB is a key connectivity choice for our customers and teaming-up with … Read More → "EnSilica and Evatronix collaborate on USB connectivity for eSi-RISC processors"

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