industry news
Subscribe Now

Xilinx Research Labs Fellow Steve Trimberger Named IEEE Fellow

SAN JOSE, Calif.Dec. 14, 2011 /PRNewswire/ –Xilinx, Inc. (NASDAQ: XLNX) today announced that Steve Trimberger has been named an IEEE Fellow for “contributions to circuits, architectures and software technology for field-programmable gate arrays.”

Each year, following a rigorous evaluation procedure, the IEEE Fellow Committee recommends a select group of recipients to be honored with elevation to IEEE Fellow. With nearly 400,000 members world-wide, IEEE elevated 321 individuals to IEEE Fellow for 2011, bestowing one of the most prestigious honors given by the association to the top echelon of the engineering community. 

Trimberger is one of Xilinx’s most tenured and distinguished employees, having played a pivotal role over more than two decades in the creation of many generations of field programmable gate array (FPGA) architectures and the electronic design automation software to design and program those devices. For example, Trimberger led the software development for XC4000 devices and architecture development for XC4000X families, as well as the design and software development for Xilinx’s time-multiplexed FPGA. In addition, he designed the device security used in Xilinx FPGA FPGAs. Trimberger currently holds over 185 patents, with dozens more pending.

“We’re delighted that the IEEE has awarded this honor to Steve for his contributions to the semiconductor industry,” said Xilinx Senior Vice President and Chief Technology Officer, Ivo Bolsens.  “Over the years, his vision and creativity have taken Xilinx to new heights, influencing the future of the programmable logic industry and fueling the development of phenomenal new products by our customers. To this day, he exemplifies a spirit of innovation that’s shared by the entire engineering community here at Xilinx.”

In June 2011, Trimberger was inducted into the class of 2010 ACM (Association of Computing & Machinery) fellows for his achievements in computer science and information technology. Recognition as an ACM fellow is the most prestigious member grade granted to the top one percent of ACM members for outstanding accomplishments in computing and information technology and/or outstanding service to ACM and the larger computing community. 

Trimberger received his B.S. in Engineering and Applied Science from the California Institute of Technology (Caltech), M.S. in Information and Computer Science from UC Irvine, and Ph.D in Computer Science from California Institute of Technology. Notably, he studied under EDA pioneer and Inventors Hall of Fame recipient Professor Carver Mead.

About IEEE and the IEEE Fellow Program

The IEEE Grade of Fellow is conferred by the IEEE Board of Directors upon a person with an outstanding record of accomplishments in any of the IEEE fields of interest. The total number selected in any one year cannot exceed one-tenth of one percent of the total voting membership. IEEE Fellow is the highest grade of membership and is recognized by the technical community as a prestigious honor and an important career achievement. Three hundred twenty-one individuals have been elevated to IEEE Fellow for 2011.

The IEEE (Institute of Electrical and Electronics Engineers) is the world’s leading professional association for advancing technology for humanity. Through its 385,000 members in 160 countries, the association is a leading authority on a wide variety of areas ranging from aerospace systems, computers and telecommunications to biomedical engineering, electric power and consumer electronics.

About Xilinx

Xilinx is the world’s leading provider of programmable platforms. For more information, visit:http://www.xilinx.com/.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Addressing the Challenges of Low-Latency, High-Performance Wi-Fi
In this episode of Chalk Talk, Amelia Dalton, Andrew Hart from Infineon, and Andy Ross from Laird Connectivity examine the benefits of Wi-Fi 6 and 6E, why IIoT designs are perfectly suited for Wi-Fi 6 and 6E, and how Wi-Fi 6 and 6E will bring Wi-Fi connectivity to a broad range of new applications.
Nov 17, 2023
21,457 views