Highly secure OTP memory used for WHDI key storage on AMIMON WHDI™ chips

Ottawa, Canada – October 13, 2009 – Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) IP cores, today announced that AMIMON, the market leader in wireless High Definition (HD) semiconductor solutions, is employing Sidense’s 1T-Fuse™-based one-time programmable (OTP) memory macro technology in chips used for uncompressed wireless high-definition video connectivity. The chips are used in AMIMON’s second-generation WHDI™ (Wireless Home Digital Interface) transmitter and receiver products designed for wireless delivery of full uncompressed 1080 … Read More → "Sidense OTP Enables Security of Wireless Video Transmissions"

AppliedMicro Taps LiquidSoC to Lower Systems Risk, Cost and Time-to-Market

SAN DIEGO–(BUSINESS WIRE)–Rapid Bridge, an innovator in advanced semiconductor design and development processes, announced today that its LiquidSoC™ has been selected by Applied Micro Circuits Corporation (NASDAQ: AMCC) for a multi-platform, advanced nanometer system-on-chip (SoC) engagement.

LiquidSoC – A Systems Approach to Design

Rapid Bridge’s Liquid platforms provide an entirely new approach to IC development that inherently improves the performance of the SoC building blocks. Developed from the ground up, Rapid Bridge’s SoC platforms, or … Read More → "Rapid Bridge Technology Selected by AppliedMicro for Multi-Platform Advanced Nanometer System-on-Chip Development"

Unique M-language and model-based solution delivers up to 10X higher productivity for communications and multimedia system designers

MOUNTAIN VIEW, Calif., October 12, 2009 – Synopsys, Inc. (Nasdaq:SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced its Synphony HLS (High Level Synthesis) solution that integrates M-language and model-based synthesis to deliver up to 10X higher design and verification productivity than traditional RTL flows for communications and multimedia applications. Synphony HLS creates optimised RTL for ASIC and FPGA implementation, architecture exploration and rapid prototyping. In addition, Synphony HLS complements C/ … Read More → "Synopsys introduces Synphony High Level Synthesis"

New features include UPDM 1.0, glossUML, Artisan Publisher, UML Activity modeling and extra-large model support, amongst many improvement

Washington DC, USA and Cheltenham, UK – 12th October 2009. Artisan® Software Tools, the world’s largest independent supplier of industrial-grade, collaborative modeling tools for complex, mission and safety-critical embedded systems and software, has launched a major new version of its flagship model-driven development tool suite, Artisan Studio® Version 7.1. It delivers some major new modeling features including comprehensive support for the new OMG Unified Profile for DoDAF and MODAF (UPDM 1.0) standard, improved model diagram presentation through glossUML& … Read More → "Launch of Artisan Studio Version 7.1 delivers major new model-driven development features"

SANTA CLARA, Calif., Oct. 12, 2009 — Agilent Technologies Inc. (NYSE: A) today announced that it has qualified its Momentum Electromagnetic (EM) tool for Taiwan Semiconductor Manufacturing Corp.’s (TSMC’s) 65-nm process as part of the TSMC EM Tool Qualification program. This program assists IC designers by providing certified process technology files, layout and measurements for 65-nm and 90-nm process technologies. Certified process files eliminate several error sources in the design process and enable designers to use a TSMC-qualified EM simulator on TSMC 65-nm processes with confidence. Today’s qualification announcement demonstrates the fitness of Momentum in EM-based inductor device … Read More → "Agilent Technologies’ Momentum Electromagnetic Simulator Qualified for High-Frequency Designs in TSMC Advanced RF Processes"

Texas Instruments Selects IDT Serial RapidIO Gen2 IP for Wireless-Optimized DSP

SAN JOSE, Calif.–(BUSINESS WIRE)–IDT® (Integrated Device Technology, Inc.) (NASDAQ:IDTI), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, today announced its Serial RapidIO® Gen2 program consisting of a comprehensive portfolio of IP, switches, evaluation platforms and tools. At the same time, IDT announced its Serial RapidIO Gen2 endpoint Intellectual Property (IP) has been selected by Texas Instruments (TI) for use in its wireless optimized digital signal processors (DSPs). The combination of the IDT Serial … Read More → "IDT Introduces Serial RapidIO Gen2 Development Program"

SOI Test Chip Results Detailed at IEEE Conference

CAMBRIDGE, England–(BUSINESS WIRE)–ARM [(LSE:ARM); (Nasdaq:ARMH)] announced at the IEEE SOI Conference, Foster City, Calif., the results from a silicon-on-insulator (SOI) 45nm test chip that demonstrate potential power savings of up to 40 percent over traditional bulk process for manufacturing chips. The test chip was based on an ARM 1176™ processor and enables a direct comparison between SOI and bulk microprocessor implementations. The results confirm SOI technology is a viable alternative to traditional bulk process technology when designing low-power processors for high-performance consumer devices and mobile … Read More → "ARM Announces 45nm SOI Test Chip Results That Demonstrate Potential 40 Percent Power Savings Over Bulk Process"

UPDM 1.0 given final sign-off as a formal OMG standard

Washington DC, USA and Cheltenham, UK – 7th October 2009. Artisan® Software Tools, the world’s largest independent supplier of industrial-grade, collaborative modeling tools for complex, mission and safety-critical systems and software, has announced that it has helped successfully steer UPDM (the Unified Profile for DoDAF/MODAF) to OMG standardization approval. The content definition and preparation of the UPDM 1.0 specification was led by Artisan and No-Magic as co-chairs of the UPDM Group, drawing on the extensive experience of Artisan’s … Read More → "Artisan helps steer UPDM through OMG standardization in record time"

High quality DesignWare IP speeds time-to-market for STM32 Connectivity Line of SoCs

MOUNTAIN VIEW, Calif. – October 7, 2009 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that STMicroelectronics (ST) has achieved first-pass silicon success for its STM32 Connectivity Line of system-on-chips (SoCs) utilising the Synopsys DesignWare(r) USB 2.0 On-The-Go (OTG) and Ethernet digital controllers. ST, a global leader in developing and delivering SoC and semiconductor solutions, evaluated several IP vendors and selected Synopsys DesignWare IP solutions because they are high-quality, include the right feature set, and have … Read More → "Synopsys DesignWare USB 2.0 and Ethernet IP enables first-pass silicon success for STMicroelectronics"

Improved collaboration, lifecycle management and measurement capabilities target semiconductor, photovoltaic and thin film MEMs sectors

Dortmund, Germany – 6th October 2009 – Process Relations has today launched the latest version of its XperiDesk Process Development Execution System (PDES) software. XperiDesk 2009.2 delivers a new module, XperiSim, that provides a generic simulation and calculation interface, together with the management of simulation and calculation modules. These additional tools combined with the core capabilities of the XperiDesk system, give engineers even more time to focus on tackling the technical challenges involved with what-if process development, rather than data collection and management.