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Major release of HighTec Rust and C/C++ Arm Development Platform v10.0.0 speeds up safety and security focused Automotive software development

February 2, 2026
Saarbruecken/Germany, February 2, 2026 – HighTec EDV-Systeme, a leading provider of compiler solutions for automotive MCUs, announces a new major release of their HighTec Rust and C/C++ Arm Development Platform. The latest version v10.0.0 broadens its device support, integrates LLVM 17 to boost performance, supports memory-safe Rust for hybrid development with legacy C/C++ and comes with comprehensive qualification kits to speed up safety and security certification. HighTec’s toolchain for Rust and C/C++ Arm development is qualified according to the highest functional safety standard ISO 26262 up to ASIL D and … Read More → "Major release of HighTec Rust and C/C++ Arm Development Platform v10.0.0 speeds up safety and security focused Automotive software development"

PIC32CM PL10 MCUs Expand Microchip’s Arm® Cortex®-M0+ Portfolio

Low-power, 5V‑capable devices deliver high performance while preserving low system complexity and costs
January 30, 2026
CHANDLER, Ariz., January 29, 2026 — Building on decades of experience in serving embedded applications where low power, affordability and ease of development are critical, Microchip Technology (Nasdaq: MCHP) has added PIC32CM PL10 MCUs to its … Read More → "PIC32CM PL10 MCUs Expand Microchip’s Arm® Cortex®-M0+ Portfolio"

Cincon’s 600W CFM Series: Addressing Today’s Engineering Challenges

January 30, 2026

FORTEC United Kingdom is introducing the new CFM600S Series from Cincon, a 600W AC-DC power supply designed to directly address the key challenges faced by today’s design and system engineers: space constraints, thermal management, regulatory compliance and long-term reliability.

As power requirements increase and enclosures shrink, engineers are under growing pressure to deliver higher performance without compromising safety, efficiency or service life. The CFM600S responds with a compact 3” × 5” form factor, integrated PFC and a power density of up to 25.97 W/in³, enabling high-power designs without costly mechanical … Read More → "Cincon’s 600W CFM Series: Addressing Today’s Engineering Challenges"

Rohde & Schwarz at DesignCon 2026 to deliver the latest in T&M solutions and a chance to win an MXO 3 oscilloscope

January 30, 2026

Rohde & Schwarz will exhibit its latest advancements in test and measurement technology at DesignCon 2026, booth #949. Attendees can participate in a full-day technical workshop open to all DesignCon visitors, experience hands-on demonstrations of cutting-edge solutions, and enter a drawing to win the new MXO 3 oscilloscope.

Rohde & Schwarz has announced comprehensive plans for DesignCon 2026, the premier high-speed communications and system design conference and exposition, taking place February 24 to 26 in Santa Clara, California, in the heart of Silicon Valley. This year’s program for the conference reflects the commitment of Rohde & Schwarz to delivering technical expertise directly … Read More → "Rohde & Schwarz at DesignCon 2026 to deliver the latest in T&M solutions and a chance to win an MXO 3 oscilloscope"

EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI

Ultra-low-power Edge AI SoC enters fabrication, validating next-generation architecture
January 30, 2026

LOS ANGELES (Jan. 28, 2026) – EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC). The device has entered fabrication at TSMC, marking the transition of EMASS’s next-generation ultra-low-power edge AI architecture from final design into production silicon.

The 16nm ECS-DoT represents a process-node and architectural scaling of EMASS’s proven 22nm ECS-DoT platform, increasing compute density, memory bandwidth and system integration while preserving the ultra-low-power design principles that define the ECS-DoT family. The move to 16nm enables higher logic density … Read More → "EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI"

RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026

A system-level platform spanning humanoid robotic arms, integrated joint modules, global remote operations, and open-sourced real-world data.
January 29, 2026

Las Vegas, CES 2026 – RealMan Robotics, a system-level infrastructure platform company for the era of embodied intelligence, unveiled its latest advancements at CES 2026, showcasing a comprehensive technology stack spanning hardware, data, and remote operations. 

At the exhibition, RealMan presented three core innovations: 

A fully integrated joint module 

Ultra-lightweight humanoid robotic arms 

The Global Labor Network (GLN), powered by RealBOT wheel-foldable robots and the Humanoid Robot Data Training Center 

Read More → "RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026"

Synopsys and AMD Honored by World Economic Forum for Generative and Agentic AI Vision, Leadership, and Impact

January 29, 2026

WHAT’S NEW: Synopsys, in collaboration with AMD, has been selected for the World Economic Forum’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program. This recognition places both companies among a distinguished global group of pioneers advancing artificial intelligence solutions that are not only technically advanced but also deployed with measurable real-world impact.

The MINDS awards and program, part of the World Economic Forum’s AI Global Alliance initiative, identifies organizations that are leading the way in applying AI to complex, high-stakes challenges. Synopsys and AMD were specifically recognized for their work applying reinforcement learning, generative … Read More → "Synopsys and AMD Honored by World Economic Forum for Generative and Agentic AI Vision, Leadership, and Impact"

Keysight and Point2 Technology Collaborate to Advance Next-Generation AI Scale-Up Interconnects

Collaboration validates Point2 Technology’s innovative e-Tube™ multi-terabit interconnects using Keysight's high-speed digital test solutions, addressing critical power and bandwidth challenges in AI infrastructure
January 29, 2026

Keysight Technologies, Inc. (NYSE: KEYS) and Point2 Technology today announced a strategic collaboration to validate next-generation, multi-terabit interconnects designed to eliminate scale-up connectivity bottlenecks in artificial intelligence (AI) and machine learning (ML) data centers. Using Keysight’s high-speed digital test solutions, including theRead More → "Keysight and Point2 Technology Collaborate to Advance Next-Generation AI Scale-Up Interconnects"

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