News – Page 2135 – EEJournal

Agilent Technologies Announces New Wireless Communications Test Set for R&D

December 16, 2011

SANTA CLARA, Calif., Dec. 13, 2011 – Agilent Technologies Inc. (NYSE: A) today announced the new E5515E 8960 Series 10 wireless communications test set, designed for R&D engineers who need to stress their 2G/3G/3.5G designs at the maximum data rates.

The E5515E, an enhancement to the industry-preferred 8960 wireless test set, is equipped with dual downlink paths, a more powerful processor and other significant hardware … Read More → "Agilent Technologies Announces New Wireless Communications Test Set for R&D"

Imec, Polyera and Solvay set 8.3% efficiency record for organic solar cell with inverted device architecture

December 16, 2011

Leuven (Belgium) December 15, 2011 – Imec, Polyera and international chemical group Solvay have achieved a new world-record efficiency of 8.3% for polymer-based single junction organic solar cells in an inverted device stack. These excellent performance results represent a crucial step towards successful commercialization of organic photovoltaic cells.

Solar power is gradually becoming cost-competitive with traditional mainstream energy sources such as coal, oil, and nuclear. Continued reduction of manufacturing and installation costs of solar panels will further drive this cost-competitiveness. Organic solar cells are holding the promise of addressing these issues, due to their potential to be … Read More → "Imec, Polyera and Solvay set 8.3% efficiency record for organic solar cell with inverted device architecture"

New Brad®HarshIO Ethernet I/O Modules from Molex Integrate QuickConnect and Fast Start-up

December 16, 2011

LISLE, IL – Dec. 14, 2011 –Molex Incorporated introduces new Brad® HarshIO Ethernet I/O Modules with QuickConnect (QC) and Fast Start-Up (FSU) technologies to provide a reliable solution for connecting industrial controllers to I/O devices in harsh environments where liquids or vibrations may be present. Delivering significant operational advantages over conventional I/O modules, the Brad … Read More → "New Brad®HarshIO Ethernet I/O Modules from Molex Integrate QuickConnect and Fast Start-up"

VIA Announces Android Support for Embedded x86 Boards

December 16, 2011

Taipei, Taiwan, December 15, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Android support for VIA x86 embedded platforms, starting with support for the VIA EITX-3002 Em-ITX board. Running Android on an x86 platform offers increased flexibility, great multimedia support and cost saving advantages for embedded applications such as in-vehicle entertainment and interactive kiosks.

Key advantages for Android on x86 include leverage of Android development resources and existing apps, rich I/O flexibility, greater CPU performance as well as higher display resolutions of up to 1920 x 1080. In addition VIA has … Read More → "VIA Announces Android Support for Embedded x86 Boards"

Synopsys Enables Silicon Success for GLOBALFOUNDRIES’ First Complex 20-nm Design

December 15, 2011

MOUNTAIN VIEW, Calif., Dec. 14, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today announced that IC Compiler-Advanced Geometry (AG) drove silicon success for GLOBALFOUNDRIES’ first major 20-nanometer (nm) chip. Recently announced, IC Compiler-AG is the 20-nm edition of IC Compiler. The tapeout of this large design containing a dual-core processor represents a major milestone in the collaboration between Synopsys and GLOBALFOUNDRIES to develop 20-nm rules and a comprehensive double patterning technology (DPT)-aware implementation solution. The selection of IC Compiler for this … Read More → "Synopsys Enables Silicon Success for GLOBALFOUNDRIES’ First Complex 20-nm Design"

The Latest Tool from JTAGLive Family

December 15, 2011

Eindhoven, The Netherlands, December 2011 ,- JTAG Technologies, market leader in boundary-scan solutions will showcase these latest hard- and software solutions at Embedded World Show in Nuremberg, February – 28 to 30^th 2012, booth 4-619.

The Latest Tool from JTAGLive Family

AutoBuzz is a totally unique new tool that effectively learns a connectivity signature of all boundary-scan parts within a design from only the BSDL models of those parts. By expanding on the seek and discover mode of BuzzPlus, AutoBuzz automatically gathers the circuit data of a known good board and … Read More → "The Latest Tool from JTAGLive Family"

CAST Full Hardware UDP/IP Stack Core Simplifies Streaming Media Over IP Networks

December 15, 2011

Woodcliff Lake, NJ, December 15, 2011 — A new core from semiconductor intellectual property (IP) provider CAST, Inc. the UDPIP, provides an extremely competitive hardware implementation of the User Datagram Protocol (UDP), part of the Internet Protocol Suite (TCP/IP) for data transfer over Ethernet.

UDP is a fast, simple, transport layer protocol that works without the handshaking and error correction of the more rigorous Transmission Control Protocol (TCP). This makes UDP good for applications like video or audio streaming, where receiving … Read More → "CAST Full Hardware UDP/IP Stack Core Simplifies Streaming Media Over IP Networks"

CEVA and Idea! Electronic Systems Partner to Deliver Software-Based ISDB-T Solution for DTV Demodulation

December 15, 2011

MOUNTAIN VIEW, Calif., December 15, 2011 – CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores today announced a new software-based product offering for multi-standard DTV demodulation based on its CEVA-XC DSP core. The company has partnered with Idea! Electronic Systems to develop a complete, ISDB-T solution based on a multi-standard reference architecture, including ISDB-T software library functions, ISDB-T PHY software IP, a universal front-end engine and FEC accelerators. CEVA and Idea! will demonstrate the solution demodulating an ISDB-T live signal at CES 2012 in Las Vegas, from January 10-13th, 2012.</ … Read More → "CEVA and Idea! Electronic Systems Partner to Deliver Software-Based ISDB-T Solution for DTV Demodulation"

High Efficiency Dual Synchronous Buck Controller Provides Complete DDR Power Solution & Complies with DDR1/DDR2/DDR3 Standards

December 15, 2011

MILPITAS, CA – December 15, 2011 – Linear Technology Corporation introduces the LTC3876, a high-efficiency dual output synchronous step-down DC/DC controller that generates the VDDQ supply voltage, the VTT bus termination voltage and the VTTR reference voltage for DDR1/DDR2/DDR3 and future standard memory applications. The output of the first channel produces VDDQ and can be programmed from 2.5V down to 1 … Read More → "High Efficiency Dual Synchronous Buck Controller Provides Complete DDR Power Solution & Complies with DDR1/DDR2/DDR3 Standards"

Xilinx Research Labs Fellow Steve Trimberger Named IEEE Fellow

December 14, 2011

SAN JOSE, Calif., Dec. 14, 2011 /PRNewswire/ –Xilinx, Inc. (NASDAQ: XLNX) today announced that Steve Trimberger has been named an IEEE Fellow for “contributions to circuits, architectures and software technology for field-programmable gate arrays.”

Each year, following a rigorous evaluation procedure, the IEEE Fellow Committee recommends a select group of recipients to be honored with elevation to IEEE Fellow. With nearly 400,000 members world-wide, IEEE elevated 321 individuals to IEEE Fellow for 2011, bestowing one of the most prestigious honors given … Read More → "Xilinx Research Labs Fellow Steve Trimberger Named IEEE Fellow"