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AMD Extends Ryzen AI Embedded Processor Portfolio, Delivering Scalable, Efficient AI Compute for Industrial and AI Edge Solutions

News Snapshot:

  • New processors enable next-generation industrial and robotics solutions with up to twice the CPU cores and higher AI throughput in the same compact footprint.
  • From industrial automation to mobile robotics and medical imaging, embedded developers can accelerate AI deployments using AMD ROCm™, a proven, open-source software stack for edge applications.

Factory automation, physical AI in mobile robotics, and other AI-driven edge applications are rapidly evolving and driving the need for computing platforms that … Read More → "AMD Extends Ryzen AI Embedded Processor Portfolio, Delivering Scalable, Efficient AI Compute for Industrial and AI Edge Solutions"

SEGGER Partners with Razorcat on Automated Embedded-Software Testing

Monheim am Rhein, Germany — March 9, 2026 — TESSY is a widely used unit and integration testing tool for embedded software, particularly for safety-related projects. It automates test creation and test cycles; aids test organization and management; and supports a wide range of microcontrollers, compilers, and debuggers.

SEGGER’s software-development tools are well integrated with TESSY. Read More → "SEGGER Partners with Razorcat on Automated Embedded-Software Testing"

POLYN Highlighting Live NASP Voice Chip Demo at Embedded World 2026

March 9, 2026 – Nuremberg, Germany – POLYN Technology, a pioneer in ultra-low-power neuromorphic computing, will present a live demonstration of its NeuroVoice voice chip at Embedded World 2026, showcasing the first production-oriented implementation of its silicon-proven Neuromorphic Analog Signal Processing (NASP™) technology.

The live demo highlights POLYN’s first silicon-proven NASP VAD chip, which performs always-on voice detection with microwatt-level power consumption. By executing neural-network inference directly in the analog domain, the chip eliminates the traditional power–latency tradeoff that constrains digital edge AI architectures. The result is deterministic, ultra-fast voice detection suitable for battery-operated and energy-harvesting … Read More → "POLYN Highlighting Live NASP Voice Chip Demo at Embedded World 2026"

STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack

Geneva, Switzerland, March 9, 2026 — STMicroelectronics has released motor-control software to simplify enhancing drives with AI for optimization and predictive maintenance, ready to load on the EVLSPIN32G4-ACT evaluation board and start exploring.

The Read More → "STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack"

Rohde & Schwarz and NETGEAR collaborate for next generation Wi-Fi 8 access point testing

NETGEAR has selected the CMP180 radio communication tester from Rohde & Schwarz for the development of future Wi-Fi 8 access points. By integrating the tester into their design validation test environment, NETGEAR will be able to speed up the development of performance optimized Wi-Fi products.

Rohde & Schwarz, a leading supplier of test and measurement equipment for wireless applications, and NETGEAR, manufacturer of advanced networking technologies and leading-edge Wi-Fi 7 products, collaborate to get the next generation Wi-Fi 8 products ready for the market.

Wi-Fi 8 is the next generation Wi-Fi based on the upcoming IEEE 802.11bn standard. With … Read More → "Rohde & Schwarz and NETGEAR collaborate for next generation Wi-Fi 8 access point testing"

Panasonic Connect Unveils Latest in Smart Manufacturing at APEX EXPO 2026

NEWARK, NJ (March 9, 2026) – Panasonic Connect North America is showcasing a broad portfolio of smart manufacturing solutions at APEX EXPO 2026 (booth #2103), taking place March 16-19 in Anaheim, CA. In addition to hands-on demonstrations that highlight how the company’s innovations drive real-world customer success, Panasonic Connect … Read More → "Panasonic Connect Unveils Latest in Smart Manufacturing at APEX EXPO 2026"

ZeroRISC and Leading Research Institutions Deliver Production-Grade Post-Quantum Cryptography for Open Silicon

STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere

  • STM32C5 with Cortex®-M33 and 40 nm for enhanced speed and Flash density
  • Increased performance with cost efficiency
  • Comprehensive ecosystem to enhance end-device capabilities and accelerate time to market
Mar 5, 2026 (Geneva, Switzerland) — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new generation of entry-level microcontrollers (MCUs) to boost the performance of billions of tiny smart devices throughout factories, homes, cities, and infrastructures while meeting extreme cost, size, and power limitations.
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